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The Trenz Electronic TEMB0005 is an industrial-grade carrier equipped with FMC...a carrier for the module TEM00005. The carrier is equipped with a LAN socket, a FTDI JTAG/UART to USB2.0 solution, three low speed and one high speed CRUVI B2B Connectors, a PMod Connector.

Refer to http://trenz.org/temb0005-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • ...TEM0005
  • RAM/Storage
    • ...2KB EEPROM
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...
    • FT2232H FTDI
    • 4x User LEDs
    • 2x Push Buttons
    • 2x MEMS Oscillators
  • Interface
    • 1x Samtec Razor Beam (SS5) B2B Connector
    • 1x Samtec Razor Beam (SS4) High Speed CRUVI Connector
    • 3x Samtec Low Speed CRUVI Connectors
    • 1x PMod SMD (2x6) Connector
    • 1x SMD Header (1x6)
    • 1x RJ45 LAN Socket
    • 1x Micro USB2.0 Connector
  • Power
    • 5V Input Power Supply 
  • Dimension
    • 115 x 70 mm
  • Notes


Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTEMB0005 block diagram


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Main Components

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titleTEMB0005 main components


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  1. SMD Header 6x1, J3
  2. RJ45 LAN Socket, J1
  3. B2B Razor Beam Connector, J11
  4. Barrel Jack, J4
  5. Green LEDs, D1...4
  6. User Push Button, S2
  7. PMod 2x6 SMD Host Socket, J9
  8. FT2232H FTDI, U1
  9. Reset Push Button, S1
  10. Micro USB2.0 Socket, J2
  11. Red LED (PG_DCDC), D8
  12. Green LED (5VIN), D5
  13. B2B Mezzanine ConnectorHigh Speed CRUVI Connectors, J5
  14. Dual Wipe SocketLow Speed CRUVI Connectors, J8Dual Wipe Socket
  15. Low Speed CRUVI Connectors, J7
  16. Dual Wipe SocketLow Speed CRUVI Connectors, J6

Initial Delivery State

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titleInitial delivery state of programmable devices on the module

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System Controller CPLD

Storage device name

Content

Notes

Quad SPI FlashEEPROMEEPROMProgrammedFTDI Confirguration


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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titleBoot Reset process.

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MODE

Signal

State

Boot Mode
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Signal

B2BI/ONote

Signals, Interfaces and Pins

B2BConnected toNote
M_RESETJ11- 11Push Button, S1Module Reset
EN_VADJJ11-110DCDC, U6pull-down, input from module
SEL_VADJJ11-108DCDC, U6

pull-up, input from module.
'low' → 1.8V,
'high'→ 2.5V


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:The carrier TEMB0005 is equipped with a Samtec (SS4) B2B Connector. More information in the following table.

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titleGeneral PL I/O to B2B connectors information

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FPGA Bank
Designators
B2B Connector
InterfaceI/O Signal Count
Voltage Level
Connected toNotes
J11






JTAG

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JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection

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JTAG Signal

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B2B Connector

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MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

4x Single EndedFTDI, U1
MSIOD24x Single Ended, 12x Differential PairsCRUVI B2B, J5A0...5, B0...5 (N/P)
MSIO/GPIO8x Single EndedCRUVI B2B, J6A_X0...7
MSIO8x Single EndedCRUVI B2B, J7B_X0...7
MSIO/GPIO8x Single EndedCRUVI B2B, J8C_X0...7
LEDs (2x MSIO, 2x MSIO/GPIO)4x Single EndedD1...4LED1...4
MSIO8x Single EndedPmod Header, J9
Push Button1x Single EndedPush Button, S1M_RESET
Push Button1x Single EndedPush Button, S2pull-up, User Button
MSIO/GPIO/I2C2x Single EndedCRUVI B2B J6I2C
ETH

2x Differential Pairs

2x Single Ended

RJ45 Socket, J1

RJ45 LEDs, J1


Yellow and Green LEDs

UART2x Single EndedFTDI, U1UART RX/TX
FTDI I/O2x Single EndedFTDI, U1BDBUS2-BDBUS3
CLK

1x Single Ended

Oscillator, U8

30 MHz

MSIOD

4x Single Ended

CRUVI B2B, J5

RESET, HSIO, HSO, HSI

IO (3x MSIO, 4x MSIO/GPIO, 2x MSIO GPIO/I2C)9x Single EndedCRUVI B2B, J5
Power Signal1x Single Ended

RED LED, D8


PG_DCDC
SC_SPI4x Single Endedpin header, J3SC_CLK, SC_SDO, SC_SDI, SC_SS
GOLDEN1x Single EndedTestpoint, TP1GOLDEN
JTAGSEL1x Single EndedTestpoint, TP2JTAGSEL


CRUVI B2B Connectors

The TEMB0005 is equipped with three Low Speed Connectors J6...8 and a High Speed Connector J5. These connectors are provided for CRUVI extension cards. More information is provided in the  B2B Connectors section.

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titleCRUVI B2B connectors information

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SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

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titleMIOs pins

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Test Points

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Signal
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Test PointSignalB2BNotes
10PWR_PL_OKJ2-120
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SpeedDesignatorsSchematic
Test Point
Connected toNotes

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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titleOn board peripherals
LowJ6A_X0...1B2B, J11alternative GPIO

A_X2...5B2B, J11alternative SPI

A_X6...7B2B, J11alternative I2C0 SDA/SCL
J7B_X0...7|B2B, J11
J8C_X0...7B2B, J11alternative GPIO
HighJ5A0...A5 (N/P)B2B, J11HS I/O
B0...B5 (N/P)B2B, J11HS I/O
HSIO, HI, HO, RESETB2B, J11HS I/O single ended

SMB_ALERT, SMB_SDA, SMB_SCL, MODE, REFCLK

B2B, J11
DI,DO,SCK,SELB2B, J11alternative GPIO


USB2.0 Socket

There is a USB2.0 Socket, J2 provided in order to use JTAG/UART via FTDI, U1.

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titleUSB2.0 Socket information

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Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

Scroll Title
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titleQuad SPI interface MIOs and pins

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MIO Pin
Pin Schematic
U?? Pin
Connected toNotes

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IDN.CN.C
D+DL_PFTDI, U1Through Line Filter, L1
D-DL_NFTDI, U1Through Line Filter, L1
VbusVBUSDiode, U2


RJ45 LAN Socket

There is a RJ45 Ethernet LAN Socket, J1 connected to B2B, J11 via 2x channels data receive and transmit.

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titleI2C interface MIOs and pins
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MIO PinSchematicU? PinNotes
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titleI2C Address for RTCRJ45 LAN Socket information

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MIO Pin
Pin 
I2C Address
Schematic
Designator
Connected toNotes

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titleI2C EEPROM interface MIOs and pins
TD+ETH1_TX_PB2B, J11
TD-ETH1_TX_NB2B, J11
RD+ETH1_RX_PB2B, J11
RD-ETH1_RX_NB2B, J11
Green LEDETH1_LED0B2B, J11Link/Activity indicator
Yellow LEDETH1_LED1B2B, J11Speed indicator


PMod Header

There is a PMod Header, J9 connected to the B2B, J11 and all signals are protected from invers polarity by two diodes D6, D7.

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Designator
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titleI2C address for EEPROMPMod Header information

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SchematicConnected to
MIO PinI2C Address
Notes

LEDs

PM0...3 (N/P)B2B, J11


Pin Header

There is a Pin Header 6x1, J3 provided for SPI signals. 

Scroll Title
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titlePin Header connections
Scroll Title
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titleOn-board LEDs

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Designator
Pin 
Color
SchematicConnected to
Active LevelNote

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

Notes
13.3VB2B, J11
2GNDB2B, J11
3SC_SDOB2B, J11
4SC_SDIB2B, J11
5SC_SSB2B, J11
6SC_CLKB2B, J11


UART 

There is an UART channel provided in order to communicate with the module and signals are accessible via B2B, J11 through the FTDI, U1.

Signal Name
scrollscroll-title
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titleEthernet PHY to Zynq SoC connectionsUART connection

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U1 PinSchematic
U?? Pin 
Connected toNotes
Signal DescriptionNote