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Overview

The Trenz Electronic TEM0707 is an industrial-grade module TEB0707 is a carrier for 4 x 5 Trenz Electronic modules.

Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.

It provides three high speed and one low speed CRUVI extension connectors. For more information, please refer to the CRUVI B2B Connectors. The TEB0707 is integrated with an Intel MAX10 FPGA as system controller and is equipped with a Micro USB2.0 Socket with FTDI to JTAG/UART solution, RJ45 LAN Socket, USB A Socket, Micro SD Card Socket, User LEDs, Push Buttons and DIP Switches for controlling the SoM.

Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.

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Notes :

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Modules
    • ...4x5 Trenz Electronic modules
  • RAM/Storage
    • ...EEPROM (FTDI Configuration)
  • On Board
      • ...
    • Interface
      • ...
    • Power
      • ...
    • Dimension
      • ...
    • Notes
      • ...

    Block Diagram

      • Intel Max 10 FPGA
      • FTDI FT2223
      • 6x User LEDs (3x green, 3x red)
      • 2x Status LED
      • DIP Switch
      • Push Buttons
    • Interface
      • Gigabit RJ45 LAN socket
      • SD Card socket
      • Micro USB2.0 Socket
      • USB A Socket
      • 3x High Speed CRUVI B2B Connectors
      • 1x Low Speed CRUVI B2B Connector
      • 4x Jumpers
    • Power
      • 5V Input Power Supply 
    • Dimension
      • 135 x 68 mm
    • Notes


    Block Diagram

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    add drawIO object here.

    Note

    For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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    titleTEB0707 block diagram


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    Main Components

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    Notes :

    • Picture of the PCB (top and bottom side) with labels of important components
    • Add List below


    Note

    For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .

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    titleTEB0707 main components


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    2. ...
    3. ...

    Initial Delivery State


    1. Barrel Jack Power Supply, J1
    2. Voltage Regulator, U1
    3. Micro SD Card Socket, J8
    4. Micro USB2.0 Socket, J15
    5. FT2232H FTDI, U8
    6. USB A Socket, J9
    7. RJ45 LAN Socket, J2
    8. SDIO Port Expander, U4
    9. Jumpers, J4...7
    10. Push Button (Reset), S2
    11. DIP Switch, S1
    12. B2B Connector, JB3
    13. B2B Connector, JB2
    14. B2B Connector, JB1
    15. Intel MAX 10 FPGA, U6
    16. High Speed CRUVI Connector, J10
    17. High Speed CRUVI Connector, J11
    18. High Speed CRUVI Connector, J12
    19. Low Speed CRUVI Connector, J13
    20. User Push Button, S3
    21. Pin header, J3

    Initial Delivery State

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    Notes :

    Only components like EEPROM,

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    Notes :

    Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

    If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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    Quad SPI Flash

    Storage device name

    Content

    Notes

    EEPROMSystem Controller CPLDProgrammed

    FTDI Configuration


    Configuration Signals

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    • Overview of Boot Mode, Reset, Enables.

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    MODE Signal State

    Boot Mode

    MODE

    Boot Mode:

    • SD Card (Low)
    • QSPI (High)
    PROGMODE

    Programming Mode:

    • select between CPLD (low, closed, on)
    • on SoM or FPGA/SoC (high, open, off )



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    Signal

    B2B
    Connected toI/ONote

    Reset

    Push Button, S2OutModule Reset signal


    Signals, Interfaces and Pins

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    Notes :

    • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
      • SD
      • USB
      • ETH
      • FMC
      • ...
    • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
      • JTAG
      • UART
      • I2C
      • MGT
      • ...

    Board to Board (B2B)

    ...

    Interfaces and Number FPGA bank number and number of I/O signals connected to the B2B connector:connectors for Trenz 4x5 modules:

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    FPGA Bank
    B2B ConnectorInterfaceI/O Signal Count
    Voltage Level
    Connected toNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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JTAG Signal

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B2B Connector

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JB1


Ethernet LAN4x Diff pairsRJ45 Socket, J2
SD  Card6 x Single EndedIO Expander, U4
I/Os20x Single EndedMAX10 FPGA Bank 6, U6
CRUVI

12x Diff pairs/24x Single ended

4x Single Ended

High Speed CRUVI, J12CRUVI C
SoM Control Signals5x Single EndedMAX10 FPGA, U6
I/Os8x Single endedMAX10 FPGA Bank 8, U6
JB2

CRUVI

12x Diff pairs/24x Single ended

4x Single Ended

High Speed CRUVI, J10CRUVI A
CRUVI6x Diff pairs/12x Single endedHigh Speed CRUVI, J11CRUVI B
JTAG4x Single EndedFPGA Bank 5, U6
JB3CRUVI

6x Diff pairs/12x Single ended

4x Single Ended

High Speed CRUVI, J11CRUVI B
USB 

1x Diff pair,

2x Single Ended

USB A, J9


CRUVI B2B Connectors

The TEMB0707 is equipped with a Low Speed Connectors J 13 and three High Speed Connector J10...12. These connectors are provided for CRUVI extension cards. More information is provided in the  B2B Connectors section.

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MIO Pins

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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SpeedDesignatorsSchematic
MIO Pin
Connected to
B2B
Notes

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

High



CRUVI C, J12A0...A5 (N/P)B2B, JB1
B0...B5 (N/P)B2B, JB1
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCKMAX10 FPGA Bank 8, U63.3V User IOs (Max10 Firmware dependent)
HSIO, HI, HO, RESET B2B, JB1
High


CRUVI B, J11A0...A5 (N/P)B2B, JB1
B0...B5 (N/P)B2B, JB1
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCKMAX10 FPGA Bank 2/3, U63.3V User IOs (Max10 Firmware dependent)
HSIO, HSI, HSO, RESET B2B, JB3
High



CRUVI A, J13



A0...A5 (N/P)B2B, JB2
B0...B5 (N/P)B2B, JB2

MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK

MAX10 FPGA Bank 2/3, U63.3V User IOs (Max10 Firmware dependent)
HSIO, HSI, HSO, RESET B2B, JB2
LowCRUVIX0...X7MAX10 FPGA Bank 1A, U6



JTAG Interface

JTAG signals form FTDI U8  are routed to MAX10 CPLD. Via dip setting JTAG of MAX10 or JTAG of the connected Trenz 4x5 module can be selected. Forwarding signals to SoM is MAX10 Firmware dependent.

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On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

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titleOn board peripheralsJTAG pins connection

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Chip/InterfaceDesignatorNotes

Quad SPI Flash Memory

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JTAG Signal

MAX10 Pin Bank 1B, U6

Connected to

TMSG1FTDI (U8) - ADBUS3
TDIF5FTDI (U8) - ADBUS1
TDOF6FTDI (U8) - ADBUS2
TCKG2

FTDI (U8) - ADBUS0

JTAGENE5Dip S1-4


JTAG access to the Trenz 4x5 module is through B2B connector JB2.

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MIO PinSchematicU?? PinNotes

...

JTAG Signal

MAX10 Pin Bank5, U6

B2B Connector

M_TMSL12JB2-94
M_TDIL13JB2-96
M_TDOJ10JB2-100
M_TCKH8

JB2-98

VCCJTAGJ11, J12JB2-92


SD Card socket

The TEB0707 is equipped with an Micro SD Card slot, J8. For levelshifting an IO Expander (U4) is used.

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MIO PinSchematicU? PinNotes
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titleI2C Address for RTCUSB2.0 Socket information

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MIO Pin
Pin 
I2C Address
Schematic
Designator
Connected toNotes

...

DAT0...3ESD_DAT0...3B2B, JB1Through IO Expander, U4
CMDESD_CMDB2B, JB1Through IO Expander, U4
VDD3.3V_SDB2B, JB1Through IO Expander, U4
CLKESD_CLKB2B, JB1Through IO Expander, U4
DLTSD_CDFPGA Bank 3, U6Card detect.


Micro USB2.0 Socket

There is a micro USB2.0 Socket, J15 provided in order to communicate with the FTDI, U8.

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MIO PinSchematicU?? PinNotes
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titleI2C address for EEPROMMicro USB2.0 Socket information

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MIO Pin
Pin 
I2C Address
Schematic
Designator
Connected toNotes

...

D+O2-D_PB2B, JB3Through Line Filter, L4
D-O2-D_NB2B, JB3Through Line Filter, L4
VbusVBUSB2B, JB3


 USB A Socket

The SoM USB 2.0 signals are routed to a USB A socket (host).

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Designator
Pin 
Color
SchematicConnected to
Active LevelNote

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

Notes
Data+O2-D_PB2B, JB3Through Line Filter, L1
Data-O2-D_NB2B, JB3Through Line Filter, L1
VCCUSB_VBUSB2B, JB3


RJ45 LAN Socket

There is a RJ45 Ethernet LAN MagJack, J2 connected to B2B, JB1.

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Pin SchematicConnected toNotes
2PHY_MDI0_PB2B, JB1
3PHY_MDI0_NB2B, JB1
4PHY_MDI1_PB2B, JB1
5PHY_MDI1_NB2B, JB1
6PHY_MDI2_PB2B, JB1
7PHY_MDI2_NB2B, JB1
8PHY_MDI3_PB2B, JB1
9PHY_MDI3_NB2B, JB1
VCCETH-VCCB2B, JB1
Green LEDETH1_LED0Intel MAX 10, U6MAX10 Firmware dependent
Yellow LEDETH1_LED1Intel MAX 10, U6MAX10 Firmware dependent


Jumpers

There are three Jumpers provided to choose the CRUVI Extension power voltage.

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DesignatorSchematicConnected toNotes
J14VCCIO_CCB2B, JB2CRUVI C
J16VCCIO_CBB2B, JB2CRUVI B
J17VCCIO_CAB2B, JB2CRUVI A


Pin Header

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DesignatorSchematicConnected toNotes
J3VBATB2B, JB1


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



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Test PointSignalConnected toNotes
TP13.3VRegulator, U1
TP2VINVoltage Protection, U2
TP4IOVRegulator, U3
TP53.3VPower Switch, Q1
TP6C5VINPower Switch, Q2


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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Chip/InterfaceDesignatorNotes
Intel MAX 10U6
FTDIU8
105698015U10FTDI, programmed with Xilinx licence
OscillatorU7
105698015D1...8
DIP SwitchS1
Push ButtonsS2, S3


Intel Max10 CPLD

The TEB0707 is quipped with an Intel Max10 as CPLD used for levelshifting of 3.3V signals on CRUVI connectors, JTAG/UART forward to modules, Module control pis, power sequencing and IO voltage selection along with providing User Push buttons, LEDs and switches. For complete information, please see the TEB0707 MAX10 CPLD.

FTDI FT2232H

The FTDI chip (U8) converts signals from USB2 to variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip which is used in  Multi-Protocol Synchronous Serial Engine (MPPSE) mode for JTAG. 

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U10.

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PinSchematicConnected toNotes
ADBUS0TCKFPGA Bank 1B, U6JTAG interface
ADBUS1TDIFPGA Bank 1B, U6
ADBUS2TDOFPGA Bank 1B, U6
ADBUS3TMS

FPGA Bank 1B, U6

BDBUS0F_UART_TXFPGA Bank 1B, U6UART Transmitter output
BDBUS1F_UART_RXFPGA Bank 1B, U6UART Receiver Input
OSCIOSCIOscillator, U7Clock 12 MHz
EECSEECSEEPROM, U10EEPROM Contains FTDI configuration
EECLKEECLKEEPROM, U10
EEDATAEEDATAEEPROM, U10
DM/DPFD_N/ FD_PMicro USB, J15USB to UART
nRESET3.3V3.3V


LEDs

The functions of the LEDs are MAX10 Firmware dependent. See TEB0707 MAX10 CPLD LEDs.

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DesignatorColorSchematicConnected toActive LevelNote
D1greenLED3FPGA Bank 8Active High
D2greenLED5FPGA Bank 8Active High
D3greenLED7FPGA Bank 8Active High
D4redLED4FPGA Bank 3Active High
D5redLED6FPGA Bank 2Active High
D6redLED8FPGA Bank 8Active High
D7redLED2FPGA Bank 3Active High
D8greenLED1FPGA Bank 3Active High


EEPROM

The EEPROM IC, U8 contains the FTDI configuration and is prprogrammed with Xilinx JTAG licence.

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PinSchematicConnected toNotes
CSEECSFTDI, U8
CLKEECLKFTDI, U8
DINEEDATAFTDI, U8


DIP Switch

There is a DIP Switch provided for user controlling of settings. Dip1..3 are connected to MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 Dips.

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titleEthernet PHY to Zynq SoC DIP Switch connections

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U?? Pin Signal NameConnected toSignal DescriptionNote

CAN Transceiver

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titleCAN Tranciever interface MIOs

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PinSchematicFunction (in standard Firmware)Notes
DIP1DIP1Forwarded to IO so SoM

MAX10 firmware dependent.

DIP2DIP2IO Voltage selection1.8V ('high', open, OFF), 2.5V ('low', closed, ON)
DIP3DIP3 (PROGMODE)Programming mode (JTAG selection on Trenz 4x5 module)Select between FPGA/SoC (high, open, OFF ) or CPLD (low, closed, ON), MAX10 firmware dependent.
DIP4JTAGENJTAG SelectionJTAG mode between CPLD (high, closed, ON) or SoM (low, open, OFF)


Push Buttons

Buttons are connected MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 CPLD Buttons

...

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Designator
DescriptionFrequencyNoteMHzMHzKHz

Programmable Clock Generator

SchematicFunction (in standard Firmware)Notes
S2RESETSoM ResetHardware debounced.
S3BUTTON1User Buttondebounced in Max10 FPGA


Clock Sources

MEMS U7 Oscillator is nedded for FTDI. It is  additionally connectd to MAX 10 FPGA Bank 2 Pin H4 and can be used in custom FirmwareThere is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??.  The I2C Address is 0x??.

OUT8/OUT9
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titleProgrammable Clock Generator Inputs and OutputsOsillators

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DesignatorDescriptionFrequencyNote
U7MEMS Oscillator12 MHz
U?? Pin
SignalConnected toDirectionNote

IN0

IN1IN2IN3

XAXB

SCLKSDAOUT0OUT1OUT2OUT3OUT4OUT5OUT6OUT7