Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.

...

Page properties
hiddentrue
idComments

Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2CG, ZU3CG, ZU4CG, ZU5CG
    • Engine: G (General Purpose)
    • Speed: -1L (Low Power)
    • ZU2 ...ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **Temperature range: Industrial (-40 ~ 85 °C)
  • RAM/Storage
    • Low power DDR4 on PS with 32 bit data width
    • 128 MByte QSPI boot Flash in dual parallel mode
    • 2x  DDR4 SDRAM,
      • Data Width: 16 Bit
      • Size: 8 Gb, *
      • Speed: 2400 Mbps, ***
    • 2x QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x e.MMC Memory
      • Data Width: 16 Bit
      • Size: 8 Gb, *
      8 GByte e.MMC memory with 8 bit data width
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1 GB/s serial GMII interfaceGigabit Ethernet transceiver PHY
    • Hi-speed USB2 ULPI transceiver with full OTG support
    Interface
    • 132 x HP 34 x High Performance (HP) und 96 x High Density PL I/Os (3 banks)
    • ETH
    • USB
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers4 GTR (for USB3, SATA, PCIe, DP)
      Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 14 x PS MIOs
      • MIO for UART
      • thereof 6 MIO for SD card interface (default configuration)
      • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V main input
    • 3.3V controller input
    • Variable bank I/O power input
    • All power supplies on board
  • Dimension
    • 4 x 5 cm
  • Power
    • All power regulators on board
  • Dimension
    • 40 x 50 mm
  • Note
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination
    • Rugged for shock and high vibration
    Notes
    • Rugged for shock and high vibration
    • Evenly spread supply pins for good signal integrity
    • Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)
  • Block Diagram
Page properties
hiddentrue
idComments

add drawIO object here.


Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


...