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Refer to https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/carrier_boards/TEBF0808/REV04 for downloadable version of this manual and additional technical documentation of the product. |
The Trenz Electronic TEBF0808 Carrier Board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0808 and TE0803, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ SoMs and for developing purposes.
List key features here, like FPGA type, amount and type of RAM, type of flash, etc.
Additional assembly options are available for cost or performance optimization upon request.
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PC Enclosure Rear Panel Accessible I/O
PC Front Panel I/O
The above I/O interfaces are accessible using standard PC front panel cables.
Additional assembly options are available for cost or performance optimization upon request.
Figure 1: TEBF0808-04 Block Diagram
Figure 2: TEBF0808-04 Carrier Board
Storage device name | Content | Notes |
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I/O signals connected to the SoCs I/O bank and B2B connector:
Bank | Type | B2B Connector | I/O Signal Count | LVDS Pairs Count | Bank Voltage | Notes |
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All MIO banks are powered from on-module DC-DC power rail. All PL I/O Banks have separate VCCO pins in the B2B connectors, valid VCCO should be supplied from the baseboard.
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<!-- MGT Lanes should be separately listed, as those are more specifically not just I/O's. --> |
Bank | Type | Lane Count | B2B Connector | Schematic Names / Connector Pins | FPGA Pin Name | MGT Bank's Reference Clock Inputs |
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111 | GTX | 4 | J1 | MGT_RX4_P, MGT_RX4_N, pins J1-23, J1-21 MGT_RX5_P, MGT_RX5_N, pins J1-17, J1-15 MGT_RX6_P, MGT_RX6_N, pins J1-11, J1-9 MGT_RX7_P, MGT_RX7_N, pins J1-3, J1-5 | 1 Reference clock MGT_CLK3 from programmable 1 Reference clock MGT_CLK2 from B2B connector J3 |
JTAG access to the ... is provided through B2B connector ....
JTAG Signal | B2B Connector Pin |
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TCK | |
TDI | |
TDO | |
TMS |
Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:
Pin Name | Mode | Function | B2B Connector Pin | Default Configuration |
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PGOOD | Output | Power Good | J1-148 | Active high when all on-module power supplies are working properly. |
JTAGEN | Input | JTAG Select | J2-131 | Low for normal operation. |
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<!-- For the detailed function of the pins and signals, the internal signal assignment and implemented logic, look to the Wiki reference page SC CPLD of this module or into the bitfile of the SC CPLD. Put in link to the Wiki reference page of the SC CPLD, if available. --> |
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Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.
MIO | Signal Name | U14 Pin |
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1 | SPI-CS | C2 |
2 | SPI-DQ0/M0 | D3 |
3 | SPI-DQ1/M1 | D2 |
4 | SPI-DQ2/M2 | C4 |
5 | SPI-DQ3/M3 | D4 |
6 | SPI-SCK/M4 | B2 |
On board Gigabit Ethernet PHY is provided with ...
Ethernet PHY connection
PHY Pin | PS | PL | B2B | Notes |
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USB PHY is provided with ...
PHY Pin | Pin | B2B Name | Notes |
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The schematics for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.
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On-board I2C devices are connected to MIO.. and MIO.. which are configured as I2C... by default. I2C addresses for on-board devices are listed in the table below:
I2C Device | I2C Address | Notes |
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By default the ... supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector.
MODE Signal State | Boot Mode |
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high or open | SD Card |
low or ground | QSPI |
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<!-- Components on the Module, like Flash, PLL, PHY... --> |
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There is a Silicon Labs I2C programmable quad PLL clock generator Si5338A (U..) ..
Si5338A (U13) Input | Signal Schematic Name | Note |
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IN1/IN2 | CLKIN_P, CLKIN_N | Reference clock signal from B2B connector J3, pins J3-74, J3-76 |
IN3 | reference clock signal from oscillator SiTime SiT8008BI (U21) | 25.000000 MHz fixed frequency. |
IN4/IN6 | pins put to GND | LSB (pin 'IN4') of the default I²C-adress 0x70 not activated. |
IN5 | not connected | - |
Si5338A (U13) Output | Signal Schematic Name | Note |
CLK0 A/B | MGTCLK1_P, MGTCLK1_N | Reference clock signal to MGT bank 112, pins U6/U5 |
CLK3 A/B | MGTCLK3_P, MGTCLK3_N | Reference clock signal to MGT bank 111, pins AA6/AA5 |
The SoC module has following reference clocking signals provided by external baseboard sources and on-board oscillators:
Clock Source | Schematic Name | Frequency | Clock Input Destination |
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SiTime SiT8008BI oscillator, U21 | - | 25.000000 MHz | Quad PLL clock generator U16, pin 3 |
LED | Color | Connected to | Description and Notes |
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Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
Power Input Pin | Typical Current |
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VIN | TBD* |
3.3VIN | TBD* |
* TBD - To Be Determined soon with reference design setup.
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if this circuit is fitted on module, describe it here...
Voltages on B2B-Connectors | B2B | B2B | B2B | Input / Output | Note |
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Bank | Schematic Name | Voltage | Voltage Range |
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500 (MIO0) | PS_1.8V | 1.8V | - |
501 (MIO1) | PS_1.8V | 1.8V | - |
502 (DDR3) | 1.35V | 1.35V | - |
12 HR | VCCIO_12 | User | HR: 1.2V to 3.3V |
13 HR | VCCIO_13 | User | HR: 1.2V to 3.3V |
33 HP | VCCIO_33 | User | HP: 1.2V to 1.8V |
34 HP | VCCIO_34 | User | HP: 1.2V to 1.8V |
35 HP | VCCIO_35 | User | HP: 1.2V to 1.8V |
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Module Variant | Zynq SoC | SoC Junction Temperature | Operating Temperature Range |
---|---|---|---|
TE0745-02-30-1I | XC7Z030-1FBG676I | –40°C to +100°C | Industrial |
TE0745-02-35-1C | XC7Z035-1FBG676C | 0°C to +85°C | Commercial |
TE0745-02-45-1C | XC7Z045-1FBG676C | 0°C to +85°C | Commercial |
TE0745-02-45-2I | XC7Z045-2FBG676I | –40°C to +100°C | Industrial |
Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | V | - | ||
Storage temperature |
| °C | - |
Note |
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Assembly variants for higher storage temperature range are available on request. |
Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | ||||
Operating temperature |
Note |
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Please check Xilinx datasheet ... for complete list of absolute maximum and recommended operating ratings. |
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Date | Revision | Notes | PCN | Documentation Link |
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- | 01 | Prototypes |
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
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Date | Revision | Contributors | Description | ||||||||
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| John Hartfiel | -removed weight section update template version | |||||||||
2017-06-08 | v.20 | John Hartfiel | add revision number and update document change history | ||||||||
2017-05-30 | v.1 | Jan Kumann | Initial document. | ||||||||
all | Jan Kumann, John Hartfiel |
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