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Overview
The Trenz Electronic TEM0707 is an industrial-grade module TEB0707 is a carrier for 4 x 5 Trenz Electronic modules.
Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.
It provides three high speed and one low speed CRUVI extension connectors. For more information, please refer to the CRUVI B2B Connectors. The TEB0707 is integrated with an Intel MAX10 FPGA as system controller and is equipped with a Micro USB2.0 Socket with FTDI to JTAG/UART solution, RJ45 LAN Socket, USB A Socket, Micro SD Card Socket, User LEDs, Push Buttons and DIP Switches for controlling the SoM.
Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.
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Notes : |
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Note: 'description: Important components and connector or other Features of the module → please sort and indicate assembly options Key Features' must be split into 6 main groups for modules and mainboards: - SoC/FPGA
- Package: SFVC784
- Device: ZU2...ZU5*
- Engine: CG, EG, EV*
- Speed: -1LI, -2LE,*, **
- Temperature: I, E,*, **
- RAM/Storage
- Low Power DDR4 on PS
- Data width: 32bit
- Size: def. 2GB*
- Speed:***
- eMMC
- Data width: 8Bit
- size: def. 8GB *
- QSPI boot Flash in dual parallel mode (size depends on assembly version)
- Data width: 8bit
- size: def. 128MB *
- HyperRAM/Flash (optional, default not assembled)
- MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
- On Board
- Lattice LCMXO2
- PLL SI5338
- Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
- Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
- Interface
- 132 x HP PL I/Os (3 banks)
- ETH
- USB
- 4 GTR (for USB3, Sata, PCIe, DP)
- MIO for UART
- MIO for SD
- MIO for PJTAG
- JTAG
- Ctrl
- Power
- 3.3V-5V Main Input
- 3.3V Controller Input
- Variable Bank IO Power Input
- Dimension
- Notes
- * depends on assembly version
- ** also non low power assembly options possible
- *** depends on used U+ Zynq and DDR4 combination
Key Features' must be split into 6 main groups for carrier: - Modules
- TE0808, TE807, TE0803,...
- RAM/Storage
- On Board
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
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- Modules
- TE08204x5 Trenz Electronic modules
- RAM/Storage
- MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48(FTDI Configuration)
- On Board
- Intel Max 10 FPGA
- FTDI FT2223
- 8x Green 6x User LEDs (3x green, 3x red)
- 2x Status LED
- DIP Switch
- Push Buttons
- Interface
- Gigabit RJ45 LAN socket
- SD Card socket
- Micro USB2.0 Socket
- Miceo USB A Socket
- 6x 3x High Speed CRUVI B2B Connectors,
- 1x Low Speed CRUVI B2B Connector
- 4x Jumpers
- Power
- Dimension
- Notes
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anchor | Figure_OV_BD |
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title | TEB0707 block diagram |
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diagramName | TEB0707_OV_BD |
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Main Components
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Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" . draw.io Diagram |
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diagramName | TEB0707_OV_BD |
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simpleViewer | false |
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width | 639 |
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lbox | true |
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diagramWidth | 641 |
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revision | 23 |
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anchor | Figure_OV_MC |
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title | TEB0707 main components |
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diagramName | TEB0707_OV_MC |
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- Barrel Jack Power Supply, J1
- Voltage Regulator, U1
- Micro SD Card Socket, J8
- Micro USB2.0 Socket, J15
- FT2232H FTDI, U8
- Micro USB A Socket, J9
- RJ45 LAN Socket, J2
- SDIO Port Expander, U4
- Jumpers, J4...7
- Push Button (Reset), S2
- DIP Switch, S1
- High Speed B2B Connector, JB3
- High Speed B2B Connector, JB2
- High Speed B2B Connector, JB1
- Intel MAX 10 FPGA, U6
- High speed B2B Speed CRUVI Connector, J10
- High speed B2B Speed CRUVI Connector, J11
- High speed B2B Speed CRUVI Connector, J12
- Low Speed CRUVI Connector, J13
- User Push Button, S3
- JumperPin header, J3
Initial Delivery State
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anchor | Table_OV_BP |
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title | Boot process. |
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MODE Signal State | Boot Mode |
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MODE | SoM Mode control pin (depnds on SoMBoot Mode: | PROGMODE | Programming Mode: - select between CPLD (low, closed, on)
- on SoM or FPGA/SoC (high, open, off )
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anchor | Table_OV_RST |
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title | Reset process. |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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cellHighlighting | true |
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Signal B2B | Connected to | I/O | Note |
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Reset | Push Button, S2 | RESIN | JB2- 17 | Out | SoM Module Reset signal |
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Signals, Interfaces and Pins
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Notes : - For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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Board to Board (B2B)
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Interfaces and Number FPGA bank number and number of I/O signals connected to the B2B connectorconnectors for Trenz 4x5 modules:
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anchor | Table_SIP_B2B |
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title | General PL I/O to B2B connectors information |
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orientation | portrait |
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FPGA Bank | B2B Connector | Interface | I/O Signal Count |
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Voltage Level |
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JTAG access to the TExxxx SoM through B2B connector JMX.
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anchor | Table_SIP_JTG |
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title | JTAG pins connection |
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JTAG Signal
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B2B Connector
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| Ethernet LAN | 4x Diff pairs | RJ45 Socket, J2 |
| SD Card | 6 x Single Ended | IO Expander, U4 |
| I/Os | 20x Single Ended | MAX10 FPGA Bank 6, U6 |
| CRUVI | 12x Diff pairs/24x Single ended 4x Single Ended | High Speed CRUVI, J12 | CRUVI C | SoM Control Signals | 5x Single Ended | MAX10 FPGA, U6 |
| I/Os | 8x Single ended | MAX10 FPGA Bank 8, U6 |
| JB2
| CRUVI | 12x Diff pairs/24x Single ended 4x Single Ended | High Speed CRUVI, J10 | CRUVI A | CRUVI | 6x Diff pairs/12x Single ended | High Speed CRUVI, J11 | CRUVI B | JTAG | 4x Single Ended | FPGA Bank 5, U6 |
| JB3 | CRUVI | 6x Diff pairs/12x Single ended 4x Single Ended | High Speed CRUVI, J11 | CRUVI B | USB | 1x Diff pair, 2x Single Ended | USB A, J9 |
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CRUVI B2B Connectors
The TEMB0707 is equipped with a Low Speed Connectors J 13 and three High Speed Connector J10...12. These connectors are provided for CRUVI extension cards. More information is provided in the B2B Connectors section.
MIO Pins
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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
Example:
MIO Pin | Connected to | B2B | Notes |
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MIO12...14 | SPI_CS , SPI_DQ0... SPI_DQ3 SPI_SCK | J2 | QSPI |
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anchor | Table_SIP_MIOsCRUVIB2B |
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title | MIOs pinsCRUVI B2B connectors information |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortEnabled | false |
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cellHighlighting | true |
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Speed | Designators | Schematic |
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MIO PinB2B | |
Test Points
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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.
Example:
High
| CRUVI C, J12 | A0...A5 (N/P) | B2B, JB1 |
| B0...B5 (N/P) | B2B, JB1 |
| MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK | MAX10 FPGA Bank 8, U6 | 3.3V User IOs (Max10 Firmware dependent) | HSIO, HI, HO, RESET | B2B, JB1 |
| High
| CRUVI B, J11 | A0...A5 (N/P) | B2B, JB1 |
| B0...B5 (N/P) | B2B, JB1 |
| MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK | MAX10 FPGA Bank 2/3, U6 | 3.3V User IOs (Max10 Firmware dependent) | HSIO, HSI, HSO, RESET | B2B, JB3 |
| High
| CRUVI A, J13
| A0...A5 (N/P) | B2B, JB2 |
| B0...B5 (N/P) | B2B, JB2 |
| MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK | MAX10 FPGA Bank 2/3, U6 | 3.3V User IOs (Max10 Firmware dependent) | HSIO, HSI, HSO, RESET | B2B, JB2 |
| Low | CRUVI | X0...X7 | MAX10 FPGA Bank 1A, U6 |
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JTAG Interface
JTAG signals form FTDI U8 are routed to MAX10 CPLD. Via dip setting JTAG of MAX10 or JTAG of the connected Trenz 4x5 module can be selected. Forwarding signals to SoM is MAX10 Firmware dependent.
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anchor | Table_SIP_TPs |
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title | Test Points Information |
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On-board Peripherals
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Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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anchor | Table_OBPSIP_MJTG |
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title | On board peripheralsJTAG pins connection |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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Chip/Interface | Designator | Notes |
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Quad SPI Flash Memory
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Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
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anchor | Table_OBP_SPI |
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title | Quad SPI interface MIOs and pins |
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JTAG Signal | MAX10 Pin Bank 1B, U6 | Connected to |
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TMS | G1 | FTDI (U8) - ADBUS3 | TDI | F5 | FTDI (U8) - ADBUS1 | TDO | F6 | FTDI (U8) - ADBUS2 | TCK | G2 | FTDI (U8) - ADBUS0 | JTAGEN | E5 | Dip S1-4 |
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JTAG access to the Trenz 4x5 module is through B2B connector JB2.
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anchor | Table_OBPSIP_RTCMJTG |
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title | I2C interface MIOs and JTAG pins connection |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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MIO Pin | Schematic | U? Pin | Notes |
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anchor | Table_OBP_I2C_RTC |
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title | I2C Address for RTC |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | widths | sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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MIO Pin | I2C Address | Designator | Notes |
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JTAG Signal | MAX10 Pin Bank5, U6 | B2B Connector |
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M_TMS | L12 | JB2-94 | M_TDI | L13 | JB2-96 | M_TDO | J10 | JB2-100 | M_TCK | H8 | JB2-98 | VCCJTAG | J11, J12 | JB2-92 |
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SD Card socket
The TEB0707 is equipped with an Micro SD Card slot, J8. For levelshifting an IO Expander (U4) is used.
Scroll Title |
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anchor | Table_SIP_SD Card |
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title | USB2.0 Socket information |
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anchor | Table_OBP_EEP |
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title | I2C EEPROM interface MIOs and pins |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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anchor | Table_OBP_I2C_EEPROM |
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title | I2C address for EEPROM |
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Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | widths | sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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MIO Pin | I2C Address | Designator | Notes |
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LEDs
DAT0...3 | ESD_DAT0...3 | B2B, JB1 | Through IO Expander, U4 | CMD | ESD_CMD | B2B, JB1 | Through IO Expander, U4 | VDD | 3.3V_SD | B2B, JB1 | Through IO Expander, U4 | CLK | ESD_CLK | B2B, JB1 | Through IO Expander, U4 | DLT | SD_CD | FPGA Bank 3, U6 | Card detect. |
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Micro USB2.0 Socket
There is a micro USB2.0 Socket, J15 provided in order to communicate with the FTDI, U8.
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anchor | Table_OBPSIP_LEDUSB2 |
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title | On-board LEDsMicro USB2.0 Socket information |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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DDR3 SDRAM
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Notes : Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3) |
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
- Part number:
- Supply voltage:
- Speed:
- NOR Flash
- Temperature:
Ethernet
D+ | O2-D_P | B2B, JB3 | Through Line Filter, L4 | D- | O2-D_N | B2B, JB3 | Through Line Filter, L4 | Vbus | VBUS | B2B, JB3 |
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USB A Socket
The SoM USB 2.0 signals are routed to a USB A socket (host).
scrollscroll-title |
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anchor | Table_OBPSIP_ETHUSBA |
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title | Ethernet PHY to Zynq SoC connectionsUSB A Socket information |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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U?? Signal NameSignal DescriptionNote | |
CAN Transceiver
Data+ | O2-D_P | B2B, JB3 | Through Line Filter, L1 | Data- | O2-D_N | B2B, JB3 | Through Line Filter, L1 | VCC | USB_VBUS | B2B, JB3 |
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RJ45 LAN Socket
There is a RJ45 Ethernet LAN MagJack, J2 connected to B2B, JB1.
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anchor | Table_SIP_ETH |
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title | RJ45 LAN Socket information |
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anchor | Table_OBP_CAN |
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title | CAN Tranciever interface MIOs |
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Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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BankU?? PinD-Tx | Driver Input | R-Rx | Reciever Output | |
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anchor | Table_OBP_CLK |
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title | Osillators |
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2 | PHY_MDI0_P | B2B, JB1 |
| 3 | PHY_MDI0_N | B2B, JB1 |
| 4 | PHY_MDI1_P | B2B, JB1 |
| 5 | PHY_MDI1_N | B2B, JB1 |
| 6 | PHY_MDI2_P | B2B, JB1 |
| 7 | PHY_MDI2_N | B2B, JB1 |
| 8 | PHY_MDI3_P | B2B, JB1 |
| 9 | PHY_MDI3_N | B2B, JB1 |
| VCC | ETH-VCC | B2B, JB1 |
| Green LED | ETH1_LED0 | Intel MAX 10, U6 | MAX10 Firmware dependent | Yellow LED | ETH1_LED1 | Intel MAX 10, U6 | MAX10 Firmware dependent |
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Jumpers
There are three Jumpers provided to choose the CRUVI Extension power voltage.
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anchor | Table_SIP_Jumpers |
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title | Jumpers information |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Designator | Schematic | Connected to | Notes |
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J14 | VCCIO_CC | B2B, JB2 | CRUVI C | J16 | VCCIO_CB | B2B, JB2 | CRUVI B | J17 | VCCIO_CA | B2B, JB2 | CRUVI A |
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anchor | Table_SIP_SMD |
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title | Jumpers information |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Designator | Schematic | Connected to | Notes |
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J3 | VBAT | B2B, JB1 |
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Test Points
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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section. Example: Test Point | Signal | B2B | Notes |
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10 | PWR_PL_OK | J2-120 |
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Scroll Title |
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anchor | Table_SIP_TPs |
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title | Test Points Information |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Test Point | Signal | Connected to | Notes |
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TP1 | 3.3V | Regulator, U1 |
| TP2 | VIN | Voltage Protection, U2 |
| TP4 | IOV | Regulator, U3 |
| TP5 | 3.3V | Power Switch, Q1 |
| TP6 | C5VIN | Power Switch, Q2 |
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On-board Peripherals
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Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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Page properties |
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
Scroll Title |
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anchor | Table_OBP |
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title | On board peripherals |
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Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Intel Max10 CPLD
The TEB0707 is quipped with an Intel Max10 as CPLD used for levelshifting of 3.3V signals on CRUVI connectors, JTAG/UART forward to modules, Module control pis, power sequencing and IO voltage selection along with providing User Push buttons, LEDs and switches. For complete information, please see the TEB0707 MAX10 CPLD.
FTDI FT2232H
The FTDI chip (U8) converts signals from USB2 to variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip which is used in Multi-Protocol Synchronous Serial Engine (MPPSE) mode for JTAG.
The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U10.
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anchor | Table_OBP_FT2232H |
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title | FTDI chip interfaces and pins |
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Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Pin | Schematic | Connected to | Notes |
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ADBUS0 | TCK | FPGA Bank 1B, U6 | JTAG interface | ADBUS1 | TDI | FPGA Bank 1B, U6 | ADBUS2 | TDO | FPGA Bank 1B, U6 | ADBUS3 | TMS | FPGA Bank 1B, U6 | BDBUS0 | F_UART_TX | FPGA Bank 1B, U6 | UART Transmitter output | BDBUS1 | F_UART_RX | FPGA Bank 1B, U6 | UART Receiver Input | OSCI | OSCI | Oscillator, U7 | Clock 12 MHz | EECS | EECS | EEPROM, U10 | EEPROM Contains FTDI configuration | EECLK | EECLK | EEPROM, U10 | EEDATA | EEDATA | EEPROM, U10 | DM/DP | FD_N/ FD_P | Micro USB, J15 | USB to UART | nRESET | 3.3V | 3.3V |
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LEDs
The functions of the LEDs are MAX10 Firmware dependent. See TEB0707 MAX10 CPLD LEDs.
Scroll Title |
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anchor | Table_OBP_LED |
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title | On-board LEDs |
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Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Designator | Color | Schematic | Connected to | Active Level | Note |
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D1 | green | LED3 | FPGA Bank 8 | Active High |
| D2 | green | LED5 | FPGA Bank 8 | Active High |
| D3 | green | LED7 | FPGA Bank 8 | Active High |
| D4 | red | LED4 | FPGA Bank 3 | Active High |
| D5 | red | LED6 | FPGA Bank 2 | Active High |
| D6 | red | LED8 | FPGA Bank 8 | Active High |
| D7 | red | LED2 | FPGA Bank 3 | Active High |
| D8 | green | LED1 | FPGA Bank 3 | Active High |
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|
EEPROM
The EEPROM IC, U8 contains the FTDI configuration and is prprogrammed with Xilinx JTAG licence.
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title | I2C EEPROM interface MIOs and pins |
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Pin | Schematic | Connected to | Notes |
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CS | EECS | FTDI, U8 |
| CLK | EECLK | FTDI, U8 |
| DIN | EEDATA | FTDI, U8 |
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DIP Switch
There is a DIP Switch provided for user controlling of settings. Dip1..3 are connected to MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 Dips.
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anchor | Table_OBP_DIP |
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title | DIP Switch connections |
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Pin | Schematic | Function (in standard Firmware) | Notes |
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DIP1 | DIP1 | Forwarded to IO so SoM | MAX10 firmware dependent. | DIP2 | DIP2 | IO Voltage selection | 1.8V ('high', open, OFF), 2.5V ('low', closed, ON) | DIP3 | DIP3 (PROGMODE) | Programming mode (JTAG selection on Trenz 4x5 module) | Select between FPGA/SoC (high, open, OFF ) or CPLD (low, closed, ON), MAX10 firmware dependent.
| DIP4 | JTAGEN | JTAG Selection | JTAG mode between CPLD (high, closed, ON) or SoM (low, open, OFF) |
|
Push Buttons
Buttons are connected MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 CPLD Buttons
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anchor | Table_OBP_BTN |
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title | Push Buttons informations |
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Designator | Schematic | Function (in standard Firmware) | Notes |
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S2 | RESET | SoM Reset | Hardware debounced. | S3 | BUTTON1 | User Button | debounced in Max10 FPGA |
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Clock Sources
MEMS U7 Oscillator is nedded for FTDI. It is additionally connectd to MAX 10 FPGA Bank 2 Pin H4 and can be used in custom Firmware.
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anchor | Table_OBP_CLK |
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title | Osillators |
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orientation | portrait |
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Designator | Description | Frequency | Note |
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U7 | MEMS Oscillator | 12 MHz |
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Power and Power-On Sequence
Page properties |
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn: - |Power on-sequence
- Power distribution
- Voltage monitoring circuit
|
Power Supply
Power supply with minimum current capability of 3 A for system startup is recommended.
Power Consumption
...
Programmable Clock Generator
There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??. The I2C Address is 0x??.
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anchor | Table_OBPPWR_PCLKPC |
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title | Programmable Clock Generator Inputs and OutputsPower Consumption |
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U?? SignalConnected toDirection | Note | IN0 | IN1 | IN2 | IN3 | XAXB | SCLK | SDA | OUT0 | OUT1 | OUT2 | OUT3 | OUT4 | OUT5 | OUT6 | OUT7 | OUT8/OUT9 | |
Power and Power-On Sequence
...
In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
- Power on-sequence
- Power distribution
- Voltage monitoring circuit
Note |
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For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" . |
* TBD - To Be Determined
Power Distribution Dependencies
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anchor | Figure_PWR_PD |
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title | Power Distribution |
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draw.io Diagram |
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diagramName | TEB0707_PWR_DP |
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lbox | true |
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diagramWidth | 641 |
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revision | 5 |
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Power-On Sequence
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
...
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anchor | TableFigure_PWR_PCPS |
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title | Power ConsumptionSequency |
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style | widths | sortByColumn | 1 |
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Power Input Pin | Typical Current |
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VIN | TBD* |
* TBD - To Be Determined
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diagramName | TEB0707_PWR_PS |
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width | 639 |
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links | auto |
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tbstyle | hidden |
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diagramDisplayName | |
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lbox | true |
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diagramWidth | 641 |
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revision | 4 |
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Power Rails
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anchor | FigureTable_PWR_PDPR |
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title | Power DistributionModule power rails. |
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ignore draw.io Diagram |
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border | false |
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diagramName | TEB0707_PWR_PD |
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simpleViewer | false |
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width | links | auto |
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tbstyle | hidden |
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diagramDisplayName | lbox | true |
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diagramWidth | 641 |
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revision | 2 |
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Image Removed |
Power-On Sequence
...
anchor | Figure_PWR_PS |
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title | Power Sequency |
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...
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Image Removed |
Voltage Monitor Circuit
...
anchor | Figure_PWR_VMC |
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title | Voltage Monitor Circuit |
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Create DrawIO object here: Attention if you copy from other page, objects are only linked. |
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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed |
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orientation | portrait |
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repeatTableHeaders | default |
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Power Rail Name | B2B Connector JB1 Pin | B2B Connector JB2 Pin | B2B Connector JB3 Pin | Direction | Notes |
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VCCIO_CA | - | 8, 10 | - | Output |
| VCCIO_CB | - | 2, 4, 6 | - | Output |
| VCCIO_CC | 10, 12 | - | - | Output |
| 3.3V | 14, 16 | - | - | Output |
| M1.8VOUT | 40 | - | - | Input |
| M3.3VOUT | - | 9, 11 | - | Input |
| ETH-VCC | 13 | - | - | Input |
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|
Bank Voltages
Below MAX10 CPLD Bankvoltages are summarized.
...
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anchor | Table_PWR_PRBV |
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title | Module power railsZynq SoC bank voltages. |
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Power Rail B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | |
...
1A | 3.3V | 3.3V |
| Bank 1B | 3.3V | 3.3V |
| Bank 2 | 3.3V | 3.3V |
| Bank 3 | 3.3V | 3.3V |
| Bank 5 | VCCJTAG |
| from SoM | Bank 6 | VCCIO_CC |
| Variable | Bank 8 | 3.3V | 3.3V |
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anchor | Table_PWR_BV |
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title | Zynq SoC bank voltages. |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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Board to Board Connectors
Page properties |
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- This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series, For example: 6 x 6 SoM LSHM B2B Connectors
Include Page |
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| 6 x 6 SoM LSHM B2B Connectors |
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| PD:6 x 6 SoM LSHM B2B Connectors |
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Include Page |
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| 4 x 5 SoM LSHM B2B Connectors |
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...
...
5 SoM LSHM B2B Connectors |
|
? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
CRUVI Connectors
Include Page |
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| CRUVI B2B Connectors |
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| CRUVI B2B Connectors |
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|
...
Technical Specifications
Absolute Maximum Ratings
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anchor | Table_TS_AMR |
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title | PS absolute maximum ratings |
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orientation | portrait |
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Symbols | Description | Min | Max | Unit |
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|
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5VIN | Input supply Voltage | -40 | 60 |
V | VV | T_STG | Storage Temperature | -40 | 85 | °C |
V | V | V | V
|
Recommended Operating Conditions
...
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anchor | Table_TS_ROC |
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title | Recommended operating conditions. |
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orientation | portrait |
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repeatTableHeaders | default |
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Parameter | Min | Max | Units | Reference Document |
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Input supply Voltage | 4.06 | 5.58 | V | See the OV/UV in the carrier datasheets. | T_OPT | 0 | 70 | °C | See Push Button | V | See ???? datasheets. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | °C | See Xilinx ???? datasheet. | °C | See Xilinx ???? datasheet. |
|
Physical Dimensions
Module size: ?? 135 mm × ?? 68 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? 4 mm.
PCB thickness: ?? 1.7 mm.
Page properties |
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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below: https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF
|
...
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anchor | Figure_TS_PD |
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title | Physical Dimension |
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draw.io Diagram |
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border | false |
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diagramName | TEB0707_TS_PD |
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simpleViewer | false |
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width | 639 |
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links | auto |
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tbstyle | hidden |
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diagramDisplayName | |
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lbox | true |
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diagramWidth | 641591 |
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revision | 17 |
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scroll-pdf | true |
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scroll-office | true |
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scroll-chm | true |
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scroll-docbook | true |
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scroll-eclipsehelp | true |
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scroll-epub | true |
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scroll-html | true |
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...
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anchor | Table_RH_HRH |
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title | Hardware Revision History |
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orientation | portrait |
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Date | Revision | Changes | Documentation Link |
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2020-11-20 | REV02 | first production release | REV02 | 2020-04-01 | REV01 | Prototypes | - |
|
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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anchor | Figure_RV_HRN |
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title | Board hardware revision number. |
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diagramName | TEB0707_RV_HRN |
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width | 200 |
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links | auto |
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tbstyle | hidden |
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lbox | true |
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diagramWidth | 238122 |
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revision | 37 |
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Image RemovedImage Added |
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Document Change History
...
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anchor | Table_RH_DCH |
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title | Document change history. |
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cellHighlighting | true |
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Date | Revision | Contributor | Description |
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Page info |
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infoType | Modified date |
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dateFormat | yyyy-MM-dd |
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type | Flat |
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| Page info |
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infoType | Current version |
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prefix | v. |
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type | Flat |
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showVersions | false |
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| Page info |
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infoType | Modified by |
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type | Flat |
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showVersions | false |
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| | -- | all | Page info |
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infoType | Modified users |
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type | Flat |
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showVersions | false |
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...
Include Page |
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| IN:Legal Notices |
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| IN:Legal Notices |
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draw.io Diagram |
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border | false |
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diagramName | TEB0707_OV_MC |
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simpleViewer | false |
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width | 639 |
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links | auto |
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tbstyle | hidden |
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diagramDisplayName | lbox | true |
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diagramWidth | 641 |
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revision | 3 |
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