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On the VG96 connector J9 are signals assigned to control the SoM and the interfaces of the SoM's Zynq chip device and of its on-module peripherals:
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JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JB3. With the TE0790 XMOD USB2.0 to JTAG adapter, the Zynq chip device on the mounted SoM can be programed via USB2.0 interface.
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The SD IO interface of the SoM's Zynq chip device (MIO-bank) is routed to the on-board MicroSD Card socket J1. By this interface, the Zynq chip device can be booted from an inserted MicroSD Card:
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| Note |
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Use Xilinx compatible TE0790 adapter board (designation TE-0790TE0790-xx with out 'L') to program the Zynq device. The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download. |
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| DIP-switches S2 | Signal Schematic Net Name | Function | Note |
|---|---|---|---|
| S2-1 | JTAGSEL | Select Zynq chip device or SC CPLD programming of mounted SoM: OFF: Zynq device in JTAG chain | Refer also to the TE0729 SC CPLD documentation for detailed information about JTAG update |
| S2-2 | BOOT_MODE1 | Select first bit of boot mode code | Refer to TE0729 TRM and SC CPLD documentation for detailed information about boot modes |
| S2-3 | BOOT_MODE2 | Select second bit boot mode code | |
| S2-4 | x | x | not used |
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Table 15: Boot Modes configuration via DIP-switch S2 with default TE0729 CPLD Firmware
VCCIO
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Selection Jumper
The Carrier Board VCCIO for the PL IO-banks of the mounted SoM are selectable by the jumpers J6 and J7.
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The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq chipdevice.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
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Order | REF Number | Samtec Number | Type | Mated Height | Data sheet | Comment |
|---|---|---|---|---|---|---|
| - | REF-189019-02 | BTE-060-01-L-D-A-K-TR | Module connector | 5 mm | http://suddendocs.samtec.com/catalog_english/bte.pdf | Standard connector used on module |
| 26663 | REF-189019-01 | BSE-060-01-L-D-A-TR | Baseboard connector | 5 mm | http://suddendocs.samtec.com/catalog_english/bse.pdf | Standard connector used on board |
Table 24: B2B Connectors.
| Connector Specifications | Value |
|---|---|
| Insulator material | Liquid crystal polymer |
| Stacking height | 5 mm |
| Contact material | Phosphor-bronze |
| Plating | Au or Sn over 50 μ" (1.27 μm) Ni |
| Current rating | 2 A per pin (1 pin powered per row) |
| Operating temperature range | -55 °C to +125 °C |
| Voltage rating | 225 VAC with 5 mm stack height |
| Max cycles | 100 |
| RoHS compliant | Yes |
Table 25: B2B Connector specifications.
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| Module Variant | Operating Temperature | USB Socket | Temperature Range |
|---|---|---|---|
| TEB0729-03-A | -40°C to +125°C | USB2.0 Type A socket fitted | Industrial |
| TEB0729-03-B | -40°C to +125°C | Micro USB2.0 B socket fitted | Industrial |
Table 26: Module Board variants.
Technical Specifications
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Overview
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