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The Trenz Electronic TEM0005-02 is a low-cost , small FPGA module with Microsemi SmartFusion2 FPGA SoC and 32 MByte flash memory for configuration and operation. SmartFusion2 combines a 166 MHz Cortex-M3 MCU with 256 KByte Flash and 80 KByte SRAM as well as 12 kLUT FPGA Core Logic.

...

  • SoC/FPGA
    • Package: VFG400
    • Device: M2S005, M2S010, M2S025, M2S050 ,M2S060 *
    • Engine: VFG166Mhz 32Bit ARM Cortex-M3
    • Speed: -1, Standard*, **
    • Temperature: C, I,*, **
  • RAM/Storage
    • Low Power DDR3
      • Data width: 8/ 16bit
      • Size: def. 2Gb*
      • Speed: 20ns***
    • SPI Flash
      QSPI
      • Data width: 8 bit
      • size: 256 M bit * bit 
    • 2Kb EEPROM
  • On Board
    • Crypto Authentication IC
    • Voltage monitor IC
    • 10/100 Mbps PHY Ethernet
  • Interface
    • Samtec ST5 B2B Connector
  • Power
    • 5V 3.3V supplied from carrier
  • Dimension
    • 56 x 31 mm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used FPGA and DDR3 combination

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
anchorFigure_OV_BD
titleTEM0005 block diagram


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Main Components

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titleTEM0005 main components


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  1. Microsemi SmartFusionSmartFusion2 SoC, U2
  2. RegDual DCDC Regulator, U7
  3. EEPROM, U4
  4. 10/100 Mb Ethernet, U1
  5. QSPI Flash, U3
  6. Authentication IC, U6
  7. DDR3 Memory, U5
  8. B2B Connector, J1

...

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Quad SPI Flash

Not Programmed


EEPROMNot Programmed


DDR3 SDRAMCryptoAuthenticationNot Programmed


Configuration Signals

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FPGA bank number and number of I/O signals connected to the B2B connector:, J1.

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titleGeneral PL I/O to B2B connectors information

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FPGA Bank
B2B Connector
InterfaceI/O Signal CountVoltage LevelNotes

...

JTAG access to the TEM0005 SoM through B2B connector J1.

...

anchorTable_SIP_JTG
titleJTAG pins connection
Bank 1GPIO8x Single Ended3.3V
UART4x Single Ended3.3V
I2C2x Single Ended3.3V
GOLDEN1x Single Ended3.3V
Bank 2ULPI/I/O12x Single Ended3.3V
I2C2x Single Ended3.3V
GPIO10x Single Ended 3.3V
SC SPI4x Single Ended3.3V
SPI17x Single Ended3.3V
Bank 3JTAG5x Single Ended3.3V
Reset 1x Single Ended3.3V
Bank 4I/O24x Single Ended/12 LVDS pairs3.3V
Bank 6I/O28x Single Ended/14 LVDS pairsVDDI6max 2.5V
Bank 7I/O4x Single Ended3.3V



JTAG Interface

JTAG access to the TEM0005 SoM through B2B connector J1.

Scroll Title
anchorTable_SIP_JTG
titleJTAG pins connection

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JTAG Signal

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B2B Connector

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J1-12

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Test Points

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

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Test PointSignalB2BNotes
10PWR_PL_OKJ2-120
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titleTest Points Information

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Test PointSignalConnected toNotes
TP1CLKOUTRegulator, U7

...

JTAG Signal

B2B Connector

TMSJ1-14
TDIJ1-8
TDOJ1-10
TCK

J1-12

TRSTJ1-7


Test Points

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



Designator
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titleTest Points Information

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titleOn board peripherals

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Test PointSignalConnected to
Chip/Interface
Notes
QSPI
TP1
U3DDR3 SDRAMU5EEPROMU4Authentication ICU6EthernetU1

Quad SPI Flash Memory

CLKOUTRegulator, U7


On-board Peripherals

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

Scroll Title
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titleQuad SPI interface MIOs and pins
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MIO PinSchematicU?? PinNotes

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  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


Scroll Title
anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pinsOn board peripherals

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MIO PinSchematicU?? PinNotes
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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
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MIO PinI2C AddressDesignatorNotes

DDR3 SDRAM

Chip/InterfaceDesignatorNotes
QSPIU3
DDR3L SDRAMU5
EEPROMU4
Authentication ICU6
Ethernet PHYU1
OscillatorsY3


(Quad) SPI Flash Memory

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Notes :

Minimum and Maximum density of DDR3 SDRAM quad SPI flash must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

The TEM0005 is equipped with a (Q)SPI flash memory, U3 provided in order to store data and configuration. 

Signal Name
Scroll Title
anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins
Scroll Title
anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections

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SchematicU3 Pin
U?? Pin 
Connected to
Signal DescriptionNote

...

Notes
SPI0_SS0nCEFPGA Bank 2
SPI0_CLKSCKFPGA Bank 2
SPI0_SDOSI/IO0FPGA Bank 2
SPI0_SDISO/IO0FPGA Bank 2


EEPROM

The TEM0005 is equipped with an EEPROM IC, U4. The I2C signals are connected to authentication IC as well.

Scroll Title
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titleOsillatorsI2C EEPROM interface MIOs and pins

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Designator
Schematic
Description
U4 Pin
Frequency
Notes
Note
I2C0_SCL
Y3Crystal Oscillator25 MHz

Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

SCL
I2C0_SDASDA



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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

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 PinI2C AddressDesignatorNotes
SCL/SDA0x70U4


Authentication IC

There is an Authentication IC ATECC608A provided on TEM0005, The IC is connected to I2C0 bus.

Power Supply

Power supply with minimum current capability of 1.5 A for system startup is recommended.

Power Consumption

Scroll Title
anchorTable_PWROBP_PCAuth
titlePower ConsumptionAuthentication IC information

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

...

 PinSchematicNotes
SCLI2C0_SCLSerial Clock
SDAI2C1_SCLSerial Data



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anchorFigureTable_OBP_PWRI2C_PDAuthentication IC
titlePower DistributionI2C address for Authentication IC

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Power-On Sequence

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titlePower Sequency

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 PinI2C AddressDesignatorNotes
SCL/SDA0xC0U6This is the default value, which can be changed, see device datasheet.


DDR3L SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TEM0005 SoM has 2 Gb volatile DDR3L SDRAM IC for storing user application code and data.

  • Part number: IS43TR16128CL-125KBLI
  • Supply voltage: 1.5 V
  • Temperature: -40 to 95 °C

Ethernet Transceiver

On board 10/100 Mbps Ethernet Transceiver U1 is provided on the module TEM0005. 

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anchorFigureTable_PWROBP_VMCETH
titleVoltage Monitor CircuitEthernet PHY to Zynq SoC connections

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Power Rails

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titleModule power rails.

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U1 Pin Signal
Power Rail
Name

B2B Connector JM1 Pin

DirectionNotes3.3V1, 2, 3, 4OutputVDDI622Input

Bank Voltages

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anchorTable_PWR_BV
titleZynq SoC bank voltages.

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Bank          

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Voltage

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VDDI1

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use "include page" macro and link to the general B2B connector page of the module series,

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Technical Specifications

Absolute Maximum Ratings

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anchorTable_TS_AMR
titlePS absolute maximum ratings

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Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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anchorTable_TS_ROC
titleRecommended operating conditions.

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Physical Dimensions

  • Module size: 56 mm × 31 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 4 mm.

PCB thickness:  1.6 mm.

...

hiddentrue
idComments

In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Connected toNote
RXM/RXPETH1_RXB2B, J1
TXM/TXPETH1_TXB2B, J1
LED0/NWAYENETH1_LED0B2B, J1
LED1/SPEEDETH1_LED1B2B, J1
MDIOETH1_MDIOFPGA Bank 7, U2
MDCETH1_MDCFPGA Bank 7, U2
REXT-GND
INTRPETH1_INTRPFPGA Bank 7, U2
XO/XI-Crystal Oscillator, Y3
nRSTETH1_RSTFPGA Bank 7, U2
CONFIG0...2ETH1_COL/CRC/RXDVFPGA Bank 7, U2
TXCETH1_TXCFPGA Bank 7, U2
TXENETH1_TXENFPGA Bank 7, U2
TXD0...3ETH1_TXD0...3FPGA Bank 7, U2
RXD0...3ETH1_RXD0...3FPGA Bank 7, U2
RXCETH1_RXCFPGA Bank 7, U2
RXCERETH1_RXCERFPGA Bank 7, U2



Clock Sources

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anchorFigure_TS_PD
titlePhysical Dimension

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Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

    DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706

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anchorTable_VCP_SO
titleTrenz Electronic Shop Overview

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Revision History

Hardware Revision History

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Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD

...

anchorTable_RH_HRH
titleHardware Revision History

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  • Support M2S050 -> added R29,R30, C24..C26,C31
  • Added resistor R32
  • Full upd LIB

...

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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anchorFigure_RV_HRN
titleBoard hardware revision number.

...

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Document Change History

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  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

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anchorTable_RH_DCH
titleDocument change history.

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Page info
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Page info
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Page info
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  • change list

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--

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all

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Page info
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  • --

Disclaimer

...

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Template Revision 2.12

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"
HTML
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Important General Note:

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Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

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Figure template:

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anchorFigure_anchorname
titleText
Scroll Ignore

Create DrawIO object here: Attention if you copy from other page, objects are only linked.

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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed

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Table template:

  • Layout macro can be use for landscape of large tables

...

anchorTable_tablename
titleText

...

The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

  • <type>_<main section>_<name>

    • type: Figure, Table
    • main section:
      • "OV" for Overview
      • "SIP" for Signal Interfaces and Pins,
      • "OBP" for On board Peripherals,
      • "PWR" for Power and Power-On Sequence,
      • "B2B" for Board to Board Connector,
      • "TS" for Technical Specification
      • "VCP" for Variants Currently in Production
      •  "RH" for Revision History
    • name: custom, some fix names, see below
  • Fix names:
    • "Figure_OV_BD" for Block Diagram

    • "Figure_OV_MC" for Main Components

    • "Table_OV_IDS" for Initial Delivery State

    • "Table_PWR_PC" for Power Consumption

    • "Figure_PWR_PD" for Power Distribution
    • "Figure_PWR_PS" for Power Sequence
    • "Figure_PWR_PM" for Power Monitoring
    • "Table_PWR_PR" for Power Rails
    • "Table_PWR_BV" for Bank Voltages
    • "Table_TS_AMR" for Absolute_Maximum_Ratings

    • "Table_TS_ROC" for Recommended_Operating_Conditions

    • "Figure_TS_PD" for Physical_Dimensions
    • "Table_VCP_SO" for TE_Shop_Overview
    • "Table_RH_HRH" for Hardware_Revision_History

    • "Figure_RH_HRN" for Hardware_Revision_Number
    • "Table_RH_DCH" for Document_Change_History

...

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-----------------------------------------------------------------------

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Note for Download Link of the Scroll ignore macro:

Scroll Ignore

Download PDF version of this document.

Scroll pdf ignore

Table of Contents

Table of Contents

Overview

The Trenz Electronic TE0xxx-xx ... is an industrial-grade ... module ... based on Xilinx ...

Refer to http://trenz.org/tem0005-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

...

hiddentrue
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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination

Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension
  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • ...
  • RAM/Storage
    • ...
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...

Block Diagram

...

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

...

anchorFigure_OV_BD
titleTEM0005 block diagram

...

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Main Components

...

hiddentrue
idComments

Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below
Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .

...

anchorFigure_OV_MC
titleTEM0005 main components

...

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  1. ...
  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

...

anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module

...

Storage device name

...

Content

...

Notes

...

Quad SPI Flash

...

Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

...

anchorTable_OV_BP
titleBoot process.

...

MODE Signal State

...

anchorTable_OV_RST
titleReset process.

...

Signal

...

Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

...

anchorTable_SIP_B2B
titleGeneral PL I/O to B2B connectors information

...

JTAG access to the TExxxx SoM through B2B connector JMX.

...

anchorTable_SIP_JTG
titleJTAG pins connection

...

JTAG Signal

...

B2B Connector

...

MIO Pins

...

hiddentrue
idComments

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

...

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

...

anchorTable_SIP_MIOs
titleMIOs pins

...

Test Points

...

hiddentrue
idComments

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

...

anchorTable_SIP_TPs
titleTest Points Information

...

On-board Peripherals

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idComments

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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anchorTable_OBP
titleOn board peripherals

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Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins

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anchorTable_OBP_RTC
titleI2C interface MIOs and pins

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anchorTable_OBP_I2C_RTC
titleI2C Address for RTC

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anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

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LEDs

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anchorTable_OBP_LED
titleOn-board LEDs

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DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

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anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections

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CAN Transceiver

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anchorTable_OBP_CAN
titleCAN Tranciever interface MIOs

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anchorTable_OBP_CLK
titleOsillators

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Programmable Clock Generator

There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??.  The I2C Address is 0x??.

OUT8/OUT9
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anchorTable_OBP_PCLKCLK
titleProgrammable Clock Generator Inputs and OutputsOsillators

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DesignatorDescriptionFrequencyNote
Y3Crystal Oscillator25 MHzConnected to ETH PHY
U?? Pin
SignalConnected toDirectionNote

IN0

IN1IN2IN3

XAXB

SCLKSDAOUT0OUT1OUT2OUT3OUT4OUT5OUT6OUT7