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Note: Key Features' must be split into 6 main groups for modules and mainboards:
Key Features' must be split into 6 main groups for carrier:
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- SoC/FPGA
- Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
- Application Processor: Dual-core ARM Cortex-A53 MPCore
- Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
- Package: SFVC784
- Device: ZU3ZU2CG, ZU3CG, ZU4CG, ZU5CG
- Engine: CGG (General Purpose)
- Speed: -1LI (also non-low power assembly options possible1L (Low Power)
- Temperature range: industrialIndustrial (-40 ~ 85 °C)
- Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
- RAM/Storage
- Low power DDR4 on PS with 32 bit data width
- 128 MByte QSPI boot Flash in dual parallel mode
- 8 GByte e.MMC memory with 8 bit data width
- MAC address serial EEPROM with EUI-48 node identity
- On Board
- Lattice LCMXO2
- PLL SI5338
- Gigabit Ethernet transceiver PHY
- Hi-speed USB2 ULPI transceiver with full OTG support
- Interface
- 132 x HP PL I/Os (3 banks)
- ETH
- USB
- 4 GTR (for USB3, SATA, PCIe, DP)
Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:- PCI Express interface version 2.1 compliant
- SATA 3.1 specification compliant interface
DisplayPort source-only interface with video resolution up to 4k x 2k
- USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
- 1 GB/s serial GMII interface
- 14 x PS MIOs
- MIO for UART
- thereof 6 MIO for SD card interface (default configuration)
- MIO for PJTAG
- JTAG
- Ctrl
- Power
- 3.3V-5V main input
- 3.3V controller input
- Variable bank I/O power input
- All power supplies on board
- Dimension
- 4 x 5 cm
- Notes
- Rugged for shock and high vibration
- Evenly spread supply pins for good signal integrity
- Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)
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Main Components
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Overview
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