Page History
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- Xilinx Zynq UltraScale+ ZU3EG MPSoC, U1
- 4A power system on a chip (PowerSoC) DC-DC converter, U5
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.9V), U9
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U13
3A PFET load switch with configurable slew rate, fast transient isolation and hysteresis control, Q1
- Ultralow supply-current voltage monitor with optional watchdog, U19
- Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
- Low power programmable oscillator @ 12.000000 MHz, U11
- Miniature traceability S/N pad for low-cost, unique product identification
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (2.5V), U4
- 4 Gbit (256 x 16) DDR4 SDRAM, U3
- 4 Gbit (256 x 16) DDR4 SDRAM, U2
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.2V), U15
- 1.8V, 256 Mbit multiple I/O serial flash memory, U17
- 1.8V, 256 Mbit multiple I/O serial flash memory, U7
- Low power programmable oscillator @ 33.333333 MHz, U32
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.85V), U12
- 350 mA, ultra-low VIN, RF low-dropout linear regulator with bias pin, U23
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U20
- B2B connector Samtec Razor Beam™ LSHM-150, JM2
- 2A peak sink / source DDR termination regulator with VTTREF buffered reference for DDR2, DDR3, DDR3L, and DDR4, U16
- Low power programmable oscillator @ 52.000000 MHz, U14
- Highly integrated full featured hi-speed USB 2.0 ULPI transceiver, U18
- B2B connector Samtec Razor Beam™ LSHM-130, JM3
- I2C programmable, any frequency , any output quad clock generator, U10
- B2B connector Samtec Razor Beam™ LSHM-150, JM1
- Lattice Semiconductor MachXO2 System Controller CPLD, U21
- 4 GByte eMMC memory, U6
Key features
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- Xilinx Zynq UltraScale+ MPSoC 784 pin package (ZU3EG, option ZU5EV)
- Memory:
- 32-Bit DDR4 - 4 GByte max
- SPI Boot Flash dual parallel - 512 MByte max
- 4 GByte eMMC (up to 64 GByte)
- B2B connectors:
Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips- 14 x MIO, 132 I/O's x HP (3 banks)
- Serial transceiver: 4 x serial PS GTR 4transceivers
- GT Reference clock input
- PLL for GT Clocks clocks (optional external reference)
- 1 GBit Gbit Ethernet PHY
- USB 2.0 OTG PHY
- Real Time Clock
- Size: 40 x 50 mm
- All power supplies on board.
Initial delivery state
Signals Interfaces and Pins
Board to Board (B2B) I/Os
I/O signals connected to the MPSoC's I/O bank and B2B connector:
Bank | Type | B2B Connector | I/O Signal Count | Voltage | Notes |
---|---|---|---|---|---|
64 | HP | JM2 | 48 | User | Max voltage 1.8V. |
64 | HP | JM2 | 2 | User | Max voltage 1.8V. |
65 | HP | JM2 | 18 | User | Max voltage 1.8V. |
65 | HP | JM3 | 12 | User | Max voltage 1.8V. |
66 | HP | JM1 | 48 | User | Max voltage 1.8V. |
501 | MIO | JM1 | 6 | 1.8V | - |
505 | GTR | JM3 | 4 lanes | N/A | - |
505 | GTR CLK | JM3 | 2 differential inputs | N/A | - |
For detailed information about the pin out, please refer to the Pin-out Table.
JTAG Interface
System Controller I/O Pins
On-board LEDs
Default MIO Mapping
Gigabit Ethernet
USB Interface
I2C Interface
Boot Modes
On-board Peripherals
Processing System (PS) Peripherals
Clocking
Power and Power-on sequence
Power Supply
Power-on sequence
Power Rails
Bank Voltages
Board to Board Connectors
Technical Specifications
Absolute Maximum Ratings
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Physical Dimensions
Module size: 40 50 mm × 30 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm
PCB thickness: 1.6 mm
Highest part on PCB: approximately 2. 5 mm. Please download the step model for exact numbers.
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