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Template Revision 2.12

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"


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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
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        Scroll Ignore

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        Scroll Only

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        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



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-----------------------------------------------------------------------


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Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.


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Table of Contents

Table of Contents

Overview

The Trenz Electronic TEM0707 is an industrial-grade module for 4 x 5 Trenz Electronic modules. The TEB0707 is integrated with an Intel MAX10 FPGA and it is equipped with a Micro USB2.0 Socket, RJ45 LAN Socket, Micro USB A Socket, Micro SD Card Socket, Low and High Speed Board to Board Connectors, User LEDs, FTDI,  Push Buttons and DIP Switch for controlling the SoM. Furtheremore, the TEB0707 provides CRUVI Extension connectors. For more information, Please refer to the CRUVI B2B Connectors.

Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Modules
    • 4x5 Trenz Electronic modules
  • RAM/Storage
    • EEPROM (FTDI Configuration)
  • On Board
    • Intel Max 10 FPGA
    • FTDI FT2223
    • 8x Green User LEDs
    • DIP Switch
    • Push Buttons
  • Interface
    • Gigabit RJ45 LAN socket
    • SD Card socket
    • Micro USB2.0 Socket
    • USB A Socket
    • 3x High Speed CRUVI B2B Connectors
    • 1x Low Speed CRUVI B2B Connector
    • 4x Jumpers
  • Power
    • 5V Input Power Supply 
  • Dimension
    • 135 x 68 mm
  • Notes


Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .



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titleTEB0707 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .

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titleTEB0707 main components


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  1. Barrel Jack Power Supply, J1
  2. Voltage Regulator, U1
  3. Micro SD Card Socket, J8
  4. Micro USB2.0 Socket, J15
  5. FT2232H FTDI, U8
  6. USB A Socket, J9
  7. RJ45 LAN Socket, J2
  8. SDIO Port Expander, U4
  9. Jumpers, J4...7
  10. Push Button (Reset), S2
  11. DIP Switch, S1
  12. B2B Connector, JB3
  13. B2B Connector, JB2
  14. B2B Connector, JB1
  15. Intel MAX 10 FPGA, U6
  16. High speed CRUVI Connector, J10
  17. High speed CRUVI Connector, J11
  18. High speed CRUVI Connector, J12
  19. Low Speed CRUVI Connector, J13
  20. User Push Button, S3
  21. Jumper, J3

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

EEPROMProgrammed

FTDI Configuration


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.


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titleBoot process.

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MODE Signal State

Boot Mode

MODE

SoM Mode control pin (depnds on SoM)

PROGMODE
  • select between CPLD (low, closed, on)
  • on SoM or FPGA/SoC (high, open, off )




Scroll Title
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titleReset process.

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Signal

B2BI/ONote

RESIN

JB2- 17OutSoM Module


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B)

Interfaces and Number of I/O signals connected to the B2B connectors:

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B2B ConnectorInterfaceI/O Signal CountConnected toNotes
JB1


Ethernet LAN8x Single ended, 4x Diff pairsRJ45 Socket, J2
SD  Card6 x Single EndedIO Expander, U4
I/Os20x Single EndedFPGA BAnk 6, U6
CRUVI

20x Single ended, 10x Diff pairs

4x Single Ended

High Speed CRUVI, J12CRUVI C
Control Signals5x Single EndedFPGA, U6
I/Os8x Single endedFPGA Bank 8, U6
JB2CRUVI

8x Single ended, 4x Diff pairs

4x Single Ended

High Speed CRUVI, J10CRUVI A

CRUVI12x Single ended, 6x Diff pairsHigh Speed CRUVI, J11CRUVI B

JTAG4x Single EndedFPGA Bank 5, U6
JB3CRUVI

12x Single ended, 6x Diff pairs

4x Single Ended

High Speed CRUVI, J11CRUVI B

USB 4x Single EndedUSB A, J9


CRUVI B2B Connectors

The TEMB0707 is equipped with a Low Speed Connectors J 13 and three High Speed Connector J10...12. These connectors are provided for CRUVI extension cards. More information is provided in the  B2B Connectors section.

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SpeedDesignatorsSchematicConnected toNotes
HighJ12VCCIO_CCB2B, J11GPIO
CC_SMBB2B, J11SC SPI



























J11A_X6...7B2B, J11I2C0 SDA/SCL
B_X0...7|B2B, J11GPIO



J10C_X0...7B2B, J11GPIO






LowJ13A0...A5 (N/P)B2B, J11
B0...B5 (N/P)B2B, J11
MODEB2B, J11
RESETB2B, J11

SMB_ALERT

SMB_SDA

SMB_SCL

B2B, J11
DI,DO,SCK,SELB2B, J11SPI
HSIO, HI, HOB2B, J11



JTAG Interface

JTAG access to the attached SoM through B2B connector JB2. The JTAG Enable is connected to VCC and after power on it will be enable.

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titleJTAG pins connection

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JTAG Signal

B2B Connector

M_TMSJB2-94
M_TDIJB2-96
M_TDOJB2-100
M_TCK

JB2-98

VCCJTAGJB2-92


There is an Intel MAX10 provided on TEB0707 as CPLD and JTAG access to the Intel MAX10 SoC is provided through the FTDI U8.

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JTAG Signal

Connected to

M_TMSFTDI (U8) - ADBUS3
M_TDIFTDI (U8) - ADBUS1
M_TDOFTDI (U8) - ADBUS2
M_TCK

FTDI (U8) - ADBUS0


SD Card Reader

The TEB0707 is equipped with an Micro SD Card reader, J8. Data for USBs are expanded through an IO Expander (U4).

Scroll Title
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titleUSB2.0 Socket information

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Pin SchematicConnected toNotes
DAT0...3ESD_DAT0...3B2B, JB1Through IO Expander, U4
CMDESD_CMDB2B, JB1Through IO Expander, U4
VDD3.3V_SDB2B, JB1Through IO Expander, U4
CLKESD_CLKB2B, JB1Through IO Expander, U4
DLTSD_CDFPGA Bank 3, U6


Micro USB2.0 Socket

There is a USB2.0 Socket, J15 provided in order to communicate with the FTDI, U8. Data signals from USB2.0 are passed through a Line Filter L4 and a Diode U9 in order to be protected against inverse polarity connection.

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titleUSB2.0 Socket information

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Pin SchematicConnected toNotes
VbusVBUSB2B, JB3
D+O2-D_PB2B, JB3Through Line Filter, L4
D-O2-D_NB2B, JB3Through Line Filter, L4


 USB A Socket

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titleUSB2.0 Socket information

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Pin SchematicConnected toNotes
VCCUSB_VBUSB2B, JB3
Data+O2-D_PB2B, JB3Through Line Filter, L1
Data-O2-D_NB2B, JB3Through Line Filter, L1


RJ45 LAN Socket

There is a RJ45 Ethernet LAN Socket, J2 connected to B2B, JB1 via 4x channels data receive and transmit.

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titleRJ45 LAN Socket information

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Pin SchematicConnected toNotes
2PHY_MDI0_PB2B, JB1
3PHY_MDI0_NB2B, JB1
4PHY_MDI1_PB2B, JB1
5PHY_MDI1_NB2B, JB1
6PHY_MDI2_PB2B, JB1
7PHY_MDI2_NB2B, JB1
8PHY_MDI3_PB2B, JB1
9PHY_MDI3_NB2B, JB1
VCCETH-VCCB2B, JB1
Green LEDETH1_LED0Intel MAX 10, U6Link/Activity indicator
Yellow LEDETH1_LED1Intel MAX 10, U6Speed indicator


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



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titleTest Points Information

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Test PointSignalConnected toNotes
TP13.3VRegulator, U1
TP2VINVoltage Protection, U2
TP4IOVRegulator, U3
TP53.3VPower Switch, Q1
TP6C5VINPower Switch, Q2


Jumpers

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titleUSB2.0 Socket information

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DesignatorSchematicConnected toNotes
J14VCCIO_CCB2B, JB2
J16VCCIO_CBB2B, JB2Through Line Filter, L1
J17VCCIO_CAB2B, JB2Through Line Filter, L1


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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titleOn board peripherals

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Chip/InterfaceDesignatorNotes
Intel MAX 10U6
FTDIU8
SDIO ExpanderU4
EEPROMU10
OscillatorU7
LEDsD1...8


LEDs

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titleOn-board LEDs

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DesignatorColorSchematicConnected toActive LevelNote
D2GreenLED3FPGA Bank 3Active High
D3GreenLED5FPGA Bank 3Active High
D4GreenLED7FPGA Bank 3Active High
D5GreenLED4FPGA Bank 8Active High
D6GreenLED6FPGA Bank 2Active High
D7GreenLED8FPGA Bank 8Active High
D8GreenLED2FPGA Bank 8Active High
D9GreenLED1FPGA Bank 8Active High


EEPROM

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titleI2C EEPROM interface MIOs and pins

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PinSchematicConnected toNotes
CSEECSFTDI, U8
CLKEECLKFTDI, U8
DINEEDATAFTDI, U8



Scroll Title
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titleI2C address for EEPROM

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I2C AddressDesignatorNotes
A0U10


Clock Sources

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titleOsillators

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DesignatorDescriptionFrequencyNote
U7MEMS Oschilator12 MHz


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

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titlePower Consumption

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Power Input PinTypical Current
VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

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titlePower Sequency


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Voltage Monitor Circuit

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titleVoltage Monitor Circuit


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Power Rails

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titleModule power rails.

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

























Bank Voltages

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titleZynq SoC bank voltages.

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Bank          

Schematic Name

Voltage

Notes






























Board to Board Connectors

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    PD:6 x 6 SoM LSHM B2B Connectors
    PD:6 x 6 SoM LSHM B2B Connectors

Include Page
PD:4 x 5 SoM LSHM B2B Connectors
PD:4 x 5 SoM LSHM B2B Connectors

Technical Specifications

Absolute Maximum Ratings

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titlePS absolute maximum ratings

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SymbolsDescriptionMinMaxUnit




V






Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document



VSee ???? datasheets.



°CSee Xilinx ???? datasheet.


Physical Dimensions

  • Module size: 135 mm × 68 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 4 mm.

PCB thickness: 1.7 mm.

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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titlePhysical Dimension


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Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

    DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


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titleTrenz Electronic Shop Overview

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Trenz shop TEB0707 overview page
English pageGerman page


Revision History

Hardware Revision History

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idComments

Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD


Scroll Title
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titleHardware Revision History

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DateRevisionChangesDocumentation Link
2020-04-01REV01Initial Release


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Scroll Title
anchorFigure_RV_HRN
titleBoard hardware revision number.


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Scroll Only


Document Change History

Page properties
hiddentrue
idComments
  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


Scroll Title
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titleDocument change history.

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DateRevisionContributorDescription

Page info
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dateFormatyyyy-MM-dd
typeFlat

Page info
infoTypeCurrent version
prefixv.
typeFlat
showVersionsfalse

Page info
infoTypeModified by
typeFlat
showVersionsfalse

  • change list

--

all

Page info
infoTypeModified users
typeFlat
showVersionsfalse

  • --


Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices


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