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  1. Xilinx Zynq XC7Z SoC, U5
  2. 4 Gbit DDR3/L SDRAM, U13
  3. 4 Gbit DDR3/L SDRAM, U12
  4. Low-power RTC with battery backed SRAM, U20
  5. 32 MByte Quad SPI Flash memory, U7
  6. Red LED (LED1LED2), D5
  7. Green LED (LED2LED1), D2
  8. System Controller CPLD, U19
  9. eMMC NAND Flash, U15
  10. 4A high-efficiency PowerSoC DC-DC step-down converter (1V), U1
  11. Green LED (DONE), D4
  12. B2B connector Samtec Razor Beam™ LSHM-130, JM3
  13. B2B connector Samtec Razor Beam™ LSHM-150, JM1
  14. B2B connector Samtec Razor Beam™ LSHM-150, JM2
  15. Hi-speed USB 2.0 ULPI transceiver, U18
  16. Gigabit Ethernet (GbE) transceiver, U8
  17. Low-power programmable oscillator @ 52.000000 MHz (OTG-RCLK), U14
  18. Low-power programmable oscillator @ 33.333333 MHz (PS-CLK), U6
  19. Low-dropout regulator (VBATT), U24
  20. DDR termination regulator, U4
  21. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.5V), U2
  22. Atmel CryptoAuthentication chip, U10
  23. 2Kbit UNI/O® serial EEPROM with EUI-48™ node identity, U17
  24. Low-power programmable oscillator @ 25.000000 MHz (ETH-CLK), U9
  25. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.8V), U3
  26. 3A PFET load switch with configurable slew rate (3.3V), Q1

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eMMC Flash memory device(U15) is connected to the Zynq PS MIO bank 501 pins MIO46..MIO51 (see also Variants Currently in Production 54395765 for options). Depending on the module variant, different make and model of eMMC chips are available.

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infoTypeModified modified-datemodified- date
dateFormatyyyy-MM-dd
typeFlat

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infoTypeCurrent version
prefixv.
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infoTypeModified by
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  • fix typo for LED location on main component section
2019-02-05v.92John Hartfiel
  • small document update

2018-07-05

Jul 2018

v.89John Hartfiel
  • Update power rail section
2017-11-10

v.85

John Hartfiel
  • Replace B2B connector section
2017-09-07

v.84

John Hartfiel
  • Correction of Boot Mode section
2017-08-31

v.83

Jan Kumann
  • Initial document.

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infoTypeModified users
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