Page History
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Parameter | Min | Max | Units | Notes |
|---|---|---|---|---|
Vin supply voltage | -0.3 | 6.0 | V | |
Vin33 supply voltage | -0.4 | 3.6 | V | |
| VBat supply voltage | -1 | 6.0 | V | |
| PL IO Bank supply voltage for HR I/O banks (VCCO) | -0.5 | 3.6 | V | |
PL IO Bank supply voltage for HP I/O banks (VCCO) | -0.5 | 2.0 | V | TE0715-xx-15 does not have HP banks |
| I/O input voltage for HR I/O banks | -0.4 | VCCO_X+0.55 | V | |
| I/O input voltage for HP I/O banks | -0.55 | VCCO_X+0.55 | V | TE0715-xx-15 does not have HP banks |
| GT Receiver (RXP/RXN) and Transmitter (TXP/TXN) | -0.5 | 1.26 | V | |
Voltage on Module JTAG pins | -0.5 | VCCO_0+0.55 | V | VCCO_0 is 3.3V nominal |
Storage Temperature | -40 | +100 | C |
| Note |
|---|
| Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Zynq device (DS181 Artix or DS182 Kintex). |
Physical Dimensions
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.
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