TE0720 TRM

Download PDF version of this document.

Overview

The Trenz Electronic TE0720 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z020 or XC7Z014S) with up to 1 GB of DDR3/L SDRAM, 32MB of SPI flash memory, Gigabit Ethernet PHY transceiver, a USB PHY transceiver and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. See also Variants Currently in Production section.

Key Features

• Xilinx XC7Z SoC (XC7Z020 or XC7Z014S)
  • Processing system (PS):
    
    • XC7Z020: Dual-core ARM Cortex-A9 MPCore™ with CoreSight™
    • XC7Z014S: Single-core ARM Cortex-A9 MPCore™ with CoreSight™
    • L1 cache: 32 KByte instruction, 32 KByte data per processor
    • L2 cache: Unified 512 KByte
  • Programmable logic (PL): Artix-7 FPGA
    • Programmable logic cells: 85K (XC7Z020), 65K (XC7Z014S)
    • Block RAM: 4.9 MByte (XC7Z020), 3.8 MByte (XC7Z014S)
    • DSP slices:  220 (XC7Z020), 170 (XC7Z014S)
    • Peak DSP performance: 276 GMACs (XC7Z020), 187 GMACs (XC7Z014S)
    • 2x 12 bit, MSPS ADCs with up to 17 differential inputs
• 54 multiuse I/O (MIO) pins
• 152 High-Range (HR) I/O pins (SelectIO interfaces)
• System Controller CPLD (Lattice LCMXO2-1200HC)
• Up to 1 GByte DDR3/L SDRAM memory (2 x 256 Mbit x 16, 32-bit wide data bus).
• 32 MByte Quad SPI Flash memory
• Gigabit Ethernet transceiver PHY (Marvell 88E1512)
• MAC address serial EEPROM with EUI-48™ node identity (11AA02E48)
• Highly integrated full-featured hi-speed USB 2.0 ULPI transceiver (Microchip USB3320C-EZK)
• 3-axis accelerometer and 3-axis magnetometer (ST Microelectronics LSM303DTR) (Optional!) 
• Real time clock with embedded crystal (Intersil ISL12020M): ±5ppm accuracy
• Atmel CryptoAuthentication element (Atmel ATSHA204A)
• Up to 32 GByte eMMC, usually 4 GByte, depends on module variant and assembly option
• User LED 1 (Green), user LED 2 (Red), user LED 3 - FPGA DONE (Green)
• On-board high-efficiency DC-DC converters for all voltages used
• Trenz 4 x 5 module socket connectors (3 x Samtec LSHM series connectors)
• Evenly spread supply pins for good signal integrity
• Rugged for shock and high vibration

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TE0720-03 block diagram.

Components and connections marked with dashed lines are optional or may be missing on some module variants, please contact us for additional information.

Main Components

Figure 2: Main components of the module.

1. Xilinx Zynq XC7Z SoC, U5
2. 4 Gbit DDR3/L SDRAM, U13
3. 4 Gbit DDR3/L SDRAM, U12
4. Low-power RTC with battery backed SRAM, U20
5. 32 MByte Quad SPI Flash memory, U7
6. Red LED (LED2), D5
7. Green LED (LED1), D2
8. System Controller CPLD, U19
9. eMMC NAND Flash, U15
10. 4A high-efficiency PowerSoC DC-DC step-down converter (1V), U1
11. Green LED (DONE), D4
12. B2B connector Samtec Razor Beam™ LSHM-130, JM3
13. B2B connector Samtec Razor Beam™ LSHM-150, JM1
14. B2B connector Samtec Razor Beam™ LSHM-150, JM2
15. Hi-speed USB 2.0 ULPI transceiver, U18
    
16. Gigabit Ethernet (GbE) transceiver, U8
17. Low-power programmable oscillator @ 52.000000 MHz (OTG-RCLK), U14
18. Low-power programmable oscillator @ 33.333333 MHz (PS-CLK), U6
19. Low-dropout regulator (VBATT), U24
20. DDR termination regulator, U4
21. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.5V), U2
22. Atmel CryptoAuthentication chip, U10
23. 2Kbit UNI/O® serial EEPROM with EUI-48™ node identity, U17
24. Low-power programmable oscillator @ 25.000000 MHz (ETH-CLK), U9
25. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.8V), U3
26. 3A PFET load switch with configurable slew rate (3.3V), Q1

Initial Delivery State

Table 1: Initial state of programmable devices on delivery of the module.

Boot Process

By default the TE-0720 supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B JM1 connector.

Table 14: Boot modes.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

PL I/O signal connections between Zynq SoC's I/O banks and B2B connectors, 152 HR GPIOs total.

Table 2: General PL I/O to B2B connectors information.

PS MIO bank 500 and 501 signal connections to B2B JM1 connector, 14 PS MIOs total.

Table 3: General PS MIO connections information.

For detailed information about the pin-out, please refer to the Pin-out tables. 

JTAG Interface

JTAG access to the Zynq SoC and System Controller CPLD is provided through B2B connector JM2.

Table 4: JTAG pins connection.

System Controller CPLD I/O Pins

Special purpose pins are connected to System Controller CPLD and have following default configuration:

Table 5: System Controller CPLD special purpose pins description.

Quad SPI Interface

Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1..6.

Table 6: Quad SPI interface MIOs and pins.

eMMC Interface

The TE0720 has on-board eMMC memory device (U15) except TE0720-03-1CR variant. At least three different eMMC devices have been used, please contact Trenz Electronic for more specific information.

Table 7: eMMC interface MIOs and pins.

Ethernet Interface

The Marvell Alaska 88E1512 (U8) is a physical layer device containing a single Gigabit Ethernet transceiver and three separate major electrical interfaces: MDI interface to copper cable, SERDES/SGMII interface and RGMII interface. RGMII interface is connected to the Zynq SoC PS bank 501 MIO pins, see tables below.

SGMII (SFP copper or fiber) pins are routed to the B2B connector JM3 and MDI pins are routed to the B2B connector JM1 (see table below).

Ethernet PHY to B2B connections

Table 8: Ethernet PHY to B2B connections.

Ethernet PHY to Zynq SoC PS MIO ETH0 connections

Table 9: Ethernet PHY to Zynq SoC connections.

USB Interface

Hi-speed USB ULPI PHY is provided by USB3320 from Microchip (U18). The ULPI interface is connected to the Zynq SoC PS USB0 via MIO28..39, bank 501.

Table 10: USB ULPI PHY to Zynq SoC connections.

USB PHY connection

Table 11: USB ULPI PHY connections.

I2C Interface

On-board I²C devices are connected to the System Controller CPLD which acts as a I²C bus repeater for the Zynq SoC. System Controller CPLD signals X1, X3 and X7 are routed to Zynq SoC bank 34. Exact functionality depends on the System Controller CPLD firmware.

Table 12: Zynq SoC to System Controller CPLD I²C bus.

Table 13: I²C slave device addresses.

On-board Peripherals

System Controller CPLD

The System Controller CPLD (U19) is provided by Lattice Semiconductor LCMXO2-1200HC (MachXO2 product family). The System Controller CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in System Controller CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Also interfaces like JTAG and I²C between the on-board peripherals and to the Zynq SoC are by-passed, forwarded and controlled.

Other tasks of the System Controller CPLD are monitoring of the power-on sequence and to indicate the programming state of the Zynq SoC FPGA.

For more detailed information, refer to the TE0720 System Controller CPLD firmware page.

DDR Memory

By default TE0720 module has two DDR3/L SDRAM chips arranged into 32-bit wide memory bus providing total on-board memory size up to 1 GBytes. Size of memory depends on the module variant, refer to the variants table.

Quad SPI Flash Memory

On-board 32-MByte QSPI flash memory S25FL256S (U7) is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

eMMC Flash Memory

eMMC Flash memory device(U15) is connected to the Zynq PS MIO bank 501 pins MIO46..MIO51 (see also Variants Currently in Production for options). Depending on the module variant, different make and model of eMMC chips are available.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signalling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin G13 of the System Controller CPLD chip (U19).

Table 15: Ethernet PHY to SC CPLD connections.

High-speed USB ULPI PHY

Hi-speed USB ULPI PHY is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section. The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U14).

RTC - Real Time Clock

Temperature compensated Intersil ISL12020M IC is used for Real Time Clock (U20). Battery voltage must be supplied to the module VBAT_IN pin from the carrier board to use battery backed functionality. Battery backed registers can be accessed over I²C bus at slave address of 0x6F. General purpose RAM is at I²C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device. 

MAC-Address EEPROM

A Microchip 2Kbit 11AA02E48 serial EEPROM (U17) is connected to the System Controller CPLD pin M14 via single-I/O UNI/O serial interface and contains pre-programmed globally unique 48-bit node address compatible with EUI-48^TM specification. Chip is programmed at the factory with a globally unique node address stored in the upper 1/4 of the memory array and write-protected through the STATUS register. The remaining 1,536 bits are available for application use.

Atmel CryptoAuthentication Chip

The ATSHA204A Atmel CryptoAuthentication^TM chip (U10) is connected to the System Controller CPLD pin N14 via single-wire interface providing various security functions and features such as anti-counterfeiting, firmware/media protection, password validation, secure session key exchanging, secure data storage and more. Refer to the product datasheet for more information.

eCompass module

Optionally TE0720 module can be fitted with ultra-compact high-performance eCompass device (LSM303D, U22) featuring 3D accelerometer and 3D magnetometer.

Oscillators

Table 16: Oscillators.

On-board LEDs

Table 17: On-board LEDs.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

Table 18: Power Consumption.

 * TBD - To Be Determined.

Power Distribution Diagram

Figure 3: Power distribution diagram.

Power-On Sequence

For highest efficiency of the on-board DC-DC regulators, it is recommended to use single 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all carrier board I/Os are 3-stated at power-on until System Controller CPLD sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10 and 12, meaning that all on-module voltages have become stable and module is properly powered up.

Use 3.3V or 1.8V output to enable external power supplies or power switches which are used to supply FPGA banks.

See also Xilinx datasheet DS187 for additional information. User should also check related carrier board documentation when choosing carrier board design for TE0720 module.

NOSEQ input signal

NOSEQ input signal from the carrier board can be used to control output of the two DC-DC converters U1 and U3. It works in conjunction with the System Controller CPLD firmware controlled ON_1V0 and ON_1V8 input signals of the U21 and U25 gate ICs.

Figure 4: Power sequencing.

Power Rails

Table 19: Module power rails.

¹⁾ In case of module variant of TE0720-03-L1IF which uses Xilinx Zynq XC7Z020-L1CLG484I chip with lower power consumption, power rails named 1.5V and VCCO_DDR_502 voltage is actually 1.35V. To achieve this, a resistor with different value is used for R4 (see schematic of the TE0720-03-L1IF for more information).

Bank Voltages

Table 20: Zynq SoC bank voltages.

Board to Board Connectors

Variants Currently in Production

Table 21: Module variants currently in production.

Technical Specifications

Absolute Maximum Ratings

Table 22: Module absolute maximum ratings.

Recommended Operating Conditions

Table 23: Recommended operating conditions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial and automotive grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 8 mm.

• PCB thickness: 1.6 mm.

• Highest part on PCB: approx. 2.5 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Figure 5: TE0720 module physical dimensions.

Revision History

Hardware Revision History

Table 24: Hardware revision history table.

There is no hardware revision number marking on the module PCB.

Document Change History

Table 25: Document change history table.

Disclaimer