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Table of Contents

Table of Contents

Overview

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Overview

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Refer to https://wiki.trenz-electronic.de/display/PD/TE0741 for downloadable version of this manual and the rest of available documentation.
 

Trenz Electronic TE0741 is an industrial-grade FPGA module integrating a Xilinx Kintex-7 FPGA, 32 MByte SPI Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips.

The TE0741 module is available in four different logic densities (70T, 160T, 325T and 410T). The 70T and 160T devices can be programmed with the free Xilinx Vivado WebPACK software. Further information about the Kintex-7 FPGA can be found in the Xilinx document 7 Series FPGA's Overview (DS180).

Block Diagram

Image Removed

Figure 1: TE0741 Block Diagram.

Main Components

Image Removed     Image Removed

Figure 2: TE0741 (REV 02).

Scroll Only (inline)
Refer to http://trenz.org/te0741-info for online version of this manual and the rest of available documentation.

Key Features

  • Industrial-grade Xilinx Kintex-7 FPGA

...

  • module (70T*, 160T*, 325T, 410T)
    * Devices supported by the free Xilinx Vivado WebPACK software.
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect (Bus width x4))
  • 8 GTX transceivers
  • FPGA configuration through:
    • JTAG (B2B connector)
    • SPI Flash memory
  • 25 MHz low jitter oscillator with shutdown control
  • Programmable quad PLL clock generator
  • On-board high-efficiency DC-DC converters
    • GTX voltage regulators with control enable
    • Core voltage regulator: 20A (2 x Enpirion DC-DC regulators with load-sharing)
    • Supply voltages: either 3.3V or 3.3V and 5V
  • Plug-on module with two 100-pin and one 60-pin high-speed hermaphroditic stacking strips
  • Up to 144 (94 for 70T) FPGA I/O pins are available on B2B strips (up to 65 LVDS pairs possible)
  • 2 user LED's, 1x DONE FPGA pin LED, 1 System Controller status LED
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption
  • Evenly spread supply pins for good signal integrity

Additional assembly options are available for cost or performance optimization upon request.

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Block Diagram

Image Added

Figure 1: TE0741 block diagram.

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Main Components

Image Added Image Added

Figure 2.1: TE0741--03-410-2CF module.

Image Added Image Added

Figure 2.2: TE0741-03-160-2C1 module.

  1. Xilinx Kintex-7 FPGA, U1
  2. Green LED (DONE), D3
  3. Red LED (LED1), D2
  4. Green LED (LED2), D1
  5. EN63A0QI Voltage Regulator 1.0V (Master), U14
  6. EN63A0QI Voltage Regulator 1.0V (Slave), U15
  7. Green LED (C_LED), D4
  8. Voltage detector, U11

  9. Serial number (traceability) pad
  10. I2C-programmable any-frequency, any-output quad clock generator, U2
  11. Low-power programmable oscillator @ 25.000000 MHz, U3
  12. Samtec Razor Beam™ LSHM-150 B2B connector, JM2 
  13. 32 MByte quad SPI Flash memory, U4
  14. Samtec Razor Beam™ LSHM-130 B2B connector, JM3 
  15. 3A PFET load switch with configurable slew rate (3.3V), Q1
  16. Samtec Razor Beam™ LSHM-150 B2B connector, JM1 
  17. System Controller CPLD, U7
  18. EP53F8QI Voltage Regulator (1.2V_MGT), U6
  19. EP53F8QI Voltage Regulator (1.8V), U8
  20. EP53F8QI Voltage Regulator (1V_MGT), U16

Initial Delivery State

Storage device name

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Demo design

-

Key Features

  • Industrial-grade Xilinx Kintex-7 FPGA module (70T*, 160T*, 325T, 410T)
    * Devices supported by the free Xilinx Vivado WebPACK software.
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect (Bus width x4))
  • 8 GTX transceivers
  • FPGA configuration through:
    • JTAG (B2B connector)
    • SPI Flash memory
  • 25 MHz low jitter oscillator with shutdown control
  • Programmable quad PLL clock generator
  • On-board high-efficiency DC-DC converters
    • GTX voltage regulators with control enable
    • Core voltage regulator: 20A (2 x Enpirion DC-DC regulators with load-sharing)
    • Supply voltages: either 3.3V or 3.3V and 5V
  • Plug-on module with two 100-pin and one 60-pin high-speed hermaphroditic stacking strips
  • Up to 144 (94 for 70T) FPGA I/O  pins available on B2B strips (up to 65 LVDS pairs possible)
  • 2 user LED's, 1 DONE FPGA pin LED, 1 System Controller status LED
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption
  • Evenly spread supply pins for good signal integrity
  • Assembly options for cost or performance optimization available on request

Additional assembly options are available for cost or performance optimization upon request.

Initial Delivery State

Storage device name

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Demo design

-

eFUSE USER

Not programmed

-

eFUSE Security

Not programmed

-

...

Board to Board (B2B) I/Os

Overview of the I/O signals signal banks connected to the FPGAs I/O banks and B2B connectorB2B connectors:

BankTypeB2B ConnectorI/O Signal CountVoltageNotes

0

HR

-

-

3.3VConfiguration bank.

12

HR

JM2

50 I/Os, 24 LVDS pairs

User

HR-Banks support voltages

Supported voltage level from 1.2V to 3.3V

standards

.

NOTE: BANK 12 IS NOT AVAILABLE ON THE K70T DEVICE

.

!

13

HR

JM1

48 I/Os, 24 LVDS pairs

User

HR-Banks support voltages
Supported voltage level from 1.2V to 3.3V
standards
.

14

HR

JM1

JM3

8 I/Os

4 I/Os, 2 LVDS pairs

3.3V

IO pins at B2B connector JM1, support only 3.3V
IO-voltage
.

15

HR

JM2

18 I/Os, 9 LVDS pairs

User

HR-Banks support voltages
Supported voltage level from 1.2V to 3.3V
standards
.

16

HR

JM3

16 I/Os, 8 LVDS pairs

User

HR-Banks support voltages
Supported voltage level from 1.2V to 3.3V
standards
.

32

HP

NC

-

-

Bank not used.

33

HP

NC

-

-

Bank not used.
34HPNC--Bank not used.

Table 2:   Voltage ranges and pin-outs of available logic banks of the FPGAAvailable I/O signal banks connected to the B2B connectors.

Please use Master Pin-out Table table as primary reference for the pin mapping information.

...

JTAG access to the Xilinx Kintex7 Kintex-7 and to the System Controller CPLD is provided through B2B connector JM2.

...

Table 3: Pin-mapping of JTAG Interface on B2B connector.

Note
Select by JTAGMODE pin on 89 in B2B connector JM1 -89 either to access FPGA Artix7 (JTAGMODE pin driven low or open) or System Controller via JTAG (JTAGMODE pin driven high)is used to select which device is accessible, low - Xilinx Kintex-7, high - System Controller CPLD.

System Controller I/O Pins

...

Pin NameModeFunctionDefault ConfigurationB2B Connector
PGOODOutputINOUTPower GoodActive high low when all on-module power supplies are working properly.failed, otherwise high impedanceJM1-30
RESINInputResetActive low reset signal, drive low to keep the system in reset (FPGA pin PROG_B will be driven by CPLD).JM2-18
JTAGMODEInputJTAG SelectLow for normal operation, high (3.3V) to program the System Controller CPLD.JM1-89

Table 4: Pin-description of System Controller CPLD. Important, functionality depends on CPLD Firmware, see TE0741 CPLD. General 4x5 module controller IO description on 4 x 5 SoM Integration Guide#4x5SoMIntegrationGuide-4x5ModuleControllerIOs

On-board LEDs

There are four LED's available on TE0741 SoM. Two status LED's (D3 and D4) and two user configurable LED's (D1 and D2).

LEDColorConnected toDescription and Notes
D1GreenLED2User configurable LED.
D2RedLED1User configurable LED.
D3GreenDONE

Reflects inverted DONE signal, ON when FPGA is not configured, OFF as soon as PL is configured.

This LED will not operate if the the 3.3V power rail is not available.

After FPGA configuration the user can use USRACCESSE2 to control Done LED.

D4GreenC_LED

Connected to the system controller indicating status of the module, functionalitly, see: TE0741 CPLD#LED

Steadily lit: RESIN pin is kept low.

Blinking fast (0.1s on/off): Power sequencing fault (PG_ALL = 0).

Blinking at medium speed (0.5s on/off): Power sequencing has completed but the FPGA is not configured (PG_ALL = 1, DONE = 0).

Blinking slow (1s on/off): FPGA is configured and board is ready (PG_ALL = 1, DONE = 1).

It is also possible to program the System Controller CPLD to connect this LED to FPGA pin named XIO.

Table 5: Description of the on board LED's.

Note: if FPGA logic toggles DONE pin (to control D3) then D4 will toggle at random, as changing value on DONE will change the blink frequency of D4.

Note

DONE LED will be ON as long as FPGA is NOT configured and will be OFF when FPGA is configured successfully. If user STARTUPE2 primitive is used in user design then DONE LED is controlled by the user design and can be on/off/blink or have any other functionality defined by the user.

Clocking

To enable the PLL (phase-locked loop) clock generator Si5338A (U2), CLK_EN-signal (bank 14, pin C26) must be set to high, to activate the 25 MHz reference clock SiT8208AI (U3). The GTX reference clocks 0 and 2 have to be provided by the user on B2B connector JM3.


Table 5: Description of the on board LED's.

Note: if FPGA logic toggles DONE pin (to control D3) then D4 will toggle at random, as changing value on DONE will change the blink frequency of D4.

Note

DONE LED will be ON as long as FPGA is NOT configured and will be OFF when FPGA is configured successfully. If user STARTUPE2 primitive is used in user design then DONE LED is controlled by the user design and can be on/off/blink or have any other functionality defined by the user.

Clocking

To enable the PLL (phase-locked loop) clock generator Si5338A (U2), CLK_EN-signal (bank 14, pin C26) must be set to high, to activate the 25 MHz reference clock SiT8208AI (U3). The GTX reference clocks 0 and 2 have to be provided by the user on B2B connector JM3.

 ClockFrequencyICFPGANotes

PLL reference

25 MHz

U3 SiT8208AI

-

Activated by CLK_EN pin of FPGA.

GTX REFCLK0

-

B2B

D5/D6

B2B connector pins:

MGT_CLK_0_N: JM3-31

MGT_CLK_0_P: JM3-33

Needs decoupling and differential terminator on base board.

GTX REFCLK1

125 MHz

U2 Si5338

F5/F6

PLL clock 1, default frequency is 125 MHz.

GTX REFCLK2

-

B2B

H5/H6

 ClockFrequencyICFPGANotes

PLL reference

25 MHz

U3 SiT8208AI

-

Activated by CLK_EN pin of FPGA.

GTX REFCLK0

-

B2B

D5/D6

B2B connector pins:

MGT_CLK_02_N: JM3-3132

MGT_CLK_02_P: JM3-3334

Needs decoupling and decoupling and differential terminator on base board.

GTX REFCLK1REFCLK3

125 MHz

U2 Si5338

F5K5/F6K6

PLL clock 12, default frequency is 125 MHz.

GTX REFCLK2

-

B2B

H5/H6

B2B connector pins:

MGT_CLK_2_N: JM3-32

MGT_CLK_2_P: JM3-34

Needs decoupling and differential terminator on base board.

GTX REFCLK3

125 MHz

U2 Si5338

K5/K6

PLL clock 2, default clock is 125 MHz.

Bank 14 input clock100 MHzU2 Si5338F22/E23PLL clock 0, default frequency is 100 MHz.

Table 6: Clocks overview.

On-board Peripherals

Programmable PLL Clock (Phase-Locked Loop)

There is a Silicon Labs I2C programmable clock generator Si5338A (U2) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70 or 0x71 (PLL_IN4 (LSB of I2C-Address) must be set for address 0x71).

A 25 MHz oscillator is connected to pin IN3 and is used to generate the output clocks. The oscillator has its enable pin connected to an FPGA pin (CLK_EN). Driving the FPGA pin low will disable the oscillator output, setting it high will enable it. Three of the Si5338 clock outputs are connected to the FPGA. One is connected to a logic bank and the other two are connected to the GTX banks. It is possible to use the clocks connected to the GTX bank in the user's logic design. This is achieved by instantiating a IBUFDSGTE buffer in the design.

The default frequency of each clock at start up is detailed in the table 7.

Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). Logic needs to be generated inside the FPGA to utilize I2C bus correctly.

Image Removed

Figure 3: Clock Generator block diagram.

 

...

IN1/IN2

...

-

...

Not used (external clock signal supply).

...

IN3

...

25MHz

...

Fixed input clock signal from.

reference clock generator SiT8208AI (U3).

...

IN4

...

-

...

IN5/IN6

...

-

...

Not used (external clock signal supply).

...

CLK0 A/B

...

100 MHz

...

Bank 14 clock input,

Pins: B14_L12_P, B14_L12_N

...

CLK1 A/B

...

MGT reference clock 1 to FPGA Bank 116 MGT

...

CLK2 A/B

...

125MHz

...

MGT reference clock 3 to FPGA Bank 115 MGT

...

not configured

Bank 14 input clock100 MHzU2 Si5338F22/E23PLL clock 0, default frequency is 100 MHz.

Table 6: Clocks overview.

On-board Peripherals

Programmable PLL Clock (Phase-Locked Loop)

There is a Silicon Labs I2C programmable clock generator Si5338A (U2) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70 or 0x71 (PLL_IN4 (LSB of I2C-Address) must be set for address 0x71).

A 25 MHz oscillator is connected to pin IN3 and is used to generate the output clocks. The oscillator has its enable pin connected to an FPGA pin (CLK_EN). Driving the FPGA pin low will disable the oscillator output, setting it high will enable it. Three of the Si5338 clock outputs are connected to the FPGA. One is connected to a logic bank and the other two are connected to the GTX banks. It is possible to use the clocks connected to the GTX bank in the user's logic design. This is achieved by instantiating a IBUFDSGTE buffer in the design.

The default frequency of each clock at start up is detailed in the table 7.

Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). Logic needs to be generated inside the FPGA to utilize I2C bus correctly.

Image Added

Figure 3: Clocking block diagram.


I/O Si5338A (U2)Default FrequencyNotes

IN1/IN2

-

Not used (external clock signal supply).

IN3

25MHz

Fixed input clock signal from.

reference clock generator SiT8208AI (U3).

IN4

-

LSB of the default I2C-Adress 0x70.

IN5/IN6

-

Not used (external clock signal supply).

CLK0 A/B

100 MHz

Bank 14 clock input,

Pins: B14_L12_P, B14_L12_N

CLK1 A/B

125MHz

MGT reference clock 1 to FPGA Bank 116 MGT

CLK2 A/B

-

MGT reference clock 3 to FPGA Bank 115 MGT

CLK3-not used

Table 7: Pin description of Si5338A PLL clock generator.

32 MByte Quad SPI Flash Memory

An SPI flash memory S25FL256SAGBHI20 (U4) is provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

Note

SPI Flash QE (Quad Enable) bit must be set, or the FPGA would not configure itself from Flash. This bit is always set at the manufacturing.

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GTX Transceivers

The Kintex-7 device that is used on the TE0741 board has 8 GTX transceivers. All 8 are wired directly to connectors JM1 and JM3. There are also 4 clocks that are associated with the transceivers. Two of the clocks are connected directly to JM3, whilst the other two are derived from the clock generator. As there is no capacitive coupling of the data and clock lines that are connected to the connectors, these may be required on the user’s PCB depending on the application.

To enable the voltage supply for the GTX transceivers, namely the Enpirion EP53F8QI voltage regulators U6 and U16, which serve the voltages MGTAVCC (1.0 V) and MGTAVTT (1.2 V), the signal EN_MGT (bank 14, pin H22) have to be set high. The voltage regulators will indicate "Power OK" with signals PG_MGT_1V and PG_MGT_1V2, when reaching stable state.


Image Added

Figure 4: GTX transceiver block diagram.

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System Controller CPLD

The System Controller CPLD is used to coordinate the configuration of the FPGA. The FPGA is held in reset (by driving the PROG_B signal) until the power supplies have sequenced. Setting input signal RESIN low will also reset the FPGA. This signal can be driven from the user’s PCB via the board connector.

User can create its own System Controller CPLD design using the Lattice Diamond software and program it into the device using the JTAG interface. The JTAGMODE signal should be set to 3.3V to enable programming mode, for normal module operation it should be set to 0V.

Green LED D4 (C_LED) connected to the System Controller CPLD is to indicate the status of the module. CPLD Firmware, see TE0741 CPLD.

Image Added

Figure 5: System Controller CPLD block diagram.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

 Power Input PinTypical Current
VINTBD*
3.3VINTBD*

Table 8: Maximum current of power supplies.

* TBD - To Be Determined.

Lowest power consumption is achieved when powering the module from single 3.3V supply. When using split 3.3V/5V power supplies, the power consumption (and heat dissipation) will rise, this is due to the DC-DC converter efficiency (it decreases when VIN/VOUT ratio rises).

Power-On Sequence

For highest efficiency of on board DC-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/Os are 3-stated at power-on until System Controller sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10,12 or 91, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx datasheet DS182 for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0741 module.

The FPGA 1.0V supply is derived from two regulators operating in a parallel allowing higher load currents. To start the power-on sequence, pin EN1 (JM1-28, enable 1.0V voltage regulators) is by default high. By driving EN1 pin low on base-board the power-on sequence will not start until the EN1 pin is released to high.

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Power Rails

Voltages on B2B-Connectors

B2B JM1 PinB2B JM2 PinB2B DirectionNote
VIN

1, 3, 5

2, 4, 6, 8InputSupply voltage.
3.3VIN13, 15-InputSupply voltage.
VCCIO12-7, 9InputHigh range bank voltage.
VCCIO139, 11-InputHigh range bank voltage.
VCCIO15-5InputHigh range bank voltage.
VCCIO16-1, 3InputHigh range bank voltage.
3.3V-10, 12, 91OutputInternal 3.3V voltage level.

Table 9: Power rails of SoM on B2B connectors.

Bank Voltages

BankSchematic NameVoltageRange
0 Config3.3V3.3V-
12VCCIO12userHR: 1.2V to 3.3V
13VCCIO13userHR: 1.2V to 3.3V
143.3V3.3V-
15VCCIO15userHR: 1.2V to 3.3V
16VCCIO16userHR: 1.2V to 3.3V

Table 10: Range of FPGAs bank voltages.

See Xilinx Kintex-7 datasheet DS182 for the voltage ranges allowed.

Board to Board Connectors

Include Page
4 x 5 SoM LSHM B2B Connectors
4 x 5 SoM LSHM B2B Connectors

Variants Currently In Production

Module Variant

FPGA

U15FPGA Junction TemperatureTemperature Grade
TE0741-03-070-2CFXC7K70T-2FBG676C-0°C to 85°CCommercial grade
TE0741-03-070-2IFXC7K70T-2FBG676I--40°C to 100°CIndustrial grade
TE0741-03-160-2CFXC7K160T-2FBG676C-0°C to 85°CCommercial grade
TE0741-03-160-2C1XC7K160T-2FFG676C-0°C to 85°CCommercial grade
TE0741-03-160-2IFXC7K160T-2FBG676I--40°C to 100°CIndustrial grade
TE0741-03-325-2CFXC7K325T-2FBG676CEN63A0QI0°C to 85°CCommercial grade
TE0741-03-325-2IFXC7K325T-2FBG676IEN63A0QI-40°C to 100°CIndustrial grade
TE0741-03-410-2CFXC7K325T-2FBG676CEN63A0QI0°C to 85°CCommercial grade

Table 11: Module TE0741-03 variants.

Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnitsNotes

VIN supply voltage

-0.36.5V-
3.3VIN supply voltage

-0.1

3.6 V-
PL IO bank supply voltage for HR I/O banks (VCCO) -0.53.6 V-
I/O input voltage for HR I/O banks-0.4 VCCO_X+0.55 V-
GT receiver (RXP/RXN) and transmitter (TXP/TXN)-0.51.26 VXilinx datasheet DS182
 Voltage on module JTAG pins

-0.5

 VCCO_0+0.45 VVCCO_0 is 3.3V nominal.
Storage temperature

-55

+125

 °C-

Table 12: Absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference Document
VIN supply voltage2.45.5V-EP53F8QI data sheet 
3.3VIN supply voltage3.1353.465V

3,3V ± 5%

 -
PL I/O bank supply voltage for HR I/O banks (VCCO)1.143.465V-Xilinx datasheet DS182
I/O input voltage for HR I/O banks-0.20VCCO+0.2V-Xilinx datasheet DS182
GT receiver (RXP/RXN) and transmitter (TXP/TXN)(*)(*)--* See datasheet DS182
Voltage on module JTAG pins3.1353.465V--

Table 13: Recommended operation conditions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Note
Check Xilinx datasheet DS182 for complete list of absolute maximum and recommended operating ratings.

Physical Dimensions

  • Module size: 50 mm × 40 mm
  • Mating height with standard connectors: 8mm
  • PCB thickness: 1.6mm

Image Added Image Added

Figure 6: Physical dimensions of the TE0741 module. All dimensions are shown in millimeters.

Weight

19 g - Plain module.

8.8 g - Set of nuts and bolts.

Revision History

Hardware Revision History

DateRevisionNotesPCNDocumentation
2016-10-25031) Fixed DC-DC connection for parallel operation
2) Samtec Razor Beam connectors updated
3) Serial number (traceability) pad added
4) Changed ferrite beads L1..L4 size 0402 to BKP0603HS121-T
5) Thermal vias added to mounting holes
PCN-20170106TE0741-03
2013-11-0602
  • Improved power-on-sequencing
  • Added differential terminator to bank 14 clock input

TE0741-02

01First production release

Hardware revision number is written on the PCB board together with the module model number separated by the dash.

Image Added   Image Added

Figure 7: TE0741 PCB revision number.

Document Change History

DateRevisionContributorsDescription

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd

Page info
infoTypeCurrent version
dateFormatyyyy-MM-dd
prefixv.
typeFlat

Page info
infoTypeModified by
dateFormatyyyy-MM-dd
typeFlat

  • update LED description
2018-08-29v.64John Hartfiel
  • update CPLD description and links

2017-11-10

v.63John Hartfiel
  • Replace B2B connector section
2017-08-28v.60Jan Kumann
  • New power-on diagram.
  • Few improvements.
  • Template revision added.
2017-07-20

v.57

John Hartfiel
  • Correction: PLL  default output CLKs.
2017-06-07v.55Jan Kumann
  • Minor formatting
2017-06-02

v.50

Jan Kumann

  • REV03 specific update.
2017-01-22

v.42

Jan Kumann
  • New block diagram added.
2017-01-13

v.38

Jan Kumann

  • New product images and physical dimension drawings.
  • Formatting improvements and small corrections.
2017-01-12

v.21

John Hartfiel
  • Correction: B2B  and FPGA bank location.
2016-12-14

v.19

Ali Naseri

  • TRM revision.
2013-12-02v.1

Antti Lukats, Jon Bean

  • Initial version.

Table 7: Pin description of PLL clock generator Si5338A.

32 MByte Quad SPI Flash Memory

An SPI flash memory S25FL256SAGBHI20 (U4) is provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

Note

SPI Flash QE (Quad Enable) bit must be set, or the FPGA would not configure itself from Flash. This bit is always set at the manufacturing.

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GTX Transceivers

The Kintex-7 device that is used on the TE0741 board has 8 GTX transceivers. All 8 are wired directly to connectors JM1 and JM3. There are also 4 clocks that are associated with the transceivers. Two of the clocks are connected directly to JM3, whilst the other two are derived from the clock generator. As there is no capacitive coupling of the data and clock lines that are connected to the connectors, these may be required on the user’s PCB depending on the application.

To enable the voltage supply for the GTX transceivers, namely the Enpirion EP53F8QI voltage regulators U6 and U16, which serve the voltages MGTAVCC (1.0 V) and MGTAVTT (1.2 V), the signal EN_MGT (bank 14, pin H22) have to be set high. The voltage regulators will indicate "Power OK" with signals PG_MGT_1V and PG_MGT_1V2, when reaching stable state.

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Figure 4: GTX Transceiver block diagram.

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System Controller CPLD

The system controller is used to coordinate the configuration of the FPGA. The FPGA is held in reset (by driving the PROG_B signal) until the power supplies have sequenced. Setting input signal RESIN low will also reset the FPGA. This signal can be driven from the user’s PCB via the board connector.

It is possible for the user to create their own system controller design using the Lattice Diamond software. Once created the design can be programmed into the device using the JTAG pins. The signal JTAGMODE should be set to 3.3V to enable programming mode. For normal operation it should be set to 0V.

The LED that is connected to the system controller flashes to indicate the state of the board.

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Figure 5: System Controller block diagram.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

...

Table 8: Maximum current of power supplies.

* TBD - To Be Determined soon with reference design setup.

Lowest power consumption is achieved when powering the module from single 3.3V supply. When using split 3.3V/5V supplies the power consumption (and heat dissipation) will rise, this is due to the DC/DC converter efficiency (it decreases when VIN/VOUT ratio rises).

Power-On Sequence

For highest efficiency of on board DC/DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/O's are 3-stated at power-on until System Controller sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10,12 or 91, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx datasheet DS182 (for Kintex7) for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0741 module.

The FPGA 1.0V supply is derived from two regulators operating in a parallel allowing higher load currents. To start the power-on sequence, pin EN1 (JM1-28, enable 1.0V voltage regulators) is by default high. By driving EN1 pin low on base-board the power-on sequence will not start until the EN1 pin is released to high.

A 3.3V supply is also needed and must be supplied from the user's PCB. An output 3.3V supply is available on some of the board connector pins (see section 'Power Rails'). The input 3.3VIN will be switched to the internal 3.3V voltage level after the FPGA 1.0V supply is stable. Than this power supply will be available on the B2B connector pins.

The regulators can be powered from the 3.3V supply or a 5V supply if preferred. The options for powering the board are detailed below.

  • Apply 5V to pins VIN and 3.3V to pins 3.3VIN on the board connector
  • Apply 3.3V to pins VIN and 3.3VIN on the board connectors.

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Figure 6: Connections between the on-board DC-DC and LDO regulators.

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Power Rails

...

Voltages on B2B-Connectors

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1, 3, 5

...

Table 9: Power rails of SoM on B2B connectors.

Bank Voltages

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Table 10: Range of FPGAs bank voltages.

See the Kintex-7 datasheet (DS182) for the allowable voltage range.

Board to Board Connectors

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Variants Currently In Production

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Module Variant

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FPGA

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Table 11: Differences between variants of Module TE0741.

Technical Specifications

Absolute Maximum Ratings

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VIN supply voltage

...

-0.1

...

-0.5

...

-55

...

+125

...

Table 12: Absolute maximum ratings.

Recommended Operating Conditions

...

3,3V ± 5%

...

Table 13: Recommended operation conditions.

Note
Check Xilinx datasheet (DS182) for complete list of absolute maximum and recommended operating ratings.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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Physical Dimensions

  • Module size: 50 mm × 40 mm
  • Mating height with standard connectors: 8mm
  • PCB thickness: 1.6mm

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Figure 7: Physical dimensions of the TE0741-02 module. All dimensions are shown in millimeters.

Weight

19 g - Plain module.

8.8 g - Set of nuts and bolts.

Revision History

Hardware Revision History

...

  • improved power-on -sequencing
  • added differential terminator
    to bank 14 clock input

...

Hardware revision number is written on the PCB board together with the module model number separated by the dash.

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Document Change History

DateRevisionContributorsDescription2017-01-12Correction: B2B  and FPGA Bank location2016-12-14

19

TRM revision

2013-12-020.1Initial version

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