The Trenz Electronic TE0xxx-xx ... is an industrial-grade ... module ... based on Xilinx ...CR00040-01 is an CRUVI peripheral module with multiple sensors
Refer to http://trenz.org/tec0850cr00040-info for the current online version of this manual and other available documentation.
...
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Note: 'description: Important components and connector or other Features of the module → please sort and indicate assembly options
Key Features' must be split into 6 main groups for modules and mainboards:
SoC/FPGA
Package: SFVC784
Device: ZU2...ZU5*
Engine: CG, EG, EV*
Speed: -1LI, -2LE,*, **
Temperature: I, E,*, **
RAM/Storage
Low Power DDR4 on PS
Data width: 32bit
Size: def. 2GB*
Speed:***
eMMC
Data width: 8Bit
size: def. 8GB *
QSPI boot Flash in dual parallel mode (size depends on assembly version)
Data width: 8bit
size: def. 128MB *
HyperRAM/Flash (optional, default not assembled)
size:*
MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
Interface
132 x HP PL I/Os (3 banks)
ETH
USB
4 GTR (for USB3, Sata, PCIe, DP)
MIO for UART
MIO for SD
MIO for PJTAG
JTAG
Ctrl
Power
3.3V-5V Main Input
3.3V Controller Input
Variable Bank IO Power Input
Dimension
4 cm x 5 cm
Notes
* depends on assembly version
** also non low power assembly options possible
*** depends on used U+ Zynq and DDR4 combination
Key Features' must be split into 6 main groups for carrier:
Modules
TE0808, TE807, TE0803,...
RAM/Storage
E.g. SDRAM, SPI
On Board
E.g. CPLD, PLL
Interface
E.g. ETH, USB, B2B, Display port
Power
E.g. Input supply voltage
Dimension
Excerpt
<Replace for module use "SoC/FPGA" for Carrier "Modules">
...
RAM/Storage
...
On Board
...
Interface
...
Power
...
Dimension
...
Notes
...
EEPROM/Unique Identifier
24AA025E48
CO2 Sensor (temperatur/humidity)
SCD40 or SCD41 or none (depending on assembly variant)
Air Pressure Sensor
LPS22HB
Ambient Light Sensor
TSL25403M
On-board
RGB LED
Buzzer
Power
3.3V
Dimension
32 x 18 mm
Block Diagram
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For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .
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TExxxx CR00040 block diagram
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Main Components
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Notes :
Picture of the PCB (top and bottom side) with labels of important components
Add List below
Note
For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .
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TExxxx CR00040 main components
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...
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Initial Delivery State
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CO2 Sensor (not fitted on CR00040-XX-0)
Air Pressure Sensor
Ambient Light Sensor
EEPROM
RGB LED
Buzzer
Pin Headers (not fitted)
CRUVI Low Speed Connector
Initial Delivery State
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Notes :
Only components like EEPROM, QSPI flash can be initialized by default at manufacture.
If there is no components which might have initial data ( possible on carrier) you must keep the table empty
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Initial delivery state of programmable devices on the module
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Storage device name
Content
Notes
Quad SPI Flash
EEPROM
System Controller CPLD
...
EEPROM
EUI-48 Node Identity
at offset 0xFA, 6 bytes
Signals, Interfaces and Pins
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Overview of Boot Mode, Reset, Enables.
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Table_OV_CNTRL
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Controller signal.
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Name
Connector Pin
Direction
Description
Boot Mode
J1-2
input
high- SD low -QSPI
Enable
J1-3
input
..
Reset
JTAGSEL
PGOOD
...
Signals, Interfaces and Pins
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Notes :
For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
SD
USB
ETH
FMC
...
For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
JTAG
UART
I2C
MGT
...
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
...
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Table_SIP_B2B
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General PL I/O to B2B connectors information
Notes :
For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
SD
USB
ETH
FMC
...
For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
JTAG
UART
I2C
MGT
...
Module I/Os
Module signals connected to the B2B connector:
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General PL I/O to B2B connectors information
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B2B Connector
I/O Signal Count
Voltage Level
Notes
J1
8
VCC (3.3V)
J2
4
parallel to J1
J3
4
parallel to J1
J1 is the main CRUVI connector and should be used to connect the CR00040 to any CRUVI baseboard with CRUVI LS connector fitter. J2 and J2 are un-populated 100 mil pin-headers that allow solder-in pin-headers to use the CR00040 with solder-less breadboards or fly-wires.
On-board Peripherals
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Notes :
add subsection for every component which is important for design, for example:
Two 100 Mbit Ethernet Transciever PHY
USB PHY
Programmable Clock Generator
Oscillators
eMMCs
RTC
FTDI
...
DIP-Switches
Buttons
LEDs
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In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection
...
JTAG access to the TExxxx SoM through B2B connector JMX.
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JTAG pins connectionOn board peripherals
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JTAG Signal
B2B Connector
TMS
TDI
TDO
TCK
JTAG_EN
MIO Pins
Chip/Interface
Designator
Notes
EEPROM
U1
CO2 Sensor
U2
Ambient Light Sensor
U3
Pressure Sensor
U4
RGB LED
D2
Buzzer
LS1
Air Pressure Sensor
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Air Pressure Sensor interface
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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
Example:
MIO Pin
Connected to
B2B
Notes
MIO12...14
SPI_CS , SPI_DQ0... SPI_DQ3
SPI_SCK
J2
QSPI
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Table_SIP_MIOs
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MIOs pins
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MIO
J1 Pin
Connected to
Schematic
B2B
U4 Pin
Notes
...
2
details
SCL
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SDA
Comments
you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.
Example:
Test Point
Signal
B2B
Notes
10
PWR_PL_OK
J2-120
4
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I2C address for Air Pressure Sensor
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I2C Address
Designator
Notes
1011_101x
U4
Ambient Light Sensor
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Table_OBP_ALS
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Ambient Light Sensor interface pins
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Table_SIP_TPs
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Test Points Information
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Test Point
J1 Pin
Signal
Schematic
Connected to
U3 Pin
Notes
On-board Peripherals
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Notes :
add subsection for every component which is important for design, for example:
Two 100 Mbit Ethernet Transciever PHY
USB PHY
Programmable Clock Generator
Oscillators
eMMCs
RTC
FTDI
...
DIP-Switches
Buttons
LEDs
...
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Notes :
...
2
SCL
3
1
SDA
4
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I2C address for Ambient Light Sensor
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I2C Address
Designator
Notes
0111_001x
U3
CO2 Sensor
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Table_OBP_EEP
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On board peripheralsI2C EEPROM interface pins
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J1 Pin
Schematic
U2 Pin
Chip/Interface
Designator
Notes
Quad SPI Flash Memory
2
SCL
9
1
SDA
10
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Notes :
Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.
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Table_OBP_I2C_SPIEEPROM
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Quad SPI interface MIOs and pinsI2C address for EEPROM
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MIO Pin
Schematic
U?? Pin
Notes
...
I2C Address
Designator
Notes
1100_010x
U2
EEPROM
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Table_OBP_RTCEEP
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I2C EEPROM interface MIOs and pinspins
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MIO
J1 Pin
Schematic
U? U1 Pin
Notes
2
SCL
1
1
SDA
3
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Table_OBP_I2C_RTCEEPROM
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I2C Address address for RTCEEPROM
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MIO Pin
I2C Address
Designator
Notes
...
1010_011x
U1
LEDs
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Table_OBP_EEPLED
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I2C EEPROM interface MIOs and pinsOn-board LEDs
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MIO Pin
Schematic
U?? Pin
Notes
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Table_OBP_I2C_EEPROM
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I2C address for EEPROM
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MIO Pin
I2C Address
Designator
Notes
LEDs
Designator
Color
Connected to
Active Level
Note
D2
Red
D0
Low
D2
Green
D1
Low
D2
Blue
D2
Low
Power and Power-On Sequence
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
Power on-sequence
Power distribution
Voltage monitoring circuit
Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
Power Supply
Power supply with minimum current capability of TBD A is recommended.
Power Consumption
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Power Consumption
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On-board LEDs
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Designator
Color
Connected to
Active Level
Note
DDR3 SDRAM
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Notes :
Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
Part number:
Supply voltage:
Speed:
NOR Flash
Temperature:
...
Power Input Pin
Typical Current
VCC
TBD*
VBUS
0 (not used)
* TBD - To Be Determined
Power Distribution Dependencies
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Power Distribution
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Power Rails
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Ethernet PHY to Zynq SoC connectionsModule power rails.
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U?? Pin
Signal Name
Connected to
Signal Description
Note
CAN Transceiver
...
anchor
Table_OBP_CAN
title
CAN Tranciever interface MIOs
Power Rail Name
B2B Connector
J1 Pin
B2B Connector
J2 Pin
B2B Connector
J3 Pin
Direction
Notes
VCC
10
1
-
in
VBUS
12
-
1
n/a
not used
Board to Board Connectors
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This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series,
CR00040 module uses one Samtec connector at the bottom side.
1 x TMMH-106-04-F-DV-A-M (12 pins, 6 per row)
Operating Temperature: -55°C ~ 105°C Current Rating: 4.5A per Contact Number of Positions: 6 (2 x 6) Number of Rows: 2
Technical Specifications
Absolute Maximum Ratings
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Absolute maximum ratings
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...
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Table_OBP_CLK
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Osillators
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Designator
Symbols
Description
Frequency
Min
Note
Max
MHz
Unit
MHz
VCC
KHz
Programmable Clock Generator
There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??. The I2C Address is 0x??.
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Table_OBP_PCLK
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Programmable Clock Generator Inputs and Outputs
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...
IN0
...
XAXB
...
Power and Power-On Sequence
...
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
Power on-sequence
Power distribution
Voltage monitoring circuit
Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
Main Power
-0.3
4.8
V
VBUS
n/a
n/a
V
SDA, SCL
-0.3
3.6
V
INT1
-0.3
VCC+0.3
V
INT2
-0.3
3.6
V
D0, D1, D2
-5
3.6
V
D3
-25*
25
V
Operating Temperature
-10
60
°C
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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Table_TS_ROC
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Recommended operating conditions.
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Parameter
Min
Typ
Max
Units
Reference Document
VCC
2.4
3.3
3.6
V
See LPS22HBTR datasheet.
VBUS
n/a
n/a
n/a
V
not used
Storage Temperature
10
-
50
°C
See SCD40 datasheet.
Short term storage Temperature
-40
-
70
°C
See SCD40 datasheet.
Operating Temperature
-10
-
60
°C
See SCD40 datasheet.
Physical Dimensions
Module size: 32 mm × 18 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.
PCB thickness: 1.6 mm.
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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.
For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
Operating Temperature: -??°C ~ ??°C Current Rating: ??A per ContactNumber of Positions: ?? Number of Rows: ??
Technical Specifications
Absolute Maximum Ratings
...
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Table_TS_AMR
title
PS absolute maximum ratings
...
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
...
anchor
Table_TS_ROC
title
Recommended operating conditions.
...
Physical Dimensions
Module size: ?? mm × ?? mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.
PCB thickness: ?? mm.
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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.
For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Board hardware revision number.number.
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Document Change History
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