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Table of Contents

Overview

The Trenz Electronic TEB0724-02 is a developement carrier board for the TE0724 and compatible modules. It facilitates easy access to all on the module available features. 

Refer to http://trenz.org/teb0724-info for the current online version of this manual and other available documentation.

Key Features

  • Samtec 160 pin board to board connector for 4,0 cm x 6,0 cm module
  • 10x 2x6 Pin Pmods, (8 usable as dual Pmods, 1x single Pmod, 1x I2C compatible Pmod)
  • MicroUSB to JTAG/UART bridge
  • CAN screw terminal
  • RJ45 Gigabit Ethernet MagJack connector
  • 6x LED, 2x Push Buttons on FPGA
  • 1 LED and 1 Push Button on PS
  • Power and Reset Push Buttons
  • On-board Power Protection Circuit and Power on LED

Block Diagram


TEB0724 block diagram


Main Components

TEB0724 main components


  1. Module connector for 4,0x6.0 cm module
  2. Pmods usabel as dual Pmods, J10, J11, J12, J13, J14, J15, J16, J17  
  3. Pmod (single), J20  
  4. I2C Pmod, J21
  5. CAN screw terminal, J2
  6. 5V 2.1mm input jack, J18
  7. microUSB J4
  8. USB to JTAG/UART bridge FT2232H, U1
  9. Configuration EEPROM U3
  10. RJ45 Gigabit Ehternet Jack, J3
  11. Power Button, S1
  12. Reset Button, S3
  13. User Button PS, S5
  14. User LED (green) PS, D8 
  15. 2x User Button PL, S2, S4
  16. 6x User LEDs (red) PL, D2-D7 
  17. Power LED (green), D36
  18. 2x10 Pin header for Boot and Programming options, J6
  19. 2x6 Pin header for jumper setting of CAN bus termination resistors, J22
  20. microSD Card Slot, J5
  21. Dip switches for selecting B_VCCIO_35, S6
  22. DCDC (B_VCCIO_35), U8
  23. DCDC (B_3.3V), U7

Initial Delivery State

Storage device name

Content

Notes

FTDI Configuration EEPROM U3Xilinx LicenseDo not overwrite, see warning in related section
Initial delivery state of programmable devices on the module.


Configuration Signals

The boot device is selected by the mode jumpers on pin header J6. Placing a jumper at pin 13-14 sets Mode0 to low level. Mode1 is set to low level by jumper on pin 15-16. Boot modes are further described at the corresponding section of the modules, e.g. Table 2, Boot mode selection of TE0724 TRM. Default with no jumpers is boot from SD-Card.

SignalFunctionRouted toB2B Connector PinNote
Mode0bootdevice selectionjumper pins J6-13 J6-14J1-4TE0724: pulled up at module
Mode1bootdevice selectionjumper pins J6-15 J6-16J1-2TE0724: pulled up at module
ONKEYmodule power signalpush button S1 and pin J6-9J1-148TE0724: pulled up at module
RESETREQmodule resetpush button S3 and pin J6-12J1-150TE0724: pulled up at module
PWR_GPIO2-J6-8J1-143User power sequenzing IO
PWR_GPIO4-J6-10J1-141User power sequenzing IO
Boot process.


Signals, Interfaces and Pins


Board to Board (B2B) I/Os

I/O signals connected to the B2B connector: 

B2B ConnectorInterfacesI/O Signal CountNotes
J1User IO72 single ended or 36 differential9x Pmod
6 LEDred
2 Push Button-
7 MIOJ7 (not assembled), TE0724: 3.3V
2 MIOJ9 (not assembled), TE0724: 1.8V
1 MIO LEDgreen
1 MIO Push Button-
I²C21x Pmod
SD IO7-
UART2-
CAN2-
GbE PHY_MDIO + PHY_LEDs10-
JTAG4-
Power GPIO2-
Power/Reset/Fuse programming3-
Bootmode2-
General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors


microUSB JTAG/UART Interface

The microUSB connector provides JTAG access to the module through the carriers USB to JTAG/UART bridge, routed to B2B connector J1. The UART is routed via a levelshifter. There is no device with JTAG port on the baseboard.

Signal

B2B Connector Pin

TCKJ1-147
TDIJ1-151
TDOJ1-145
TMSJ1-149
UART RXJ1-36
UART TXJ1-38
JTAG pins connection

SD Card Interface

Connected ToSignal NameNotes
J1-34SD-CDCard detect switch, pulled up, low if card inserted.
J1-24SD-D0
J1-22SD-CMD
J1-20SD-CCLK
J1-26SD-D1
J1-28SD-D2
J1-30SD-D3
SD Card interface signals and connections


Ethernet Interface

The TEB0724 Carrier Board has a RJ45 Gigabit Ethernet MagJack (J3) with two LEDs. On-board Ethernet MagJack pins are routed to B2B connector J1 via MDI. LEDs are also routed to the B2B connector.

Ethernet PHY connection

MagJackSignalB2B
J3-2PHY_MDI0_PJ1-7
J3-3PHY_MDI0_NJ1-9
J3-4PHY_MDI1_PJ1-13
J3-5PHY_MDI1_NJ1-15
J3-6PHY_MDI2_PJ1-19
J3-7PHY_MDI2_NJ1-21
J3-8PHY_MDI3_P

J1-25

J3-9PHY_MDI3_NJ1-27
J3BPHY_LED0J1-10
J3CPHY_LED1J1-12
Ethernet Signals


I2C Interface

On-board I2C bus is accaessable with the following pins:

SDASCLNotes
J1-144J1-142B2B
J6-7J6-5In-Circuit Programming
J21-10, J21-4J21-9, J21-3Pmod
I2C pins


There are no I2C devices on the base board. Pullup resistors have to be provided by the module.

Pmods

The GPIOs of the 10 Pmods (J10 to J17, J20, J21) are connected with 100 Ohm differential routing to the B2B connector. J21 is a pure I2C compatible Pmod, without additional signals. The other 9 are GPIO Pmods where despite J20 all others can be used as dual Pmods.

Via dip switches S6-1 to S6-3 the variable bank power B_VCCIO_35 for the Pmods J10, J11, J12, J13, J14, J16 can be selected. Respect power regulator limits!


J10J11J12J13J14
PINSignalB2BSignalB2BSignalB2BSignalB2BSignalB2B
1PA0_PJ1-56PB2_NJ1-70PC2_PJ1-57PD2_PJ1-77PE2_NJ1-90
2PA0_NJ1-58PB2_PJ1-72PC2_NJ1-55PD2_NJ1-75PE2_PJ1-92
3PA3_P

J1-46

PB0_NJ1-76PC0_PJ1-51PD0_PJ1-71PE0_NJ1-96
4PA3_NJ1-48PB0_PJ1-78PC0_NJ1-49PD0_NJ1-69PE0_PJ1-98
5GND-GND-GND-GND-GND-
6VCCIO_35J1-54VCCIO_35J1-54VCCIO_35J1-54VCCIO_35J1-54VCCIO_35J1-54
7PA1_NJ1-62PB3_PJ1-68PC3_NJ1-59PD3_NJ1-79PE3_PJ1-88
8PA1_PJ1-60PB3_NJ1-66PC3_PJ1-61PD3_PJ1-81PE3_NJ1-86
9PA2_NJ1-52PB1_PJ1-82PC1_NJ1-45PD1_NJ1-65PE1_PJ1-102
10PA2_PJ1-50PB1_NJ1-80PC1_PJ1-47PD1_PJ1-67PE1_NJ1-100
11GND-GND-GND-GND-GND-
12B_VCCIO_35J1-54B_VCCIO_35J1-54B_VCCIO_35J1-54B_VCCIO_35J1-54B_VCCIO_35J1-54

J15J16J17J20J21
PINSignalB2BSignalB2BSignalB2BSignalB2BSignalB2B
1PG2_NJ1-110PF2_PJ1-97PH2_PJ1-115PI2_PJ1-133NC-
2PG2_PJ1-112PF2_NJ1-95PH2_NJ1-113PI2_NJ1-131NC-
3PG0_PJ1-114PF0_PJ1-91PH0_PJ1-111PI0_PJ1-129I2C_SCLJ1-142
4PG0_NJ1-116PF0_NJ1-89PH0_NJ1-109PI0_NJ1-127I2C_SDAJ1-144
5GND-GND-GND-GND-GND-
63.3VJ1-74, J1- 43VCCIO_35J1-543.3VJ1-74, J1- 433.3VJ1-74, J1- 433.3VJ1-74, J1- 43
7PG3_PJ1-108PF3_NJ1-99PH3_NJ1-117PI3_NJ1-135NC-
8PG3_NJ1-106PF3_PJ1-101PH3_PJ1-119PI3_PJ1-137NC-
9PG1_NJ1-120PF1_NJ1-85PH1_NJ1-105PI1_NJ1-123I2C_SCLJ1-142
10PG1_PJ1-121PF1_PJ1-87PH1_PJ1-107PI1_PJ1-125I2C_SDAJ1-144
11GND-GND-GND-GND-GND-
123.3VJ1-74, J1- 43B_VCCIO_35J1-543.3VJ1-74, J1- 433.3VJ1-74, J1- 433.3VJ1-74, J1- 43
Pmod connections.

CAN Screw Terminal

The CAN bus is routed to screw terminal J2.

 PINSignalB2B
J2-1CAN0_NJ1-1
J2-2GND
J2-3CAN0_PJ1-3
CAN bus connection

Jumpers on J22-1 to J22-3 and J22-2 to J22-4 connect proper split termination resistors to the CAN bus.

Pin Header

Pin Header J6 provides access to power functions, bootmode selection and PMIC In-Circuit Programming (For initial PMIC In-Circuit Programming of the module, Diode D28 has to be removed).

 PINSignalB2B
J6-1VINJ1-154, J1-156, J1-158, J1-160
J6-2VINJ1-154, J1-156, J1-158, J1-160
J6-3GND
J6-4GND
J6-5I2C_SCLJ1-142
J6-6VBATJ1-152
J6-7I2C_SDAJ1-144
J6-8PWR_GPIO2J1-143
J6-9ONKEYJ1-148
J6-10PWR_GPIO4J1-141
J6-11PWR_TPJ1-146
J6-12RESETREQJ1-150
J6-13MODE0J1-2
J6-14GND
J6-15MODE1J1-4
J6-16GND
Pin Header J6


Alternatively to selecting B_VCCIO_35 by using S6 dip switches, VCCIO_35 ( e.g. SoM TE0724, Bank 35) can be selected by removing R45 and adding a jumper on optional J19. In table 18 valid jumper positions are given. Voltages and maximum current ratings could be found in the corresponding TRM of the attached module, (e.g. TE0724 TRM#PowerRails ).

 PINSignalB2B
J19-1VLDO1J1-83
J19-2GND
J19-3VCCIO_35J1-54
J19-4VLDO2J1-94

J19-5

VLDO34J1-53
J19-6GND
Optional Pin Header J19



Jumper positionSignale.g. TE0724



J19  1-3



VLDO1



3.3V



J19  4-3



VLDO2



1,8V



J19  5-3



VLDO34



2,5V

J19 Jumper settings for VCCIO_35 voltage selection


Respect VLDO current limitations!

Optional fitted headers J7, J8 and J9 are to provide full access to the Pins at the B2B connector, especially for testing and extension purposes.  Description follows below.

PL Button and LED IOs are additionally routed to optionally assembled pin header J8.

 PINSignalB2B
J8-13.3VJ1-43, J1-74
J8-2GND
J8-3S4J1-126
J8-4S2J1-124
J8-5ULED5J1-130
J8-6ULED6J1-128
J8-7ULED3J1-134
J8-8ULED4J1-132
J8-9ULED1J1-138
J8-10ULED2J1-136
Optional Pin Header J8


Optional pin header J7 gives access to otherwise not used PS MIO IOs at a 3.3V bank.

 PINSignalB2B
J7-13.3V43, 74
J7-2GND
J7-3GND
J7-4MIO8J1-14
J7-5MIO10J1-31
J7-6MIO11J1-33
J7-7MIO12J1-35
J7-8MIO13J1-37
J7-9MIO14J1-39
J7-10MIO15J1-41
Optional Pin Header J7


Optional pin header J9 gives access to otherwise not used PS MIO IOs at a 1.8V bank.

 PINSignalB2B
J9-11.8VJ1-63
J9-2GND
J9-3GND
J9-4MIO_46J1-32
J9-5MIO_50J1-40
J9-6MIO_PB

J1-42

Optional Pin Header J9.

On-board Peripherals

USB to JTAG/UART bridge

The TEB0724 carrier board has on-board microUSB 2.0 (J4) high-speed to UART/FIFO IC FT2232H (U1) from FTDI. Channel A can be used as JTAG Interface (MPSSE) to program on module JTAG devices. Channel B can be used as UART Interface routed via a level shifter to the 1.8V section of the B2B connector, usually connected to the PS of the SoM. There is also a 256-byte serial EEPROM connected to the FT2232H chip pre-programmed with license code to support Xilinx programming tools.

Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.

Oscillators

The module has the following reference clock signals provided by on-board oscillators:

Clock SourceSchematic NameFrequencyClock Destination
SiTime SiT8008AI oscillator, U4OSCI12.000000 MHz U1, pin 3.
Reference clock signals

On-board LEDs

LED ColorSignalDescription and Notes
D1greenVINpower indicator
D2-D7redULED1..6User LED
D8greenMIO9

MIO user LED

J3BgreenPHY_LED0Ethernet status
J3CyellowPHY_LED1Ethernet status
On-board LEDs

On-board Push Buttons

ButtonSignalB2BDescription and Notes
S1ONKEYJ1-148Power Button, pulled up, on push de-asserted
S3RESETREQJ1-150User LED pulled up, on push de-asserted

S2

S2J1-124PL user button, pulled up, on push de-asserted
S4S4J1-126PL user button, pulled up, on push de-asserted
S5MIO51J1-42

PS MIO user button, pulled up, on push de-asserted

On-board Push Button

Dip-Switches

Dip-switch S6-1..3 are used to select the adjustable board power. Tabel 14 shows the signals, table 15 how to adjust the switches for corresponding B_VCCIO_35 Voltages.

SwitchSignal
S6-1VADJ_VS0
S6-2VADJ_VS1

S6-3

VADJ_VS2
S6-4NC
Dip-Switches


B_VCCIO_35S6-1S6-2S6-3
3.3VONONON
2.5VOFFONON

1.8V

ONOFFON
1.5VOFFOFFON
1.25VONONOFF
1.2VOFFONOFF
Select B_VCCIO_35 via Dip-Switches.

Power and Power-On Sequence

Power Consumption

Power supply with minimum current capability of 3A for system startup is recommended.

The maximum power consumption depends on the attached module the design running on the module and additional peripherals.

Xilinx provide a power estimator excel sheets to calculate power consumption for FPGAs. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current
VIN340 mA
Power Consumption
To avoid any damage to the base board and attached module, check for stabilized voltages should be carried out (i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.

Power Distribution Dependencies

Power Distribution

User should also check related module documentation and Xilinx data sheet, respectively.

Power-On Sequence

The power-on sequence is solely controlled by the attached module. The baseboard DCDC regulators U7 and U8 are enabled by the 3.3V rail of the module. Optional sequenzing signals for integration of additional hardware are PWR_GPIO2 and PWR_GPIO4.

If the attached module uses an external bank power VCCIO_35, this has to be powered up after the modules SOCs powerrails are up and before any other signal is applied to the bank IOs. The 1.8V and 3.3V power rails are used for the SD Card level shifter U13. The datasheet states to first power up 1.8V and then 3.3V, this has to be taken into account when reconfiguring the power circuit of the attached SoM.

Power-Off is in reverse order. VCCIO_35 has to be disabled before the SoCs core voltages are turned off.

Power Rails

Some of the power rails are sourced by the attached module, see coresponding TRMs of this for further information (e.g. TE0724 TRM#PowerRails).

Power Rail Name

B2B J1 Pins

Direction on B2B

Notes
VIN154, 156, 158, 160OutputExternal main supply voltage (5V).
B_3.3V--Onboard DCDC.
B_VCCIO_35--Onboard adjustable DCDC.
3.3V43, 74Input

1.8V

63Input
VCCIO_3554OutputConnected via 0Ohm R45 to B_VCCIO_35 or source selectable by J19 (R45 removed).

VLDO1

83Input(TE0724: 3.3V)
VLDO294InputUsed to enable UART level shifter. Therefore fix at 1.8V.
VLDO3453Input(TE0724: 2.5V)

VBAT

152Input/OutputReserved for PMIC backup battery and charger.
Board power rails.

Board to Board Connectors

The module has a 160-pin double-row REF-192552-02 connector on the bottom side. The counterpart REF-192552-01 is placed on the base board.

Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
27220REF-192552-02ST5-80-1.50-L-D-P-TRModule connector5 mmhttp://suddendocs.samtec.com/catalog_english/st5.pdfStandard connector
used on module
27219REF-192552-01SS5-80-3.50-L-D-K-TRBaseboard connector5 mmhttp://suddendocs.samtec.com/catalog_english/ss5.pdfStandard connector
used on board
Connectors.

 With different connectors from the used series other mating heights are possible (according to the Datasheet). The module and base board can be manufactured using other connectors upon request.

Connector SpecificationsValue
Insulator materialLiquid crystal polymer
Stacking height5 mm
Contact materialPhosphor-bronze
PlatingAu or Sn over 50 μ" (1.27 μm) Ni
Current rating1.6 A per pin (2 pins powered)
Operating temperature range-55 °C to +125 °C
RoHS compliantYes
Connector specifications.
Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm, Single-Ended 13.5GHz /  27Gbps
5 mm, Differential 20GHz / 40Gbps
4 mm, Single-Ended 13GHz /  26Gbps
4 mm, Differential 13.5GHz / 27Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ SS5/ST5 B2B connectors is 1.6A per pin (2 pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms sawtooth wave
  • Vibration: 7.56G 'RMS', 2 hours per axis, 3 axes total
Manufacturer Documentation

  File Modified
PDF File hsc-report-sma_st5-ss5-04mm_web.pdf 21 09, 2018 by Martin Rohrmüller
PDF File hsc-report-sma_st5-ss5-05mm_web.pdf 21 09, 2018 by Martin Rohrmüller
PDF File ss5_catalog.pdf 21 09, 2018 by Martin Rohrmüller
PDF File ss5-st5_specs.pdf 21 09, 2018 by Martin Rohrmüller



Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

-0.35.5

V

Depends mostly on attached SoM, values here are for TE0724 PMIC, da9062_3v4.pdf.

Storage temperature

-30

80

°C

Push buttons datasheet.
Board absolute maximum ratings.


Assembly variants for higher storage temperature range are available on request.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage4.55.5VDepends mostly on attached SoM, values here are for TE0724 CAN Transceiver, MCP2542FD.
Operating temperature-2570°CPush buttons datasheet.
Recommended Operating Conditions.
Please check also the attached SOMs datasheet for a complete list of absolute maximum and recommended operating ratings.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

  • Module size: 105 mm × 100 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 4 mm.

  • PCB thickness: 1.6 mm.

  • Highest part on PCB: approx. 13.5 mm. Please download the step model for exact numbers.

Physical Dimension

Currently Offered Variants

Trenz shop TEB0724 overview page
English page

German page

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
2018-12-0102First production revision
REV02
-

01

Prototypes


REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Hardware Revision Number.

Document Change History



Date

Revision

Contributors

Description

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  • Update Recommended Operating Conditions

v.50Martin Rohrmüller
  • Update to TRM 2.4 style
  • Corrected Table 15
  • Added Comment on Module PMIC in Circuit Programming



v.31

Martin Rohrmüller


  • Splitted table 9 in two parts

v.30

Martin Rohrmüller

Update to REV02

  • Two DCDCs added, changes in the entire document

v.29Martin Rohrmüller
  • Added Figure J19 Jumper settings
  • updated Table counter

v.28Martin Rohrmüller
  • Updated assembly pictures
  • Added typical power consumption
  • Added hints on power rail voltages

v.27Martin Rohrmüller
  • Updated link to TE0724

v.26Martin Rohrmüller
  • Changed VCCIO_35 connection:
    R45 not placed , J19 placed

v.25Martin Rohrmüller
  • include B2B infos from general page

v.24Martin Rohrmüller
  • corrected links to connector datasheets

v.23John Hartfiel
  • style update

2018-07-10

v.19

Martin Rohrmüller

  • Initial document.
Document change history.

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REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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