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Overview

The Trenz Electronic TE0xxx-xx ... is an industrial-grade ... module ... based on Xilinx ..TEM0005-02 is a low-cost module with Microsemi SmartFusion2 SoC and 32 MByte flash memory for configuration and operation. SmartFusion2 combines a 166 MHz Cortex-M3 MCU with 256 KByte Flash and 80 KByte SRAM as well as 12 kLUT FPGA Core Logic.

Refer to http://trenz.org/tem0005-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • Package: VFG400
    • Device: M2S010, M2S050 *
    • Engine: 166Mhz 32Bit ARM Cortex-M3
    • Speed: Standard
    • Temperature: C, I*
    • ...
  • RAM/Storage
    • ...
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
    • Low Power DDR3
      • Data width: 16bit
      • Size: def. 2Gb
    • SPI Flash
      • size: 256 M bit 
    • 2Kb EEPROM
  • On Board
    • Crypto Authentication IC
    • Voltage monitor IC
    • 10/100 Mbps PHY Ethernet
  • Interface
    • Samtec ST5 B2B Connector
  • Power
    • 3.3V supplied from carrier
  • Dimension
    • 56 x 31 mm
  • Notes
    • * depends on assembly version
    Notes
    • ...

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTEM0005 block diagram


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Main Components

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titleTEM0005 main components


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  1. ...
  2. ...
  3. ...

Initial Delivery State


  1. Microsemi SmartFusion2 SoC, U2
  2. Dual DCDC Regulator, U7
  3. EEPROM, U4
  4. 10/100 Mb Ethernet, U1
  5. QSPI Flash, U3
  6. Authentication IC, U6
  7. DDR3 Memory, U5
  8. B2B Connector, J1

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Quad SPI Flash

Not Programmed


EEPROMNot Programmed


CryptoAuthenticationNot ProgrammedSystem Controller CPLD


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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MODE

Signal

State

Boot Mode
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titleReset process.
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Signal

B2BI/ONote
B2BI/ONote
RESET


J1-11
Active low reset 


Signals, Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

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FPGA bank number and number of I/O signals connected to the B2B connector:, J1.

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titleGeneral PL I/O to B2B connectors information

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FPGA Bank
B2B Connector
InterfaceI/O Signal CountVoltage LevelNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection

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JTAG Signal

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B2B Connector

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MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

Bank 1GPIO8x Single Ended3.3V
UART4x Single Ended3.3V
I2C2x Single Ended3.3V
GOLDEN1x Single Ended3.3V
Bank 2ULPI/I/O12x Single Ended3.3V
I2C2x Single Ended3.3V
GPIO10x Single Ended 3.3V
SC SPI4x Single Ended3.3V
SPI17x Single Ended3.3V
Bank 3JTAG5x Single Ended3.3V
Reset 1x Single Ended3.3V
Bank 4I/O24x Single Ended/12 LVDS pairs3.3V
Bank 6I/O28x Single Ended/14 LVDS pairsVDDI6max 2.5V
Bank 7I/O4x Single Ended3.3V



JTAG Interface

JTAG access to the TEM0005 SoM through B2B connector J1.

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SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

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Notes
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JTAG Signal

B2B Connector

TMSJ1-14
TDIJ1-8
TDOJ1-10
TCK

J1-12

TRSTJ1-7
MIO PinConnected toB2B


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120


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titleTest Points Information

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Test PointSignalConnected toNotes
TP1CLKOUTRegulator, U7


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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titleOn board peripherals

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Chip/InterfaceDesignatorNotes

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1
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Chip/InterfaceDesignatorNotes
QSPIU3
DDR3L SDRAMU5
EEPROMU4
Authentication ICU6
Ethernet PHYU1
OscillatorsY3


(Quad) SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

The TEM0005 is equipped with a (Q)SPI flash memory, U3 provided in order to store data and configuration. 

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titleQuad SPI interface MIOs and pins

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MIO PinSchematicU?? PinNotes

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SchematicU3 PinConnected toNotes
SPI0_SS0nCEFPGA Bank 2
SPI0_CLKSCKFPGA Bank 2
SPI0_SDOSI/IO0FPGA Bank 2
SPI0_SDISO/IO0FPGA Bank 2


EEPROM

The TEM0005 is equipped with an EEPROM IC, U4. The I2C signals are connected to authentication IC as well.

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titleI2C EEPROM interface MIOs and pins

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MIO Pin
Schematic
U?
U4 PinNotes
Scroll Title
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titleI2C Address for RTC
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueMIO PinI2C AddressDesignatorNotes

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I2C0_SCLSCL
I2C0_SDASDA



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MIO Pin
 Pin
SchematicU?? PinNotes
I2C AddressDesignatorNotes
SCL/SDA0x70U4