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  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"

Template Change history:

DateVersionChangesAuthor
2024-08-07

4.3

  • add article name encoding table link to "Currently offert Variants" chapter
  • removed empty lines

JH/ED


4.2.1

Error correction in tables "Power Rails" and "Configuration and System Control Signals"

KJ


4.2
  • Changes Xilinx to AMD
ED

4.1
  • Minor changes
    • Notes
    • Tables
ED

4.0
  • Rework for smaller TRM which can be generated faster
    • Reduce Signal Interfaces Pin
    • Reduce On Board Periphery
    • Reduce Power
    • Move Configuration Signals from Overview to own section
JH

3.12
  • Version History
    • changed from list to table
  • all
    • changed title-alignment for tables from left to center
ma

3.11
  • update "Recommended Operating Conditions" section


3.1
  • New general notes for temperature range to "Recommended Operating Conditions"


3.02
  • add again fix table of content with workaround to use it for pdf and wiki
  • Export Link for key features examples
    • Notes for different Types (with and without Main FPGA)
  • Export Link for Signals, Interfaces and Pins examples
    • Notes for different Types (Modul, Modul Hybrid, Evalboard, Carrier)


3.01
  • remove fix table of content and page layout ( split page layout make trouble with pdf export)
  • changed and add note to signal and interfaces, to on board periphery section
  • ...(not finished)


3.00
  • → separation of Carrier/Module and evaluation kit TRM


2.15
  • add excerpt macro to key features


2.14
  • add fix table of content
  • add table size as macro


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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
        anchorFigure_anchorname
        title-alignmentcenter
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
        anchorTable_tablename
        title-alignmentcenter
        titleText

        Scroll Table Layout
        orientationportrait
        sortDirectionASC
        repeatTableHeadersdefault
        sortByColumn1
        sortEnabledfalse
        cellHighlightingtrue

        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistent across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchor from external : <page url>#<pagename without space characters>-<anchorname>


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-----------------------------------------------------------------------

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Note for Download Link of the Scroll ignore macro:

Scroll Ignore

Download PDF version of this document.

OverviewOverview 

The Trenz Electronic TE0820 is an industrial/extended 4 x 5 SoM integrating an AMD Zynq UltraScale+ MPSoC, DDR4 SDRAM, eMMC memory, flash memory for configuration and data storage, as well as powerful switching power supplies for all required voltages. The module is equipped with a Lattice Mach XO2 CPLD for system controlling. Three high-speed connectors provide a large number of inputs and outputs. Additionally, the module provides Gigabit Ethernet and USB 2.0 transceivers.

The highly integrated modules are smaller than a credit card and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are completely mechanically and largely electrically compatible with each other.

All components cover at least the industrial temperature range. The temperature range in which the module can be used depends on the customer design and the selected cooling. Please contact us for special solutions.

Refer to http://trenz.org/te0820-info for the current online version of this manual and other available documentation.

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Notes :


Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

See examples for different types <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-KeyFeatures


Excerpt
  • SoC
    • Device: ZU1 / ZU2 / ZU3 / ZU4 / ZU5 1)
    • Engine:  CG / EG / EV 1)
    • Speedgrade: -1 / -1L / -2 / -2L / 3 1)
    • Temperature Range: Extended / Industrial 1)
    • Package: SFVC784
  • RAM/Storage
    • 2 GByte DDR4 SDRAM 2)
    • 2 x 64 MByte Serial Flash 3)
    • 8 GByte eMMC 3)
    • EEPROM with MAC address
  • On Board
    • Lattice MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 10/100/1000 Mbps Ethernet Transceiver
    • 4x LEDS
  • Interface
    • 3 x B2B Connector (LSHM)
      • up to 132 PL HP IO
      • up to PS 14 MIO
      • 4 PS GTR
      • ETH (MDI) or SGMII
      • USB
      • SDIO
      • CFG, JTAG
  • Power
    • 3.3 V power supply via B2B Connector needed 4).
  • Dimension
    • 40 mm x 50 mm
  • Notes
    1) Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design.
    2) Up to 4 GByte are possible with a maximum bandwidth of 2400 MBit/s.
    3) Please, take care of the possible assembly options.
    4) Higher input voltage may be possible.

Block Diagram

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add drawIO object in Scroll Ignore section and add reference image in Scroll Only.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


Note

Title (not anchor) of all Scroll Title such as DrawIOs and Tables should be changed according to the Module name.

Example: TE0812 Block Diagram


Note

All created DrawIOs  should be named according to the Module name:

Example: DrawIO of TE0812 Block Diagram should be named TE0812_OV_BD



Scroll Title
anchorFigure_OV_BD
title-alignmentcenter
titleTE0820 -03 block diagram


Scroll Ignore

draw.io Diagram
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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photos, Please refer to "Diagram Drawing Guidline" .


Scroll Title
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titleTE0820 main components


Scroll Ignore

draw.io Diagram
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  1. AMD Zynq UltraScale+ MPSoC, U1
  2. QSPI flash memory, U7, U17
  3. DDR4 SDRAM, U2, U3
  4. eMMC memory, U6
  5. EEPROM, U25
  6. Ethernet transceiver, U8
  7. USB 2.0 ULPItransceiver, U18
  8. B2B Connector, JM1, JM2, JM3
  9. Lattice Semiconductor MachXO2 System Controller CPLD, U21
  10. Clock generator, U10
  11. Oscillator, U11, U14, U32
  12. Done LED, D1
  13. User LED, D2
  14. Error Out LED, D3
  15. Error Status LED, D4

Initial Delivery State

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Note

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty




Scroll Title
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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Quad SPI Flash

not programmed


eMMC

not programmed


DDR4 SDRAM

not programmed


Programmable Clock Generator

not programmed


EEPROM

not programmed besides factory programmed MAC address


System Controller CPLD

programmedTE0820 CPLD



Signals, Interfaces and Pins

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For subsection examples see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-Signals,InterfacesandPins

Note
  • Table with all connectors and Designator
  • List of different interfaces per connector
  • IO CNT (for FPGA IOs where functionality can be changed by customer)


Connectors

Scroll Title
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titleBoard Connectors

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Connector TypeDesignatorInterfaceIO CNTNotes
B2BJM1 ETH  - MDIETH
B2BJM1HP 48 SE / 24 DIFF 
B2BJM1 MIO  8 x GPIO
B2BJM1 SDIO SDIO or 6 x MIO 
B2BJM2 HP  68 SE / 33 DIFF
B2BJM2CFGJTAG
B2BJM3ETHSGMII
B2BJM3MGT PS4 x MGT (RX/TX)
B2BJM3MGT PSMGT CLK
B2BJM3CLKDIFF CLK
B2BJM3HP 16 SE / 8 DIFF
B2BJM3USBUSB



Test Points 

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delete the Test Point section.

Example:

Test PointSignalNotes1)
TP1PWR_PL_OK

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.


Scroll Title
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titleTest Points Information

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Test PointSignalNotes1)
TP1PS_LP0V85
TP2DDR_2V5
TP3PS_AVCC
TP4DDR_1V2
TP5PS_AVTT
TP6VTT
TP7PS_FP0V85
TP8VREFA
TP9DDR4-TENpulled-down to GND
TP10PS_PLL
TP11PL_VCCINT
TP12PG_ALLpulled-up to 3.3VIN
TP15PL_VCCINT_IO
TP16PL_VCU

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.


On-board Peripherals

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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection by assigning advance link using: #NameOfTheSection

Example:

Chip/InterfaceDesignatorConnected ToNotes
ETH PHYU10
  • B2B connector J1
  • SoC MIO
Gigabit ETH PHY



Scroll Title
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titleOn board peripherals

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Chip/InterfaceDesignatorConnected ToNotes

QSPI Flash

U7, U17SoC - PS

EEPROM

U25SoC - PS

DDR4 SDRAM

U2, U3SoC - PS

GigaBit Ethernet

U8SoC - PS, B2B

USB2.0 Transceiver

U18SoC - PS, B2B

eMMC Memory

U6SoC - PS

Oscillator

U32SoC - PS
OscillatorU14USB PHY
OscillatorU11Clock Generator, ETH PHY

Programmable Clock Generator

U10SoC - PS, B2B

CPLD

U21SoC - PS, B2B

LED

D1SoC - PSRed, Done LED (see U+ Zynq TRM)
LEDD2CPLDGreen, Status LED (see TE0820 CPLD)
LEDD3SoC - PSRed, PS Error LED (see U+ Zynq TRM)
LEDD4SoC - PSGreen, PS Error Status LED (see U+ Zynq TRM)



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For example subsections see: <Series Name> TRM Template section examples#%3CSeriesName%3ETRMTemplatesectionexamples-On-boardPeripherals


Configuration and System Control Signals

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  • Overview  all Controller signals, like Reset, Boote Mode, JTAG Interface(Connector or USB In case of FTDI)...
  • In case it's connected to CPLD always link to CPLD description and add not from the  current implementation here(in case it's available)


Scroll Title
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titleController signal.

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Connector+Pin

Signal Name

Direction1)Description
JM1-7NOSEQIN/OUTSee 4 x 5 SoM Integration Guide and TE0820 CPLD.
JM1-28EN1INSee 4 x 5 SoM Integration Guide and TE0820 CPLD.
JM1-30PGOODIN/OUTSee 4 x 5 SoM Integration Guide and TE0820 CPLD.
JM1-32MODEINSee 4 x 5 SoM Integration Guide and TE0820 CPLD.
JM1-89JTAGENINSee 4 x 5 SoM Integration Guide and TE0820 CPLD.
JM2-18RESININReset signal, see 4 x 5 SoM Integration Guide.
JM2-93 / JM2-95 / JM2-97 / JM2-99TMS / TDI / TDO / TCKSignal-dependent

JTAG configuration and debugging interface.

JTAG reference voltage: 3.3VIN

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.


Power and Power-On Sequence

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Enter the default value for power supply and startup of the module here.

  • Order of power provided Voltages and Reset/Enable signals

Link to Schematics, for power images or more details


Power Rails

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List of all power rails which are accessible by the customer

  • Main Power Rails and Variable Bank Power


Scroll Title
anchorTable_PWR_PR
title-alignmentcenter
titleModule power rails.

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Power Rail Name/ Schematic NameConnector.PinDirection1)Notes
VINJM1.1 / JM1.3 / JM1.5 / JM2.2 / JM2.4 / JM2.6 / JM2.8INSupply voltage from carrier board
3.3VINJM1.13 / JM1.15INSupply voltage from carrier board
3.3VINJM2.91OUTJTAG reference voltage

+3.3V

JM2.10 / JM2.12OUTInternal +3.3 V voltage level

+1.8V

JM1.39OUTInternal +1.8V voltage level

VCCO_64

JM2.7 / JM2.9INHP Bank voltage (max. +1.9 V)

VCCO_65

JM2.5INHP Bank voltage (max. +1.9 V)
VCCO_66JM1.9 / JM1.11INHP Bank voltage (max. +1.9 V)

PSBATT

JM1.79INPS battery supply voltage

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

Recommended Power up Sequencing

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List baseboard design hints for final baseboard development.



Scroll Title
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titleBaseboard Design Hints

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SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
1 1)3.3VIN3.3 V (± 5 %)-Management and SoC power supply.Main module power supply for management and SoC. 1 A recommended. Power consumption depends mainly on design and cooling solution.
2 1)VIN

3.3 V (± 5 %) 2)

       OR

5.0 V (± 5 %) 2)

-Main module power supply.Main module power supply for management and SoC. 3 A to 7 A recommended. Power consumption depends mainly on design and cooling solution.
31.8V--1.8 V on-module power supply.
43.3V--3.3 V on-module power supply.
5VCCO_64 / VCCO_65 / VCCO_66 2)-Module bank voltages.Enable bank voltages after 1.8 V and/or 3.3 V are available on carrier.

1) In cases where VIN = 3.3VIN = 3.3 V, both voltages can be enabled together.

2) A higher or lower input voltage may be possible. 

2) See DS925 for additional information.


Board to Board Connectors 

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    6 x 6 SoM LSHM B2B Connectors
    6 x 6 SoM LSHM B2B Connectors

 

Include Page
4 x 5 SoM LSHM B2B Connectors
4 x 5 SoM LSHM B2B Connectors

Technical Specifications 

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List of all power rails which are accessible by the customer

  • Main Power Rails and Variable Bank Power add boarder one time maximum Rating (Board will damaged)

  

Absolute Maximum Ratings *)

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titleAbsolute maximum ratings

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Power Rail Name/ Schematic NameDescriptionMinMaxUnit
VINSupply voltage-0.37V
3.3VINSupply voltage-0.33.75V

VCCO_64

I/O bank voltage-0.52.0V

VCCO_65

I/O bank voltage-0.52.0V
VCCO_66I/O bank voltage-0.52.0V

PSBATT

RTC / BBRAM-0.52.0V


 *) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
   or any other conditions beyond those indicated under Recommended Operating ConditionConditions. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

  • Variants of modules are described here: Article Number Information
  • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
  • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C


Scroll Title
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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document
VIN 1)

3.135

OR

4.75

3.465

OR

5.25

V


V


3.3VIN3.1353.465V

VCCO_64

0.9501.900VSee FPGA datasheet.

VCCO_65

0.9501.900VSee FPGA datasheet.
VCCO_660.9501.900VSee FPGA datasheet.

PSBATT

1.2001.500VSee FPGA datasheet.

1) Higher values may possible. For more information consult schematic and according datasheets.


Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

PCB thickness: 1.66 mm (± 10 %).

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guideline" .




Scroll Title
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title-alignmentcenter
titlePhysical Dimension


Scroll Ignore

draw.io Diagram
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Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

    DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706

Set correct Link for Name encoding table

  

Scroll Title
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titleTrenz Electronic Shop Overview

Scroll Table Layout
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cellHighlightingtrue

Trenz shop TE0820 overview page*
English pageGerman page

*)  Module article name encoding table: Zynq Ultrascale+ based modules (MPSoC, RFSoC)


Revision History

Hardware Revision History

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Set correct links to download  Carrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD
  • Example: 

    DateRevisionChangesDocumentation Link
    2020-11-25REV02
    • Resistors R14 and R15 was replaced by 953R (was 5K1)
    • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
    REV02



Scroll Title
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title-alignmentcenter
titleFigure 6: Module hardware revision number


Scroll Ignore
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DateRevisionChangesDocumentation Link
2022-06-2205
  • Changed EOL ferrite beads L1..5,L7,L9..12.
  • Changed EOL DCDC U5 (EN6363QI -> MPM3860GQW-Z).
  • Changed EOL load switch U28 (TPS27082LDDCR -> MP5077GG-Z ).
  • Added additional decoupling capacitors and changed caps 4.7uF to 10uF (AMD doc UG583 v1.23).
  • Added pull-down and testpoint to TEN DDR4 signal.
  • Changed EOL transistor T1 (AO7800 -> BSD840NH6327XTSA1).
  • Added voltage detector U30 (BD39040MUF-CE2).
  • Changed EOL eMMC U6 (MTFC4GACAJCN-4M -> SDINBDG4-8G-XI2).
  • Changed EOL MEMS U14 (SiT8008AI-73-XXS-52.000000E -> SiT8008BI-73-XXS-52.000000E).
  • Added signal PG_ALL (U30) to CPLD (pin5).
  • Added option (depends assembly variants, for all assembly variants R128 set as populated, instead special inquiry) signal POR_B through R128, T2 to CPLD (pin27).
  • Added option (depends assembly variants, for all assembly variants R95 set as DNP, instead special inquiry) signal EN1 through R95 to DCDC U5.
  • Added option (depends assembly variants, for all assembly variants U29 and R129 set as populated, instead special inquiry) signal PHY_LED1 through level translator U29 to FPGA (U1.K7).
  • Added resistors R130 & R131 (select Power-on delay override, for all assembly variants R130 set as DNP -> Standard PL Power-on delay time).
  • Added diode D5.
  • Added Power Diagram sheet.
  • LIB components update.
TE0820-05
2020-08-1404
  • Fixed DDR4 connection (BG1), support B-die DDR4 Industrial grade chips.
  • Added R93, changed value C62, change obsolete U28.
  • Added R89 (10R).
  • Added additional caps 4.7uF to PS_AVTT/PS_AVCC (AMD doc UG583).
  • Changed R51 20k ->10K (PS_AVCC = 0.85V, AMD doc DS925 v1.17).
  • Fixed DDR4 connection (Alert).
  • Added 3.3V signal to CPLD.
  • Added testpoints.
  • LIB components update.
TE0820-04
2019-01-0203
  • Fixed VCU connection: add additional DCDC (0.9V).
  • LIB components update.
  • Change package 1K resistors (0402 -> 0201).
  • Added LEDs (1x user LED, 1x LED for ERR_STATUS, 1xLED for ERR_OUT).
  • Change obsolete 2xSPI Flash (256MBit) -> 2xSPI Flash (512MBit).
  • Added additional DCDCs (PL_VCCINT_IO, PS_FP0V85).
  • Changed DCDC (U5) 6A (optional 4A).
TE0820-03
2017-08-1702
  • Added MAC EEPROM (slave address).
  • LIB components update.
  • Fixed SD Card connection.
  • Fixed sense connection from DCDC.
  • Made correct power connection for VCU (removed DCDC, added resistors and caps like as AMD recommended).
  • Added resistors for variants (ZU+ with/without VCU).
  • Added termination resistors (240R) to VRP pins fro all HP-banks.
TE0820-02
2016-12-2301PrototypeTE0820-01


 Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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  • Updated to new TRM style
  • Updated for REV05

2022-11-02

v.100

John Hartfiel

  • Corrected Key features
2021-12-17v.99Vadim Yunitski
  • Corrected 'Bank voltages' table 
2021-07-14v.98John Hartfiel
  • bugfix boot mode
2021-07-05v.97John Hartfiel
  • published
  • style changes
2020-09-18v.95Pedram Babakhani
  • Update to REV04
  • Update the TRM format
  • Technical Information update
2020-03-16v.87John Hartfiel
  • Corrected PLL section
  • Corrected Designators USB, ETH PHY, CLK section
2020-02-03v.85Martin Rohrmüller
  • Corrected #MIOs for QSPI and USB in block diagram
2019-11-28v.81Martin Rohrmüller
  • typo and designator in section USB interface corrected
2019-10-30v.80John Hartfiel
  • typo correction
2019-09-17v79Martin Rohrmüller
  • Updated according to PCN-20190110: eMMC, QSPI-Flash

2019-07-17

v.78Martin Rohrmüller
  • Corrected PJTAG Mio Pin29 in table 8

2019-05-08

v.77John Hartfiel
  • Corrected EEPROM I2C Address
  • Correction USB PHY connection

2018-11-12

v.74

John Hartfiel
  • update boot section

2018-08-30

v.73John Hartfiel
  • typo correction
  • update CPLD section
  • add LEDs to component list
  • add 3D picture of REV03 instead of REV01 picture

2018-07-12

v.69Ali Naseri
  • Update PCB Rev03

2018-06-11

v.61John Hartfiel
  • Rework chapter currently available products
  • add PJTAG note to MIOtable
2018-03-12v.54
  • Correction Power Rail Section
2017-11-20v.51John Hartfiel
  • Correction Default MIO Configuration Table
2017-11-10v.50John Hartfiel
  • Replace B2B connector section
2017-10-18v.49John Hartfiel
  • add eMMC section
2017-09-25v.48John Hartfiel
  • Correction in the "Board to Board (B2B) I/Os" section
  • Update in the "Variants Currently In Production" section
2017-09-18v.47John Hartfiel
  • Update PS MIO table
2017-08-30v.46Jan Kumann
  • MGT lanes section added.

2017-08-24

v.36

John Hartfiel
  • Correction in the  "Key Features" section.
2017-08-21v.34John Hartfiel
  • "Initial delivery state" section updated.
2017-08-21v.33Jan Kumann
  • HW revision 02 block diagram added.
  • Power distribution and power-on sequence diagram added.
  • System Controller CPLD and DDR4 SDRAM sections added.
  • TRM update to the template revision 1.6
  • Weight section removed.
  • Few minor corrections.



2017-08-18


v.7

John Hartfiel
  • Style changes
  • Updated "Boot Mode", "HW Revision History", "Variants Currently In Production" sections
  • Correction of MIO SD Pin-out, System Controller chapter
  • Update and new sub-sections on "On Board Peripherals and Interfaces" sections

2017-08-07

v.5

Jan Kumann

  • Initial version

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