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Overview

The Trenz Electronic TE0720 is an industrial-grade SoM (System on Module) based on AMD Zynq-7000 SoC with DDR3/DDR3L SDRAM, SPI flash memory, Gigabit Ethernet PHY transceiver, USB PHY transceiver and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via high-speed stacking connections. 

Refer to http://trenz.org/te0720-info for current online available documentation.

Key Features

  • SoC
    • AMD XC7Z SoC:  XC7Z014S / XC7Z020 1)
    • Speedgrade: -1 / -1L / -2 / -3 1)
    • Temperature Range: Extended / Industrial 1)
    • Package: CLG484
  • RAM/Storage
    • 1 GByte DDR3/DDR3L SDRAM 1)
    • 32 MByte QSPI Flash Memory 1)
    • 32 GB e.MMC system storage 1) 2)
    • EEPROM with MAC address 3)
  • On Board
    • Gigabit Ethernet transceiver PHY
    • USB 2.0 ULPI transceiver
    • Power Supervisor with Watchdog Timer 

    • System Controller (SC)
    • Serial EEPROM with EUI-48™ node identity / MAC address 3)
    • Atmel CryptoAuthentication IC
    • Real time clock (RTC) 2)
    • 3-axis accelerometer and magnetometer (eCompass) 2)
    • 2 x User LED
    • FPGA DONE LED
    • 3 x Oscillator (FPGA, Ethernet, USB)
  • Interface
    • 3 x B2B Connector (Samtec LSHM) for Trenz 4 x 5 SoM socket
      • PL: 152 HR IOs
      • PS: 14 x MIOs
  • Power
    • Single 3.3 V or dual 5 V / 3.3 V power supply via B2B Connector
  • Dimension
    • 40 mm x 50 mm
  • Notes
    1) Assembly variant dependent.
    2) Not equipped on all variants.
    3) MAC address is write protected. 1,536 bits of storage space.

Block Diagram


TE0720 block diagram

Main Components

 

TE0720 main components
  1. AMD Zynq XC7Z SoC, U5
  2. DDR3/DDR3L SDRAM, U12, U13
  3. Quad SPI Flash memory, U7
  4. eMMC NAND Flash, U15
  5. System Controller, U19
  6. USB 2.0 ULPI transceiver, U18
  7. Gigabit Ethernet transceiver, U8
  8. Microchip CryptoAuthentication chip, U10
  9. EEPROM with EUI-48™ node identity, U17
  10. RTC, U20
  11. eCompass, U22
  12. B2B connector Samtec Razor Beam™ LSHM, JM1, JM2, JM3
  13. LEDs, D2 & D5, D4

Initial Delivery State

Storage device name

Content

Notes

System Controller, U19standard firmware

Visit TE0720 CPLD Firmware for further information.

eMMC, U15not programmed

SPI Flash, U7

not programmed


2 kBit EEPROM, U17

not programmed besides factory programmed MAC address


Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector TypeDesignatorInterfaceIO CNTNotes
B2BJM1HR IO48
B2BJM1PS IO6

Bank 501 voltage level is 1.8 V.

SDIO or optional MIO (MIO40/.../MIO45).

B2BJM1PS IO4Bank 500 voltage level is 3.3 V (MIO0/MIO9/MIO12/MIO13).
B2BJM1UART2

Bank 500/SC Bank 2 voltage level is 3.3 V.

UART or MIO (MIO14/MIO15).

B2BJM1I2C
2

Bank 500 voltage level is 3.3 V . 

I²C or optional MIO (MIO10/MIO11).

B2BJM1VBat1
B2BJM1ETH MDI8 
B2BJM2HR IO50
B2BJM2HR IO18
B2BJM2JTAG4
B2BJM3ETH MDI4
B2BJM3USB OTG3
B2BJM3USB OTG VBus2
B2BJM3HR IO36
Board Connectors


Test Points

Test PointSignalNotes
TP11V
TP2VIN
TP31.5V
TP41.8V
TP5VTT
TP6VTTREF
TP73.3VIN
TP83.3V
TP9VCCIO13
TP10

VCCIO33


TP11VCCIO34
TP12VCCIO35
TP13AVCC
TP14AVREF
TP15AGND
TP16GND
TP17GND
TP18GND
TP19GND
TP20GND
TP21PS-RST
TP22PROG_B
TP23PS-CLK
TP24PS-CS
TP25SPI-SCK/M4
TP26SPI-DQO/MO
TP27SPI-DQ3/M3
TP28SPI-DQ2/M2
TP29SPI-DQ1/M1
TP30VBATT
TP31PS-POR-B
TP32PS-RST


Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorConnected toNotes

SoC

U5
  • SC
  • JM1, JM2, JM3
  • ETH PHY
  • USB PHY
  • Power Supervisor

RAM

U12, U13
  • AMD Zynq SoC DDR Interface PS Bank 502

Quad SPI

U7
  • AMD Zynq SoC Bank 500

e.MMC

U15
  • AMD Zynq SoC Bank 501

USB 2.0 ULPI PHY

U18
  • AMD Zynq SoC Bank 501

ETH PHY

U8
  • AMD Zynq SoC Bank 501

SC

U19
  • JM1, JM3
  • MAC EEPROM
  • RTC
  • Crypto Element
  • eCompass
  • Power Supervisor
  • System Supervisor

Visit TE0720 CPLD Firmware for further information.

MAC EEPROM

U17
  • SC
Contains pre-programmed globally unique 48-bit node address.

RTC Real time clock

U20
  • SC
  • eCompass
  • Crypto  Element

Battery backed functionality via VBat pin.

I²C adresses: Registers 0x6F/RAM 0x57.

Crypto Element

U10
  • SC
  • eCompass
  • RTC

eCompass

U22
  • SC
  • RTC
  • Crypto Element
I²C adresses: 0x1D

Power Supervisor

U26
  • SC
  • AMD Zynq SoC

Power Supervisor

U27
  • SC

Oscillator

U6
  • Zynq SoC PS Bank 500
33.3 MHz

Oscillator

U14
  • USB PHY
25 MHz

Oscillator

U9
  • ETH PHY
52 MHz
On board peripherals

Configuration and System Control Signals


Signal Name

Connector.Pin

Direction1)Description
NOSEQJM1.7INOUTModule Power management 2) 3) 4).
EN1JM1.28INPower enable signal 2) 3) 4).
PGOODJM1.30INOUTPower good and/or Boot mode select signal 2) 4)
MODEJM1.32INBoot mode select signal 2) 3) 4).
JTAGMODEJM1.89INSelect JTAG target on the SoM 2) 3) 4).
RESINJM2.18INReset signal 4).

VBUS_V_EN

JM3.53OUTEnables USB Host Bus Voltage
USB-VBUSJM3.55INDetects USB Host Bus Voltage
MIO14/MIO15JM1.92 / JM1.85INOUTUART to SoC and SC 2)
MIO10/MIO11JM1.95 / JM1.93INOUTI²C SoC to B2B
X5 / X7U5C.P22 / U5C.N22
U19D.J1 / U19D.M1

INOUTI²C SC to SoC
SDA / SCLU22.6 / U22.4
U20.12 / U20.11
U10.1
U16C.P7 / U16C.P8
INOUTI²C SC to RTC, eCompass and Crypto Element

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

             2) Firmware dependent. Refer to TE0720 CPLD Firmware for further information.

             3) Do not leave floating. 

             4) For more information refer to 4 x 5 SoM Integration Guide.

Controller signal.

Power and Power-On Sequence


Power Rails

 

Power Rail Name / Schematic NameConnector.PinDirection 1)Note
VINJM1.1 / JM1.3 / JM1.5 / 
JM2.4 / JM2.4 / JM2.6 / JM2.8
INSupply voltage from carrier.
3.3VIN JM1.13 / JM1.15IN

Supply voltage from carrier.

3.3VIN / VREF_JTAG
JM2.91OUTJTAG reference voltage.
VCCIO13JM2.7 / JM2.9INSoC IO Bank supply from carrier.
VCCIO33JM2.5INSoC IO Bank supply from carrier.
VCCIO34JM2.1 / JM2.3IN

SoC IO Bank supply from carrier.

VCCIO34 must be connected to power even if this bank is not used.

VCCIO35JM1.9 / JM1.11INSoC IO Bank supply from carrier.
VBAT_INJM1.79INRTC battery buffer supply
3.3VJM2.10 / JM2.12OUT
1.8VJM1.39OUT
1.5V 2)JM2.19OUT

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) For SoM variants with DDR3L RAM, this voltage is reduced to 1.35 V. On these variants, resistor R39 has a value of 120 kΩ instead of 100 kΩ for 1.5 V variants.

Module power rails.

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
1---

Configuration signal setup.

See Configuration and System Control Signals.

3.3VIN

VIN

- 1)

-

-

Main Power supply.


2
EN1
3.3 V (± 5 %)- 2)Enable SoM.3)

 

33.3V or 1.8V- 1) -

Module generated output voltages.

SoM's internal power-on sequence is complete when these voltages reach their nominal values.

4

VCCIO35
VCCIO34
VCCIO33
VCCIO13

- 1)-Supply module bank voltages. 4)


5

PGOOD

3.3 V (± 5 %)- 3)SoM power good signal.

All power sources are stable.

1) Refer to Recommended Operating Conditions.

2) Firmware dependent. Refer to TE0720 CPLD Firmware for further information.

3) Do not assert signal before input power supply reached 90 % of nominal value.

4) VCCIO34 needs to be connected to power even if bank is not used, to setup startup parameters.

For more information refer to DS187. 

Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report Apr 07, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report Apr 07, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report Apr 07, 2016 by Thorsten Trenz



Technical Specifications

This TRM is generic for all variants.

  • The voltage ranges are generally the same across variants (exceptions are possible, depending on custom requests).
  • The temperature range can differ depending on the assembly version.
  • The combination of a carrier and a SoM might have different requirements.

Variants of modules are described here: Article Number Information. Please contact us to inquire options. 

Absolute Maximum Ratings *)

Power Rail Name/ Schematic NameDescriptionMinMaxUnit
VIN

Supply voltage from carrier.

-0.36V
3.3VIN 

Supply voltage from carrier.

-0.53.6V
VCCIO13SoC IO Bank supply from carrier.-0.53.6V
VCCIO33SoC IO Bank supply from carrier.
-0.53.6V
VCCIO34

SoC IO Bank supply from carrier.

-0.53.6V
VCCIO35SoC IO Bank supply from carrier.-0.53.6V
VBAT_IN

RTC battery buffer supply.

-0.36V
Absolute maximum ratings

*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be different in dependence to the assembly variant. The voltage ranges should not be affected by assembly variants (exceptions are possible, depending on custom request).

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 75 °C.
  • Modules with extended temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
  • Modules with industrial temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC/FPGA design.
  • Cooling solution, active and or passive cooling.
  • Climate or enviromental conditions besides ambient temperature range.
  • Module orientation, neighboring assemblies, neither other heat sources nor the SoC/FPGA as heat source to other components.

Temperature range

This SoM is capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to 85 °C.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components.

The Operating temperature range depends also on customer design and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

Power Rail Name/ Schematic NameDescriptionMinMaxUnit
VIN

Supply voltage from carrier.

3.155.25V
3.3VIN 

Supply voltage from carrier.

3.153.45V
VCCIO13SoC IO Bank supply from carrier.

1.14

3.465 

V
VCCIO33SoC IO Bank supply from carrier.

1.14

3.465 

V
VCCIO34

SoC IO Bank supply from carrier.

1.425

3.465 

V
VCCIO35SoC IO Bank supply from carrier.

1.14

3.465 

V
VBAT_IN

RTC battery buffer supply.

2.5

5.0

V


Recommended operating conditions.


Physical Dimensions

  • Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

  • PCB thickness: 1.6 mm ±10 %.

 All dimensions are given in millimeters.

 

Physical Dimension

Currently Offered Variants 

Trenz shop TE0720 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

The hardware revision number is on the PCB adjacent to the module identifier, separated by a dash.

 

Board hardware revision number.


DateRevisionChangesDocumentation Links
2022-0304

1. Revised power supply circuit, replaced next components:
- EN6347QI (U1) by MPM3840GQV-Z,
- EP53F8QI (U2, U3) by MPM3834CGPA,
- TPS27082LDDCR (Q1) by MP5077GG-Z.
2. Added power supervisor BD39040MUF (U27). Next signal connected to system controller:
- PG_All (U27 - U19.C12) with pull-up resistor R67;
- WDEN (U27.13 - U19.C6) with pull-down resistor R80;
- WDIN (U27.14 - U19.N8);
- WDOUT (U27.16 - U19.M3).
3. Signal MIO8 (U5.E5) connected to system controller (U19.N7)
4. Added pull-down resistors R64 (net ON_1V0) and R65 (net ON_1V8)
5. Revised voltage supervisor U26 circuit: U26.6 (VDD) connected to 3.3VIN, Added protection diode D3 to U26.3 (#MR input)
6. Replaced BKP0603HS (L1, L2, L3, L4, L5, L7, L8) by MPZ0603S121HT000
7. Auxiliary information has been added on Samtec B2B connectors page
8. PCB: Revised layout of power supplies
9. PCB: Revised layout of Samtec B2B signals. The length of the tracks has been changed. Pinout of Samtec B2B connectors not affected
10. PCB: Added option to install Heatsink SuperGrip (c)
11. Added capacitors C7, C8, C9 (100uF, 1V)
12. Changed voltage divider resistors (R21, R61) to set the threshold for U26.
13. Changed capacitor designator (C14)

14. Added note regarding VCCIO34, page B2B-Connectors

REV04

PCN-202202

2015-0103

1. Bootmode is now latched on Reset

2. Fixed Xilinx "AR# 65240" . Added supervisor TPS3106K33DBVR (U26) according to Xilinx recommendations. 
3. Replaced SiT8008AI-73-XXS-25.000000E with SiT8008AI-73-18S-25.000000E 
4. Removed Hirose Ultra Small Coaxial Connector (J1) 
5. Added Testpoints 
6. System Controller updates to Revision 05

7. Change eMMC from MTFC32GAKAECN-3M to IS21ES32G-JCLI

8. Change DDR3 RAM (U12, U13) from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI
9. All SoMs use S25FL256SAGBHI20 Flash (U7) 
10. Change eMMC (U15) to IS21ES08G-JCLI
11. Clock Revision Change (U6, U14) SiT8008AI-... to SiT8008BI-...

Firmware changes:  
12. Added generic options for PUDC and Boot Mode
13. Set pin associated with MIO7 to Pullnone
14. Adding internal 3.3V enable signal en_3v3_int
15. Set JTAG C_* signals high impedance until 3.3V is enabled
16. Boot mode pins set to GND or high impedance until en_3v3_int is high 
17. MIO14,15 high impedance until en_3v3_int is high
18. Improved JTAG time constraints
19. JTAG drive strength adjustment
20. Bugfix I2C to GPIO module (I2C_to_GPIO.v) 
21. Changed Firmware Identifier to REV06

22. Change eMMC (U15) from IS21ES08G-JCLI / IS21ES32G-JCLI to SDINBDG4-8G-XI2 / SDINBDG4-32G-XI2
23. Change Ferrite Beads (L1, L2, L3, L4, L5, L7, L8) BKP0603HS121-T to MPZ0603S121HT000

REV03

PCN-202106
PCN-202101
PCN-202101
PCN-202001
PCN-201601
PCN-201503

2014-09021. JTAG only boot mode is now supported
2. Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256
3. Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206
4. Changed MDIO pullup from 10k to 4k7
5. Changed eMMC core supply from switched 3.3Vout to 3.3Vin
6. MAC EEPROM power changed from 3.3V to 1.8V
7. I²C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.
8. ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants  
9. Removed test pads on top layer  
10. Increased component clearance from mounting holes on bottom layer  
11. System Controller in-system programming via B2B JTAG pins  
12. JM1 pin 89 has new function that enables System Controller JTAG Chain no impact for old designs that connect this pin to GND

REV02

PCN-20140730

-

01

Prototypes

REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History


Date

Revision

Contributors

Description

  • Clearified Power Rails
  • Fixed download links

2025-05-23

  • Updated recommended minimum voltage for VCCIO34 to 1.425 V within section Recommended Operating Conditions.
  • Fix typos.

2025-05-13


v.104

Kilian Jahn

  • Updated to TRM version 4.2
  • Updated TRM to hardware revision 04
  • Fixed Inter Page Links

  • Updated PDF & PDF-Web Link

2021-11-15

v.95

John Hartfiel
  • changed currently available chapter to new style
2021-06-21v.93Mohsen Chamanbaz
  • fix typo for LED location on main component section
2019-02-05v.92John Hartfiel
  • small document update

2018-07-05

v.89John Hartfiel
  • Update power rail section
2017-11-10

v.85

John Hartfiel
  • Replace B2B connector section
2017-09-07

v.84

John Hartfiel
  • Correction of Boot Mode section
2017-08-31

v.83

Jan Kumann
  • Initial document.

--

all

  • --

Table 25: Document change history table.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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