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There is no device with JTAG port on the baseboard. JTAG access to the module is provided through B2B connector J1. This is routed to the carriers USB to JTAG/UART bridge.

JTAG Signal

B2B Connector Pin

TCKJ1-147
TDIJ1-151
TDOJ1-145
TMSJ1-149

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LED ColorSignalDescription and Notes
D1greenVINpower indicator
D2-D7redULED1..6User LED
D8greenMIO9

MIO user LED

J3BgreenPHY_LED0Ethernet status
J3CyellowPHY_LED1Ethernet status

Table 10: On-board LEDs.


On-board Push Buttons

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Table 11: On-board Push Buttons.

Power and Power-On Sequence

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If power sequencing and distribution is not so much, you can join both sub sections together
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Power Consumption

The maximum power consumption depends on the attached module the design running on the module and additional peripherals.

Xilinx provide a power estimator excel sheets to calculate power consumption for FPGAs. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

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Table 12: Typical power consumption.

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

Warning
To avoid any damage to the base board and attached module, check for stabilized voltages should be carried out (i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.

Power Distribution Dependencies

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anchorPD_TEB0724
titleFigure 3: Module power distribution diagram.

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User should also check related module documentation and Xilinx data sheet, respectively.

Power-On Sequence

The power-on sequence is solely controlled by the attached module.  Optional sequenzing signals for integration of additional hardware are PWR_GPIO2 and PWR_GPIO4. If the attached module uses the adjustable bank power VCCIO_35, this has to be powered up after the modules SOCs powerrails are up and before any other signal is applied to the bank IOs.

The 1.8V and 3.3V power rails are used for the SD Card level shifter U13. The Datasheet claims to first power up 1.8V and then 3.3V.

Power Rails

Input

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Power Rail Name

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B2B J1 Pins

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Direction on B2B

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1.8V

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VLDO1

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VBAT

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Table 12 : Board power rails.

Different modules (not just 4 x 5 cm ones) have different type of connectors with different specifications. Following note is for Samtec Razor Beam™ LSHM connectors only, but we should consider adding such note into included file in Board to Board Connectors section instead of here.

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Pin Header

Pin Header J6

J6-2

 PINSignalB2BDescription and Notes
J6-1ONKEYJ1-148Power Button, pulled up, on push de-asserted
J6-2RESETREQJ1-150User LED pulled up, on push de-asserted
J6-2S2J1-124PL user button, pulled up, on push de-asserted
S4J1-126PL user button, pulled up, on push de-asserted
S5MIO51J1-42

PS MIO user button, pulled up, on push de-asserted

For voltage selection VCCIO_35 of Bank 35 other than 3.3V the header J19 can optionaly assambled. Therefore 0 Ohm resistor  R45 has to be removed!




Optional fitted headers J7, J8 and J9 are to provide full access to the Pins at the B2B, especially for testing and extension purposes. 



Power and Power-On Sequence

HTML
<!--
If power sequencing and distribution is not so much, you can join both sub sections together
  -->

Power Consumption

The maximum power consumption depends on the attached module the design running on the module and additional peripherals.

Xilinx provide a power estimator excel sheets to calculate power consumption for FPGAs. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current
VINTBD*

Table 12: Typical power consumption.


 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

Warning
To avoid any damage to the base board and attached module, check for stabilized voltages should be carried out (i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.

Power Distribution Dependencies

Scroll Title
anchorPD_TEB0724
titleFigure 3: Module power distribution diagram.

draw.io Diagram
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User should also check related module documentation and Xilinx data sheet, respectively.

Power-On Sequence

The power-on sequence is solely controlled by the attached module.  Optional sequenzing signals for integration of additional hardware are PWR_GPIO2 and PWR_GPIO4. If the attached module uses the adjustable bank power VCCIO_35, this has to be powered up after the modules SOCs powerrails are up and before any other signal is applied to the bank IOs.

The 1.8V and 3.3V power rails are used for the SD Card level shifter U13. The Datasheet states to first power up 1.8V and then 3.3V.

Power Rails

Power Rail Name

B2B J1 Pins

Direction on B2B

Notes
VIN154, 156, 158, 160OutputExternal main supply voltage.
3.3V43, 74Input

1.8V

63Input
VCCIO_3554Output

VLDO1

83Input
VLDO294InputUsed to enable UART level shifter. Therefore fix at 1.8V.
VLDO3453Input

VBAT

152Input/OutputReserved for PMIC backup battery and charger.

Table 12 : Board power rails.

Board to Board Connectors

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The TEB0724 base board has two a 160-pin double-row REF-189019192552-02 connectors 01 connector on the bottom top side.

Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
-REF-192552-01SS5-80-3.50-L-D-K-TRBaseboard connector4 mmhttp://suddendocs.samtec.com/catalog_english/ss5.pdfStandard connector
used on board
27220REF-192552-02ST5-80-1.50-L-D-P-TRModule connector4 mmhttp://suddendocs.samtec.com/catalog_english/st5.pdfStandard connector
used on module

Table 15: Connectors for module and baseboardbase board.


Variants Currently In Production

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