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id | Comments |
Important General Note:
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Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro
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Figure template:
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anchor | Figure_anchorname |
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title | Text |
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Create DrawIO object here: Attention if you copy from other page, objects are only linked. |
Scroll Only |
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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed |
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Table template:
- Layout macro can be use for landscape of large tables
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The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below
<type>_<main section>_<name>
- type: Figure, Table
- main section:
- "OV" for Overview
- "SIP" for Signal Interfaces and Pins,
- "OBP" for On board Peripherals,
- "PWR" for Power and Power-On Sequence,
- "B2B" for Board to Board Connector,
- "TS" for Technical Specification
- "VCP" for Variants Currently in Production
- "RH" for Revision History
- name: custom, some fix names, see below
- Fix names:
"Figure_OV_BD" for Block Diagram
"Figure_OV_MC" for Main Components
"Table_OV_IDS" for Initial Delivery State
"Table_PWR_PC" for Power Consumption
- "Figure_PWR_PD" for Power Distribution
- "Figure_PWR_PS" for Power Sequence
- "Figure_PWR_PM" for Power Monitoring
- "Table_PWR_PR" for Power Rails
- "Table_PWR_BV" for Bank Voltages
"Table_TS_AMR" for Absolute_Maximum_Ratings
"Table_TS_ROC" for Recommended_Operating_Conditions
- "Figure_TS_PD" for Physical_Dimensions
- "Table_VCP_SO" for TE_Shop_Overview
"Table_RH_HRH" for Hardware_Revision_History
- "Figure_RH_HRN" for Hardware_Revision_Number
- "Table_RH_DCH" for Document_Change_History
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Note for Download Link of the Scroll ignore macro:
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Table of Contents
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Overview
The Trenz Electronic TE0022-01 board is an industrial-grade SoC module based on Intel Cyclone V FPGA, a Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA, two 32 MByte Quad SPI Flash memory for configuration and operation and powerful switching-mode power supplies for all on-board voltages.
Refer to http://trenz.org/tei0022-info for the current online version of this manual and other available documentation.
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Notes :
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Key Features
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id | Comments |
Note:
'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options
Key Features' must be split into 6 main groups for modues:
- SoC/FPGA
- Package:
- Speed:
- Temperature:
- RAM/Storage
- E.g. SDRAM, SPI
- On Board
- E.g. CPLD, PLL
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
Key Features' must be split into 6 main groups for carrier:
- Modules
- TE0808, TE807, TE0803,...
- RAM/Storage
- E.g. SDRAM, SPI
- On Board
- E.g. CPLD, PLL
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
- SoC FPGA
- Intel Cyclone V (5CSEMA5F31C8N)
- Package: FBGA 896 pins
- Speed: 8
- Temperature: Commercial (Tj = 0 °C to 85 °C)
- RAM/Storage
- 1 GByte DDR3 SDRAM for HPS
- 1 GByte DDR3 SDRAM for FPGA
- 32 MByte SPI for HPS
- 32 MByte SPI for FPGA
- On Board
- Ethernet
- JTAG
- UART
- SD Card
- FMC
- Intel MAX10
- HDMI
- PMOD
- USB
- E.g. CPLD, PLL
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
Block Diagram
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id | Comments |
add drawIO object here.
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For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" . |
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anchor | Figure_OV_BD |
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title | TExxxx block diagram |
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Scroll Only |
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image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed |
Main Components
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id | Comments |
Notes :
- Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" . |
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anchor | Figure_OV_MC |
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title | TExxxx main components |
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Initial Delivery State
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Notes : Only components like EEPROM, QSPI flash can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
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anchor | Table_OV_IDS |
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title | Initial delivery state of programmable devices on the module |
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Storage device name
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Content
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Notes
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Quad SPI Flash
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Configuration Signals
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anchor | Table_OV_BP |
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title | Boot process. |
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MODE Signal State
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anchor | Table_OV_RST |
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title | Reset process. |
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Signal
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- For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- SD
- USB
- ETH
- FMC
- ...
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
- JTAG
- UART
- I2C
- MGT
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Board to Board (B2B) I/Os
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B2B Connector
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MIO Pins
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id | Comments |
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
Example:
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SPI_CS , SPI_DQ0... SPI_DQ3
SPI_SCK
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id | Comments |
Notes :
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Quad SPI Flash Memory
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Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
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anchor | Table_OBP_SPI |
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title | Quad SPI interface MIOs and pins |
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anchor | Table_OBP_I2C_RTC |
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title | I2C Address for RTC |
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anchor | Table_OBP_EEP |
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title | I2C EEPROM interface MIOs and pins |
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anchor | Table_OBP_I2C_EEPROM |
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title | I2C address for EEPROM |
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LEDs
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anchor | Table_OBP_LED |
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title | On-board LEDs |
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DDR3 SDRAM
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Notes : Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3) |
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
- Part number:
- Supply voltage:
- Speed:
- NOR Flash
- Temperature:
Ethernet
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anchor | Table_OBP_ETH |
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title | Ethernet PHY to Zynq SoC connections |
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anchor | Table_OBP_CLK |
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title | Osillators |
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Power and Power-On Sequence
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id | Comments |
In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
- Power on-sequence
- Power distribution
- Voltage monitoring circuit
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For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" . |
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
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* TBD - To Be Determined
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Power-On Sequence
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anchor | Figure_PWR_PS |
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title | Power Sequency |
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Voltage Monitor Circuit
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anchor | Figure_PWR_VMC |
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title | Voltage Monitor Circuit |
Scroll Ignore |
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Power Rails
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anchor | Table_PWR_PR |
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title | Module power rails. |
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B2B Connector
JM1 Pin
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B2B Connector
JM2 Pin
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B2B Connector
JM3 Pin
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Bank Voltages
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anchor | Table_PWR_BV |
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title | Zynq SoC bank voltages. |
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Bank
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Voltage
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id | Comments |
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use "include page" macro and link to the general B2B connector page of the module series,
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? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
Operating Temperature: -??°C ~ ??°C
Current Rating: ??A per ContactNumber of Positions: ??
Number of Rows: ??
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Note |
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For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" . |
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anchor | Figure_TS_PD |
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title | Physical Dimension |
Scroll Ignore |
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Currently Offered Variants
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anchor | Table_RH_DCH |
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title | Document change history. |
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infoType | Modified by |
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type | Flat |
showVersions | false |
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change list
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