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The Trenz Electronic TEM0707 is an industrial-grade module for 4 x 5 Trenz Electronic modules. The TEB0707 is integrated with an Intel MAX10 FPGA and it is equipped with a Micro USB2.0 Socket, RJ45 LAN Socket, Micro USB A Socket, Micro SD Card Socket, Low and High Speed Board to Board Connectors, User LEDs, FTDI,  Push Buttons and DIP Switch for controlling the SoM. 

Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Modules
    • TE0820
  • RAM/Storage
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48(FTDI Configuration)
  • On Board
    • Intel Max 10 FPGA
    • FTDI FT2223
    • 8x Green User LEDs
    • DIP Switch
    • Push Buttons
  • Interface
    • Gigabit RJ45 LAN socket
    • SD Card socket
    • Micro USB2.0 Socket
    • Miceo USB A Socket
    • 6x High Speed B2B Connectors,
    • 1x Low Speed B2B Connector
    • 4x Jumpers
  • Power
    • 5V Input Power Supply 
  • Dimension
    • 135 x 68 mm
  • Notes

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JTAG Interface

JTAG access to the TExxxx attached SoM through B2B connector JMXJB2. The JTAG Enable is connected to VCC and after power on it will be enable.

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JTAG Signal

B2B Connector

M_TMSJB2-94
M_TDIJB2-96
M_TDOTCKJB2-100
JTAGM_EN

MIO Pins

TCK

JB2-98

VCCJTAGJB2-92


There is an Intel MAX10 provided on TEB0707 as CPLD and JTAG access to the Intel MAX10 SoC is provided through the FTDI U8.

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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MIO PinConnected toB2B
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JTAG Signal

Connected to

M_TMSFTDI (U8) - ADBUS3
M_TDIFTDI (U8) - ADBUS1
M_TDOFTDI (U8) - ADBUS2
M_TCK

FTDI (U8) - ADBUS0


Micro USB2.0


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120


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Test PointSignalConnected toNotes
TP13.3VRegulator, U1
TP2VINVoltage Protection, U2
TP4IOVRegulator, U3
TP53.3VPower Switch, Q1
TP6C5VINPower Switch, Q2


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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