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Note for Download Link of the Scroll ignore macro:
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The Trenz Electronic TE0818 is an industrial grade MPSoC SOM integrating a Xilinx Zynq UltraScale+ MPSoC, DDR4 SDRAM with 64-Bit width data bus connection, SPI Boot Flash memory for configuration and operation, transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking connections in a compact 5.2 cm x 7.6 cm form factor.
Refer to http://trenz.org/te0818-info for the current online version of this manual and other available documentation.
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Note: → See examples fro different types <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-KeyFeatures |
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add drawIO object in Scroll Ignore section and add reference image in Scroll Only.
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For subsection examples see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-Signals,InterfacesandPins
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1) IO CNT depends on assembly variant. E.g. the MGTs are not available for all FPGAs |
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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section. Example:
1) Direction:
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1) Direction:
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection Example:
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For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals |
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1) Direction:
2) See UG1085 for additional information. 3) See Recommended Operating Conditions. |
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Enter the default value for power supply and startup of the module here.
Link to Schematics, for power images or more details |
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List of all Powerrails which are accessible by the customer
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1) Direction:
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List baseboard design hints for final baseboard development. |
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Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
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0 | - | - | - | Configuration signal setup. | See Configuration and System Control Signals. |
1 1) | PSBATT | 1.2 V ... 1.5 V | - | Battery connection. | Battery Power Domain usage. When not used, tie to GND. |
1 | 3.3VIN | 3.3 V (± 5 %) | - | Management power supply. | Management module power supply. 0.5 A recommended. |
GTH / GTR Transceiver clocking (Only necessary in cases where the PLL clock is used for GTH / GTH.): | |||||
1 1) | GT_DCDC | 3.3 V (± 5 %) 2) | GTH transceiver power supply. | Main module power supply for GTH / GTY transceiver. 5 A recommended. Power consumption depends mainly on design and cooling solution. | |
1 1) | EN_PLL_PWR | - | PD 3), GND | PLL power enable. | |
1 1) | PG_PLL_1V8 | - | PU 3), 3.3 V | PLL power good status. | |
2 | Processing System (PS): | Procedure for PS starting. | |||
2.1 | Low-power domain: | Bring-up for low-power domain PS. | |||
2.1.1 | LP_DCDC | 3.3 V (± 5 %) 2) | - | Low-power domain power supply. | Main module power supply for low-power domain. 5.5 A recommended. Power consumption depends mainly on design and cooling solution. |
2.1.2 | EN_LPD | - | PU 3), 3.3 V | Low-power domain power enable. | |
2.1.3 | LP_GOOD | - | PU 3), 3.3 V | Low-power domain power good status. | Module power-on sequencing for low-power domain finished. |
2.2 | Full-power domain: | Bring-up for full-power domain PS. | Full-power PS domain needs powered low-power PS domain. | ||
2.2.1 | DCDCIN | 3.3 V (± 5 %) 2) | Full-power domainand GTR transceiver power supply. | Main module power supply for full-power domain. 7 A recommended. Power consumption depends mainly on design and cooling solution. | |
2.2.2 | EN_FPD | 3.3 V | - | Full-power domain power enable. | |
2.2.3 | PG_FPD | - | PU 3), 3.3 V | Full-power domain power good status. | Module power-on sequencing for full-power domain finished. |
2.2.4 | EN_DDR | 3.3 V | - | DDR memory power enable. | |
2.2.5 | PG_DDR | PU 3), 3.3 V | DDR memory power good status. | Module power-on sequencing for DDR memory finished. | |
2.3 | GTR Transceiver | Procedure for GTR transceiver starting. | PS transceiver usage needs powered PS (low- and full-power domain). | ||
2.3.1 | EN_PSGT | 3.3 V | - | GTR transceiver power enable. | |
2.3.2 | PG_PSGT | - | PU 3), 3.3 V | GTR transceiver power good status. | Module power-on sequencing for GTR transceiver finished. |
2 | Programmable Logic (PL) | Procedure for PL starting. | PS and PL can be started independently. | ||
2.1 | PL_DCIN | 3.3 V (± 5 %) 2) 4) | - | Programmable logic power supply. | Main module power supply for programmable logic. 12 A recommended. Power consumption depends mainly on design and cooling solution. |
2.2 | EN_PL | - | PU 3), 3.3 V | Programmable logic power enable. | |
2.3 | PG_PL | - | PU 3), 3.3 V | Programmable logic power good status. | Module power-on sequencing for programmable logic finished. Periphery and variable bank voltages can be enabled on carrier. |
2.4 | VCCO_47 / VCCO_48 / VCCO_64 / VCCO_65 / VCCO_66 | 5) | - | Module bank voltages. | Enable bank voltages after PG_PL deassertion. |
2.5 | PG_VCU | - | PU 3), 3.3 V | VCU power good status. | |
3 | GTH / GTY Transceiver | Procedure for GTH / GTY transceiver starting. | PL transceiver usage needs powered PL and low-power PS domain. | ||
3.1 | GT_DCDC | 3.3 V (± 5 %) 2) | - | GTH transceiver power supply. | Main module power supply for GTH transceiver. 5 A recommended. Power consumption depends mainly on design and cooling solution. |
3.2 | EN_GT_R | 3.3 V | - | GTH / GTY transceiver power enable. | |
3.3 | PG_GT_R | - | PU 3), 3.3 V | GTH / GTY transceiver power good status. |
1) (optional)
2) Dependent on the assembly option a higher input voltage may be possible.
3) (on module)
4) This value depends highly on DCDC U4. Higher values may be possible with different DCDCs. For more information consult schematic and according datasheets.
5) See DS925 for additional information.
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*) Stresses beyond those listed under TE0818 TRM (more or less equal to TE0808 but other connectors) may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under TE0818 TRM (more or less equal to TE0808 but other connectors). Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
This TRM is generic for all variants. Temperature range can be differ depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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Module size: ?? mm × ?? mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.
PCB thickness: ?? mm.
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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
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Set correct link to the shop page overview table of the product on English and German. Example for TE0706: ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706 DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706 |
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Set correct links to download Carrier, e.g. TE0706 REV02: TE0706-02 -> https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents Note:
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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