Page History

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Parameter	Min	Max	Units	Notes
Vin supply voltage	-0.3	6.0	V
Vin33 supply voltage	-0.4	3.6	V
VBat supply voltage	-1	6.0	V
PL IO Bank supply voltage for HR I/O banks (VCCO)	-0.5	3.6	V
PL IO Bank supply voltage for HP I/O banks (VCCO)	-0.5	2.0	V	TE0715-xx-15 does not have HP banks
I/O input voltage for HR I/O banks	-0.4	VCCO_X+0.55	V
I/O input voltage for HP I/O banks	-0.55	VCCO_X+0.55	V	TE0715-xx-15 does not have HP banks
GT Receiver (RXP/RXN) and Transmitter (TXP/TXN)	-0.5	1.26	V
Voltage on Module JTAG pins	-0.4	VCCO_0+0.55	V	VCCO_0 is 3.3V nominal
Storage Temperature	-40	+100	C

Note
Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Zynq device (DS181 Artix or DS182 Kintex).

Recommended Operating Conditions

Parameter	Min	Max	Units	Notes	Reference document
Vin supply voltage	2.5	5.5	V
Vin33 supply voltage	2.375	3.465	V
VBat supply voltage	2.7	5.5	V
PL IO Bank supply voltage for HR I/O banks (VCCO)	1.14	3.465	V		Xilinx Document DS191 (v1.17) November 24, 2015
PL IO Bank supply voltage for HP I/O banks (VCCO)	1.14	1.89	V	TE0715-xx-15 does not have HP banks	Xilinx Document DS191 (v1.17) November 24, 2015
I/O input voltage for HR I/O banks			V		Please check Xilinx Document DS191 (v1.17) November 24, 2015
I/O input voltage for HP I/O banks			V	TE0715-xx-15 does not have HP banks	Please check Xilinx Document DS191 (v1.17) November 24, 2015 and DS187 (v1.17) November 24, 2015
Voltage on Module JTAG pins	3.135	3.465	V	VCCO_0 is 3.3 V nominal

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Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8mm
PCB thickness: 1.6mm
Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

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