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Table of Contents
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Overview
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Refer to https://wiki.trenz-electronic.de/display/PD/TE0720+TRM for online version of this manual and additional technical documentation of the product.
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The Trenz Electronic TE0720 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z020 or XC7Z014S) with up to 1 GB of DDR3/L SDRAM, 32MB of SPI flash memory, Gigabit Ethernet PHY transceiver, a USB PHY transceiver and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. See also Variants Currently in Production section.
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- Xilinx XC7Z SoC (XC7Z020 or XC7Z014S)
- Processing system (PS):
- XC7Z020: Dual-core ARM Cortex-A9 MPCore™ with CoreSight™
- XC7Z014S: Single-core ARM Cortex-A9 MPCore™ with CoreSight™
- L1 cache: 32 KByte instruction, 32 KByte data per processor
- L2 cache: Unified 512 KByte
- Programmable logic (PL): Artix-7 FPGA
- Programmable logic cells: 85K (XC7Z020), 65K (XC7Z014S)
- Block RAM: 4.9 MByte (XC7Z020), 3.8 MByte (XC7Z014S)
- DSP slices: 220 (XC7Z020), 170 (XC7Z014S)
- Peak DSP performance: 276 GMACs (XC7Z020), 187 GMACs (XC7Z014S)
- 2x 12 bit, MSPS ADCs with up to 17 differential inputs
- Processing system (PS):
- 54 multiuse I/O (MIO) pins
- 152 High-Range (HR) I/O pins (SelectIO interfaces)
- System Controller CPLD (Lattice LCMXO2-1200HC)
- Up to 1 GByte DDR3/L SDRAM memory , (2 x 256 Mbit x 16 (, 32-bit wide data bus). See also variants table.
- 32 MByte Quad SPI Flash memory
- Gigabit Ethernet transceiver PHY (Marvell 88E1512)
- MAC address serial EEPROM with EUI-48™ node identity (11AA02E48)
- Highly integrated full-featured hi-speed USB 2.0 ULPI transceiver (Microchip USB3320C-EZK)
- 3-axis accelerometer and 3-axis magnetometer (ST Microelectronics LSM303DTR) (Optional!)
- Real time clock with embedded crystal (Intersil ISL12020M): ±5ppm accuracy
- Atmel CryptoAuthentication element (Atmel ATSHA204A)
- Up to 32 GByte eMMC, usually 4 GByte, depends on module variant and assembly option
- User LED 1 (Green), user LED 2 (Red), user LED 3 - FPGA DONE (Green)
- On-board high-efficiency DC-DC converters for all voltages used
- Trenz 4 x 5 module socket connectors (3 x Samtec LSHM series connectors)
- Evenly spread supply pins for good signal integrity
- Rugged for shock and high vibration
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- Xilinx Zynq XC7Z SoC, U5
- 4 Gbit DDR3/L SDRAM, U13
- 4 Gbit DDR3/L SDRAM, U12
- Low-power RTC with battery backed SRAM, U20
- 32 MByte Quad SPI Flash memory, U7
- Red LED (LED1LED2), D5
- Green LED (LED2LED1), D2
- System Controller CPLD, U19
- eMMC NAND Flash, U15
- 4A high-efficiency PowerSoC DC-DC step-down converter (1V), U1
- Green LED (DONE), D4
- B2B connector Samtec Razor Beam™ LSHM-130, JM3
- B2B connector Samtec Razor Beam™ LSHM-150, JM1
- B2B connector Samtec Razor Beam™ LSHM-150, JM2
- Hi-speed USB 2.0 ULPI transceiver, U18
- Gigabit Ethernet (GbE) transceiver, U8
- Low-power programmable oscillator @ 52.000000 MHz (OTG-RCLK), U14
- Low-power programmable oscillator @ 33.333333 MHz (PS-CLK), U6
- Low-dropout regulator (VBATT), U24
- DDR termination regulator, U4
- 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.5V), U2
- Atmel CryptoAuthentication chip, U10
- 2Kbit UNI/O® serial EEPROM with EUI-48™ node identity, U17
- Low-power programmable oscillator @ 25.000000 MHz (ETH-CLK), U9
- 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.8V), U3
- 3A PFET load switch with configurable slew rate (3.3V), Q1
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MODE Signal State | Boot Mode |
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High or open | SD CardQSPI |
Low or connected to the ground | QSPISD Card |
Table 14: Boot modes.
Signals, Interfaces and Pins
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Table 2: General PL I/O to B2B connectors information.
PS MIO bank 500 and 501 signal connections to B2B JM1 connector, 14 PS MIOs total.
MIO | B2B Pin | Bank | Voltage | Notes | |
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0 | JM1-87 | 500 | 3.3V | ||
9 | JM1-91 | 500 | 3.3V | ||
10 | JM1-95 | 500 | 3.3V | ||
11 | JM1-93 | 500 | 3.3V | ||
12 | JM1-99 | 500 | 3.3V | ||
13 | JM1-97 | 500 | 3.3V | ||
14 | JM1-92 | 500 | 3.3V | Also wired to U19-M4 | |
15 | JM1-85 | 500 | 3.3V | Also wired to U19-N4 | |
40 | JM1-27 | 501 | 1.8V | Zynq SoC SD0 | |
41 | JM1-25 | 501 | 1.8V | Zynq SoC SD0 | |
42 | JM1-23 | 501 | 1.8V | Zynq SoC SD0 | |
43 | JM1-21 | 501 | 1.8V | Zynq SoC SD0 | |
44 | JM1-19 | 501 | 1.8V | Zynq SoC SD0 | |
45 | JM1-17 | 501 | 1.8V | Zynq SoC SD0 |
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Table 4: JTAG pins connection.
Note |
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JTAGMODE pin 89 in B2B connector JM1 is used to switch access between devices, low selects Zynq SoC, high selects System Controller CPLD. |
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System Controller CPLD I/O Pins
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Ethernet PHY to B2B connections
PHY Signal | B2B Pin | PHY Signal | B2B Pin | ||
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SOUT_N | JM3-1 | PHY_MDI1_P | JM1-10 | ||
SOUT_P | JM3-3 | PHY_MDI1_N | JM1-12 | ||
SIN_N | JM3-2 | PHY_MDI2_P | JM1-16 | ||
SIN_P | JM3-4 | PHY_MDI2_N | JM1-18 | ||
PHY_MDI0_P | JM1-4 | PHY_MDI3_P | JM1-22 | ||
PHY_MDI0_N | JM1-6 | PHY_MDI3_N | JM1-24 |
Table 8: Ethernet PHY to B2B connections.
Ethernet PHY to Zynq SoC PS MIO ETH0 connections
PHY Signal | SoC MIO | PHY Signal | SoC MIO | ||
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ETH-TXCK | 16 | ETH-RXCK | 22 | ||
ETH-TXD0 | 17 | ETH-RXD0 | 23 | ||
ETH-TXD1 | 18 | ETH-RXD1 | 24 | ||
ETH-TXD2 | 19 | ETH-RXD2 | 25 | ||
ETH-TXD3 | 20 | ETH-RXD3 | 26 | ||
ETH-TXCTL | 21 | ETH-RXCTL | 27 | ||
ETH-MDC | 52 | ETH-MDIO | 53 |
Table 9: Ethernet PHY to Zynq SoC connections.
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USB PHY Pin | SC CPLD Pin | B2B Name | Notes | |
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REFSEL0..2 | - | - | Reference clock frequency select, all set to GND = 52.000000 MHz. | |
RESETB | B14, bank 1 | - | Active low reset. | |
CLKOUT | - | - | ULPI output clock connected to Zynq PS MIO36. | |
DP, DM | OTG-D_P, OTG-D_N | USB data lines. | ||
CPEN | VBUSVBUS_V_EN | External USB power switch active high enable signal. | ||
VBUS | - | USB-VBUS | Connect to USB VBUS via a series of resistors, see reference schematic. | |
ID | - | OTG-ID | For A-device connect to the ground, for B-device leave floating. | |
SPK_L | M5, bank 2 | - | In USB audio mode a switch connects the DM pin to the SPK_L. | |
SPK_R | M8, bank 2 | - | In USB audio mode a switch connects the DP pin to the SPK_R. |
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LED | Color | Connected to | Description and Notes |
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D2 | Green | LED1 | Controlled by System Controller CPLD firmware. |
D4 | Green | DONE | |
D5 | Red | LED2 | Controlled by System Controller CPLD firmware. |
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Note |
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Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered). |
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Power-On Sequence
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It is important that all carrier board I/Os are 3-stated at power-on until System Controller CPLD sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10 and 12, meaning that all on-module voltages have become stable and module is properly powered up.
Use 3.3V or 1.8V output to enable external power supplies or power switches which are used to supply FPGA banks.
See also Xilinx datasheet DS187 for additional information. User should also check related carrier board documentation when choosing carrier board design for TE0720 module.
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NOSEQ input signal from the carrier board can be used to control output of the two DC-DC converters U1 and U3. It works in conjunction with the System Controller CPLD firmware controlled ON_1V0 and ON_1V8 input signals of the U21 and U25 gate ICs.
If NOSEQ input signal from the carrier board is low (logical 0), signals ON_1V0 and ON_1V8 can be driven by System Controller CPLD to control outputs of the U1 and U3 DC-DC converters. | If NOSEQ input signal from the carrier board is high (logical 1), state of the ON_1V0 and ON_1V8 signals is irrelevant and DC-DC converters U1 and U3 outputs are always enabled. |
Figure 4: Power sequencing.
Note |
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Initial state of the ON_1V0 and ON_1V8 signals and therefore also functionality of the NOSEQ signal depend on the System Controller CPLD firmware. |
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B2B Name | B2B JM1 Pins | B2B JM2 Pins | Direction | Note |
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VIN | 1, 3, 5 | 2, 4, 6, 8 | Input | Supply voltage from carrier board. |
3.3VIN | 13, 15 | 91- | Input | Supply voltage from carrier board. JM2 |
JTAG VREF | - | 91 is VREF_JTAG. | Output | JTAG reference voltage. Attention: Net name on schematic is "3.3VIN" |
VCCIO35 | 9, 11 | - | Input | High range bank voltage from carrier board. |
VCCIO33 | - | 5 | Input | High range bank voltage from carrier board. |
VCCIO13 | - | 7, 9 | Input | High range bank voltage from carrier board. |
VCCIO34 | - | 1, 3 | Input | High range bank voltage from carrier board. |
VBAT_IN | 79 | - | Input | RTC battery-buffer supply voltage. |
3.3V | - | 10, 12 | Output | Internal 3.3V voltage level. |
1.8V | 39 | - | Output | Internal 1.8V voltage level. |
1.5V 1) | - | 19 | Output | Internal 1.5V voltage level. |
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Bank | Schematic Name | Voltage | Notes | |
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500 | 3.3V, VCCO_MIO0_500 | 3.3V | ||
501 | 1.8V, VCCO_MIO1_501 | 1.8V | ||
502 | 1.5V, VCCO_DDR_502 | 1.5V | ||
0 Config | 3.3V | 3.3V | ||
13 HR | VCCO13 | 1.2V to 3.3V | Supplied by the carrier board. | |
33 HR | VCCIO33 | 1.2V to 3.3V | Supplied by the carrier board. | |
34 HR | VCCIO34 | 1.2V 25V to 3.3V | Supplied by the carrier board. | |
35 HR | VCCIO35 | 1.2V to 3.3V | Supplied by the carrier board. |
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Board to Board Connectors
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Variants Currently in Production
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Size
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Temperature
Range
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B2B Connector
Height
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Note: Only table was changed, chapter must be updated in case of TRM Style update |
Trenz shop TE0720 overview page | |
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English page | German page |
Table 21: Module variants currently in production.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | -0.3 | 6.5 | V | EP53F8QI datasheet. |
3.3VIN supply voltage | -0.1 | 3.75 | V | TPS27082L and LCMXO2-1200HC datasheets. |
Supply voltage for PS MIO banks | -0.5 | 3.6 | V | See Xilinx DS187 datasheet. |
I/O input voltage for MIO banks | -0.4 | VCCO_MIO + 0.55 | V | See Xilinx DS187 datasheet. (VCCO_MIO0_500, VCCO_MIO1_501) |
Supply voltage for HR I/Os banks | -0.5 | 3.6 | V | See Xilinx DS187 datasheet. (VCCIO13, VCCIO33, VCCIO34, VCCIO35) |
I/O input voltage for HR I/O banks | -0.4 | VCCIO + 0.55 | V | See Xilinx DS187 datasheet. |
Storage temperature | -40 | +85 | °C | - |
Storage temperature without the ISL12020MIRZ, eMMC Flash and 88E1512 PHY installed | -55 | +100 | °C | NB! Module variants using Nanya SDRAM chips, max temperature limit is +125 °C. |
Table 22: Module absolute maximum ratings.
Note |
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Assembly variants for higher storage temperature range are available on request. |
Note |
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Please check Xilinx datasheet DS187 for complete list of absolute maximum and recommended operating ratings. |
Recommended Operating Conditions
Table 21: Module variants currently in production.
Technical Specifications
Absolute Maximum Ratings
Parameter
Parameter | Min |
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Max | Units | Reference Document |
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VIN supply voltage |
2. |
5 |
5.5 | V | EN6347QI and EP53F8QI |
datasheets. |
3.3VIN supply voltage |
3. |
135 | 3. |
465 | V |
3.3V +/- 5%. |
Supply voltage for PS MIO banks |
1. |
71 | 3. |
465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS MIO banks | -0. |
20 | VCCO_MIO + 0. |
20 | V | See Xilinx DS187 datasheet. |
(VCCO_MIO0_500, VCCO_MIO1_501)
Supply voltage for HR I/Os banks |
1. |
14 | 3. |
465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for HR I/O banks | -0. |
20 | VCCIO + 0. |
20 | V | See Xilinx DS187 datasheet. |
Storage temperature
-40
+85
°C
Table 22: Module absolute maximum ratings.
Note |
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Assembly variants for higher storage temperature range are available on request. |
Note |
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Please check Xilinx datasheet DS187 for complete list of absolute maximum and recommended operating ratings. |
Recommended Operating Conditions
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Table 23: Recommended operating conditions.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Industrial and automotive grade: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 2.5 mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Figure 5: TE0720 module physical dimensions.
Revision History
Hardware Revision History
Table 24: Hardware revision history table.
There is no hardware revision number marking on the module PCB.
Document Change History
Date | Revision | Contributors | Description | ||||||||||||||||||||||
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2021-06-21 | v.93 | Mohsen Chamanbaz |
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2019-02-05 | v.92 | John Hartfiel |
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2018-07-05 | v.89 | John Hartfiel |
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2017-11-10 | v.85 | John Hartfiel |
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2017-09-07 | v.84 | John Hartfiel |
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2017-08-31 | v.83 | Jan Kumann |
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-- | all |
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Table 23: Recommended operating conditions.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Industrial and automotive grade: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 2.5 mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Figure 5: TE0720 module physical dimensions.
Revision History
Hardware Revision History
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Notes
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01
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Prototypes
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Table 24: Hardware revision history table.
There is no hardware revision number marking on the module PCB.
Document Change History
Date | Revision | Contributors | Description |
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Page info | modified-date | modified-date | |
dateFormat | yyyy-MM-dd | Jan Kumann | Initial document. |
Table 25: Document change history table.
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