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Note: Key Features' must be split into 6 main groups for modules and mainboards:
Key Features' must be split into 6 main groups for carrier:
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- Modules
- ...TE0820
- RAM/Storage
- eMMC
- Data width: 8Bit
- size: def.
- eMMC
- On Board
- ...
- 8GB *
- QSPI boot Flash in dual parallel mode (size depends on assembly version)
- Data width: 8bit
- size: def. 128MB *
- HyperRAM/Flash (optional, default not assembled)
- size:*
- MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
- On Board
- Intel Max 10
- FTDI FT2223
- 8x Green User LEDs
- Interface
- Gigabit RJ45 LAN socket
- SD Card socket
- ...
- Power
- ...
- Dimension
- ...
- Notes
- ...
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Main Components
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Overview
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