Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
Interface
132 x HP PL I/Os (3 banks)
ETH
USB
4 GTR (for USB3, Sata, PCIe, DP)
MIO for UART
MIO for SD
MIO for PJTAG
JTAG
Ctrl
Power
3.3V-5V Main Input
3.3V Controller Input
Variable Bank IO Power Input
Dimension
4 cm x 5 cm
Notes
* depends on assembly version
** also non low power assembly options possible
*** depends on used U+ Zynq and DDR4 combination
Key Features' must be split into 6 main groups for carrier:
Modules
TE0808, TE807, TE0803,...
RAM/Storage
E.g. SDRAM, SPI
On Board
E.g. CPLD, PLL
Interface
E.g. ETH, USB, B2B, Display port
Power
E.g. Input supply voltage
Dimension
Excerpt
EEPROM/Unique Identifier
24AA025E48
CO2 Sensor (temperatur/humidity)
SCD40 or SCD41 or none (depending on assembly variant)
Air Pressure Sensor
LPS22HB
Ambient Light Sensor
TSL25403M
On-board
RGB LED
Buzzer
Power
3.3V
Dimension
32 x 18 mm
<Replace for module use "SoC/FPGA" for Carrier "Modules">
...
RAM/Storage
...
On Board
...
Interface
...
Power
...
Dimension
...
Notes
...
Block Diagram
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Figure_OV_BD
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TExxxx CR00040 block diagram
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Main Components
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Notes :
Picture of the PCB (top and bottom side) with labels of important components
Add List below
Note
For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .
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Figure_OV_MC
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TExxxx CR00040 main components
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...
...
Initial Delivery State
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Notes :
Only components like EEPROM, QSPI flash can be initialized by default at manufacture.
If there is no components which might have initial data ( possible on carrier) you must keep the table empty
...
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Table_OV_IDS
title
Initial delivery state of programmable devices on the module
...
Storage device name
...
Content
...
Notes
...
at offset 0xFA, 6 bytes
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CO2 Sensor (not fitted on CR00040-XX-0)
Air Pressure Sensor
Ambient Light Sensor
EEPROM
RGB LED
Buzzer
Pin Headers (not fitted)
CRUVI Low Speed Connector
Initial Delivery State
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Notes :
Only components like EEPROM, QSPI flash can be initialized by default at manufacture.
If there is no components which might have initial data ( possible on carrier) you must keep the table empty
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Table_OV_IDS
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Initial delivery state of programmable devices on the module
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Storage device name
Content
Notes
EEPROM
EUI-48 Node Identity
at offset 0xFA, 6 bytes
Signals, Interfaces and Pins
Signals, Interfaces and Pins
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Notes :
For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
SD
USB
ETH
FMC
...
For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
JTAG
UART
I2C
MGT
...
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
...
anchor
Table_SIP_B2B
title
General PL I/O to B2B connectors information
...
On-board Peripherals
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add subsection for every component which is important for designFor carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
Two 100 Mbit Ethernet Transciever PHYSD
USBPHY
Programmable Clock Generator
Oscillators
eMMCs
RTC
ETH
FMC
...
For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
JTAG
UART
I2C
MGTFTDI
...
DIP-Switches
Buttons
LEDs
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Module I/Os
Module signals connected to the B2B connector:
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On board peripheralsGeneral PL I/O to B2B connectors information
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B2B Connector
I/O Signal Count
Voltage Level
Chip/Interface
Designator
Notes
EEPROM
J1
U1
CO2 Sensor
U2
Ambient Light Sensor
U3
Pressure Sensor
U4
RGB LED
D2
Buzzer
LS1
Quad SPI Flash Memory
8
VCC (3.3V)
J2
4
parallel to J1
J3
4
parallel to J1
J1 is the main CRUVI connector and should be used to connect the CR00040 to any CRUVI baseboard with CRUVI LS connector fitter. J2 and J2 are un-populated 100 mil pin-headers that allow solder-in pin-headers to use the CR00040 with solder-less breadboards or fly-wires.
On-board Peripherals
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Notes :
Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.
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Quad SPI interface MIOs and pins
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MIO Pin
Schematic
U?? Pin
Notes
...
add subsection for every component which is important for design, for example:
Two 100 Mbit Ethernet Transciever PHY
USB PHY
Programmable Clock Generator
Oscillators
eMMCs
RTC
FTDI
...
DIP-Switches
Buttons
LEDs
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Table_OBP_RTC
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I2C interface MIOs and pinsOn board peripherals
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portrait
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MIO Pin
Schematic
U? Pin
Notes
Chip/Interface
Designator
Notes
EEPROM
U1
CO2 Sensor
U2
Ambient Light Sensor
U3
Pressure Sensor
U4
RGB LED
D2
Buzzer
LS1
Air Pressure Sensor
Scroll Title
Scroll Title
anchor
Table_OBP_I2C_RTCPRESS
title
I2C Address for RTCAir Pressure Sensor interface pins
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true
MIO
J1 Pin
I2C Address
Schematic
Designator
U4 Pin
Notes
...
2
SCL
2
1
SDA
4
Scroll Title
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Table_OBP_EEPI2C_PRESS
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I2C EEPROM interface MIOs and pinsaddress for Air Pressure Sensor
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MIO Pin
Schematic
U?? Pin
Notes
I2C Address
Designator
Notes
1011_101x
U4
Ambient Light Sensor
Scroll Title
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Table_OBP_I2C_EEPROMALS
title
I2C address for EEPROMAmbient Light Sensor interface pins
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MIO
J1 Pin
I2C Address
Schematic
Designator
U3 Pin
Notes
...
2
SCL
3
1
SDA
4
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Table_OBP_LEDI2C_ALS
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On-board LEDsI2C address for Ambient Light Sensor
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I2C Address
Designator
Notes
Color
Connected to
Active Level
Note
D2
Red
D0
High
D2
Green
D1
High
D2
Blue
D2
High
Power and Power-On Sequence
...
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
Power on-sequence
Power distribution
Voltage monitoring circuit
Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
0111_001x
U3
CO2 Sensor
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Table_OBP_EEP
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I2C EEPROM interface pins
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J1 Pin
Schematic
U2 Pin
Notes
2
SCL
9
1
SDA
10
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
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Table_PWROBP_I2C_PCEEPROM
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Power ConsumptionI2C address for EEPROM
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Power Input Pin
Typical Current
VIN
TBD*
* TBD - To Be Determined
Power Distribution Dependencies
I2C Address
Designator
Notes
1100_010x
U2
EEPROM
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Power DistributionI2C EEPROM interface pins
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J1 Pin
Schematic
U1 Pin
Notes
2
SCL
1
1
SDA
3
Scroll Title
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Table_OBP_PWRI2C_PREEPROM
title
Module power rails.I2C address for EEPROM
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Power Rail Name
B2B Connector
J1 Pin
B2B Connector
J2 Pin
B2B Connector
J3 Pin
Direction
Notes
VCC
10
1
-
in
VBUS
12
-
1
n/a
not used
...
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true
id
Comments
...
I2C Address
Designator
Notes
1010_011x
U1
LEDs
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On-board LEDs
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Designator
Color
Connected to
Active Level
Note
D2
Red
D0
Low
D2
Green
D1
Low
D2
Blue
D2
Low
Power and Power-On Sequence
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Power on-sequence
Power distribution
Voltage monitoring circuit
Note
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
Power Supply
Power supply with minimum current capability of TBD A is recommended.
Power Consumption
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Table_PWR_PC
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Power Consumption
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Power Input Pin
Typical Current
VCC
TBD*
VBUS
0 (not used)
* TBD - To Be Determined
Power Distribution Dependencies
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Figure_PWR_PD
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Power Distribution
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Power Rails
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Module power rails.
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Power Rail Name
B2B Connector
J1 Pin
B2B Connector
J2 Pin
B2B Connector
J3 Pin
Direction
Notes
VCC
10
1
-
in
VBUS
12
-
1
n/a
not used
Board to Board Connectors
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This section is optional and only for modules.
use "include page" macro and link to the general B2B connector page of the module series,
CR00040 module uses one Samtec connector at the bottom side.
1 x TMMH-106-04-F-DV-A-M (12 pins, 6 per row)
Operating Temperature: -55°C ~ 105°C Current Rating: 4.5A per Contact Number of Positions: 6 (2 x 6) Number of Rows: 2
Technical Specifications
Absolute Maximum Ratings
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Table_TS_AMR
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Absolute maximum ratings
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Symbols
Description
Min
Max
Unit
VCC
Main Power
-0.3
4.8
V
VBUS
n/a
n/a
V
SDA, SCL
-0.3
3.6
V
INT1
-0.3
VCC+0.3
V
INT2
-0.3
3.6
V
D0, D1, D2
-5
3.6
V
D3
-25*
25
V
Operating Temperature
-10
60
°C
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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Table_TS_ROC
title
Recommended operating conditions.
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Parameter
Min
Typ
Max
Units
Reference Document
VCC
2.4
3.3
3.6
V
See LPS22HBTR datasheet.
VBUS
n/a
n/a
n/a
V
not used
Storage Temperature
10
-
50
°C
See SCD40 datasheet.
Short term storage Temperature
-40
-
70
°C
See SCD40 datasheet.
Operating Temperature
-10
-
60
°C
See SCD40 datasheet.
Physical Dimensions
Module size: 32 mm × 18 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.
PCB thickness: 1.6 mm.
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For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
use "include page" macro and link to the general B2B connector page of the module series,
...
CR00040 module uses one Samtec connector at the bottom side.
1 x ?-?, (12 pins, 6 per row)
Operating Temperature: -??°C ~ ??°C Current Rating: ??A per Contact Number of Positions: ?? Number of Rows: 2
Technical Specifications
Absolute Maximum Ratings
...
anchor
Table_TS_AMR
title
PS absolute maximum ratings
...
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
...
anchor
Table_TS_ROC
title
Recommended operating conditions.
...
Physical Dimensions
Module size: 32 mm × 18 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.
PCB thickness: 1.6 mm.
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For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .
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Physical Dimension
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Currently Offered Variants
...
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Board hardware revision number.
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Document Change History
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