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The Trenz Electronic TEM0005-02 is a low-cost , small FPGA module with Microsemi SmartFusion2 FPGA SoC and 32 MByte flash memory for configuration and operation. SmartFusion2 combines a 166 MHz Cortex-M3 MCU with 256 KByte Flash and 80 KByte SRAM as well as 12 kLUT FPGA Core Logic.

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SoC/FPGA
- Package: VFG400
- Device: M2S005, M2S010, M2S025, M2S050 ,M2S060 *
- Engine: VFG166Mhz 32Bit ARM Cortex-M3
- Speed: -1, Standard*, **
- Temperature: C, I,*, **

RAM/Storage
- Low Power DDR3
  - Data width: 8/ 16bit
  - Size: def. 2Gb*
  - Speed: 20ns***
  QSPIData width: 8 bit
- SPI Flash
  - size: 256 M bit * bit
- 2Kb EEPROM
On Board
- Crypto Authentication IC
- Voltage monitor IC
- 10/100 Mbps PHY Ethernet
Interface
- Samtec ST5 B2B Connector
Power
- 5V 3.3V supplied from carrier
Dimension
- 56 x 31 mm
Notes
- * depends on assembly version** also non low power assembly options possible
- *** depends on used FPGA and DDR3 combination

Block Diagram

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For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

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title	TEM0005 block diagram

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Main Components

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Microsemi SmartFusionSmartFusion2 SoC, U2
RegDual DCDC Regulator, U7
EEPROM, U4
10/100 Mb Ethernet, U1
QSPI Flash, U3
Authentication IC, U6
DDR3 Memory, U5
B2B Connector, J1

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title	Initial delivery state of programmable devices on the module

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Storage device name	Content	Notes
Quad SPI Flash	Not Programmed
EEPROM	Not Programmed
DDR3 SDRAMCryptoAuthentication	Not Programmed

Configuration Signals

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title	General PL I/O to B2B connectors information

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FPGA Bank	Interface	I/O Signal Count	Voltage Level	Notes
Bank 01	GPIO	8x Single Ended	3.3V
	UART	4x Single Ended	3.3V
	I2C	2x Single Ended	3.3V
	GOLDEN	1x Single Ended	3.3V
Bank 2	ULPI/I/O	12x Single Ended	3.3V
	I2C	2x Single Ended	3.3V
	GPIO	10x Single Ended	3.3V
	SC SPI	4x Single Ended	3.3V	SPI0	4x Single Ended
	3.3V	SPI1	7x Single Ended	3.3V
Bank 3	JTAG	5x Single Ended	3.3V
Bank 3	Reset	1x Single Ended	3.3V
Bank 4	I/O	24x Single Ended/12 LVDS pairs	3.3V
Bank 6	I/O	24x 28x Single Ended3.3V/14 LVDS pairs	VDDI6	max 2.5V
Bank 7	I/O	4x Single Ended	3.3V

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title	JTAG pins connection

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JTAG Signal	B2B Connector
TMS	J1-14
TDI	J1-8
TDO	J1-10
TCK	J1-12
JTAG_ENTRST	J1-7

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test Point	Signal	B2B	Notes
10	PWR_PL_OK	J2-120

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Chip/Interface	Designator	Notes
QSPI	U3
DDR3L SDRAM	U5
EEPROM	U4
Authentication IC	U6
Ethernet Transceiver PHY	U1
Oscillators	Y3

(Quad) SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

The TEM0005 is equipped with a QSPI (Q)SPI flash memory, U3 provided in order to store data and configuration.

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The TEM0005 is equipped with an EEPROM IC, U4. The two I²C signals are connected to authentication IC as well.

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There is an Authentication IC ATECC608A provided on TEM0005, The IC is connected to I2C0 signalsbus.

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title	Authentication IC information

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Pin	Schematic	Notes
SCL	I2C0_SCL	Serial Clock
SDA	I2C1_SCL	Serial Data

DDR3L SDRAM

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title	I2C address for Authentication IC

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Pin	I2C Address	Designator	Notes
SCL/SDA	0xC0	U6	This is the default value, which can be changed, see device datasheet.

DDR3L SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

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Part number: IS43TR16128CL-125KBLI
Supply voltage: 1.5 VAccess: time 20 ns
Temperature: -40 to 95 °C

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title	Osillators

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Designator	Description	Frequency	Note
Y3	Crystal Oscillator25 MHz	25 MHz	Connected to ETH PHY

Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

Power on-sequence
Power distribution
Voltage monitoring circuit

Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

Power Supply

Power supply with minimum current capability of 1.5 A for system startup is recommended.

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" .

Power Supply

Power supply with minimum current capability of 1.5 A for system startup is recommended.

Power Consumption

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Power Input Pin	Typical Current
VIN	TBD*

* TBD - To Be Determined

Power Distribution Dependencies

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title	Power ConsumptionDistribution

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Power Input Pin

Typical Current

VIN

TBD*

* TBD - To Be Determined

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Power-On Sequence

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Power-On Sequence


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Voltage Monitor Circuit

The TEM0005 is equipped with a voltage monitoring IC, U8. Reset Logic Output (nRST) asserts low when any of the V1, V2, or ADJ inputs are below their reset thresholds.

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title	Power SequencyVoltage Monitor Circuit

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Voltage Monitor Circuit

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Power Rails

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Power Rail Name	B2B Connector JM1 J1 Pin	Direction	Notes
3.3V	1, 2, 3, 4	OutputInput
VDDI6	22	Input

Bank Voltages

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title	Zynq SoC bank voltages.

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3.3V

Bank	Schematic Name	Voltage	Notes
Bank0	VDDI01.5V	1.5V
Bank1	VDDI13.3V	3.3V
Bank2VDDI2	3.3V	3.3V
Bank3VDDI3	3.3V	3.3V
Bank4VDDI4	3.3V	3.3V
Bank5	3.3V	VDDI6	3.3V
Bank6	VDDI6	max. 2.5V	supplied by carrier
Bank7VDDI7	3.3V	3.3V

Board to Board Connectors

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This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series,
For example: 6 x 6 SoM LSHM B2B Connectors
Include Page
PD:6 x 6 SoM LSHM B2B ConnectorsPD:
6 x 6 SoM LSHM B2B Connectors

Include Page

	DRAFT:3.1 x 5.6 SoM ST5/SS5 B2B Connectors
	DRAFT:3.1 x 5.6 SoM ST5/SS5 B2B Connectors

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title	PS absolute maximum ratings

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Symbols	Description	Min	Max	Unit
VIN	Input Supply Voltage	-0.3	3.63	V
STG_T	Storage Temperature	-45	125	°C

Recommended Operating Conditions

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title	Recommended operating conditions.

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Parameter	Min	Max	Units	Reference Document
VIN	3.15	3.45	V	See the carrier datasheets.
OPT_T	0 /-4540	12585	°C	See Microsemi Smartfusion2 datasheet. Depends on assembly version.

Physical Dimensions

Module size: 56 mm × 31 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.

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title	Hardware Revision History

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Date	Revision	Changes	Documentation Link
2019-10-01	REV01	Initial Release	REV01
2020-05-20	REV02	Support M2S050 -> added >added R29,R30, C24..C26,C31 Added resistor R32 Full upd LIB	REV02

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Date

Revision

Contributor

Description

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change listinitial Release

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all

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Trenz Electronic Documentation

Versions Compared

Old Version 18

New Version Current

Key

Block Diagram

Main Components

Configuration Signals

Test Points

(Quad) SPI Flash Memory

DDR3L SDRAM

DDR3L SDRAM

Power and Power-On Sequence

Power Supply

Power Supply

Power Consumption

Power Distribution Dependencies

Power-On Sequence

Power-On Sequence

Voltage Monitor Circuit

Voltage Monitor Circuit

Power Rails

Bank Voltages

Board to Board Connectors

Recommended Operating Conditions

Physical Dimensions