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The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs available.

The TEC0330 FPGA board is intended to be used as add-on card in a PCIe 2.0 or higher capable host systemsystems, it can not be used as a stand-alone device.

Block Diagram

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Figure 1: TEC0330-03 Block Diagram.

Main Components

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Figure 2: FPGA board TEC0330-03.

1. PCIe x8 connector, J1
2. FPGA JTAG connector,J9
3. User button, S2
4. SO-DIMM socket, U2
5. Xilinx Virtex-7 XC7VX330T-2FFG1157C FPGA, U1
6. ANSI/VITA 57.1 compliant FMC HPC connector, J2
7. SMA coaxial connector for external clock input, J3
8. System Controller CPLD JTAG connector, J8
9. I²C connector for LT LTM4676 step-down DC-DC regulator, J10
10. IDC header for access to 5 x high-speed data lanes (LVDS pairs), J7
11. 4-wire PWM fan connector, J4
12. 6-pin 12V power connector, J5
13. Reference clock generator @10.0 MHz (P5146) , U11
14. LDO DC-DC regulator @3.3V (LMK_3V3) (TI TPS74901RGWR), U21
15. 256 Mbit Quad SPI Flash Memory (Micron N25Q256A), U12
16. Cooling fan 5VDC M1 (45X5MM, 0.7W, 1.06CFM)
17. System Controller CPLD (Lattice Semiconductor LCMXO2-1200HC), U5
18. Ultra low jitter clock synthesizer (TI LMK04828B), U9
19. Step-down DC-DC regulator @1.0V (LT LTM4676), U4
20. Step-down DC-DC regulator @1.5V (VCC1V5) (LT LTM4676, U3
21. I²C Programmable quad clock generator (Silicon Labs Si5338A), U13
22. 4A PowerSoC DC-DC converter @1.8V (Altera EN6347QI, U20
23. LDO DC-DC regulator @1.0V (MGTAVCC_FPGA) (TI TPS74401RGW), U18
24. LDO DC-DC regulator @1.2V (MGTAVTT_FPGA) (TI TPS74401RGW), U17
25. 4A PowerSoC DC-DC converter @3.3V (3V3FMC) (Altera EN6347QI), U15
26. 4A PowerSoC DC-DC converter @1.8V (FMC_VADJ) (Altera EN6347QI), U7

Key Features

• Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
• FPGA board designed as PCIe card is fitting in PCI Express x8 slots (PCIe 2.0 or higher)
• FMC High Pin Count (HPC) Connector
• 8 MGT lanes available on PCIe interface
• DDR3 SO-DIMM Socket
• 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
  • FPGA
  • JTAG port (SPI indirect (Bus width x4))
• External Clock Input via SMA coaxial connector
• 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
• FPGA configuration through:
  • JTAG connector
  • SPI Flash memory
• Programmable quad PLL clock generator
• TI LMK04828B ultra low-noise high-performance clock synthesizer (jitter cleaner)
• On-board high-efficiency DC-DC converters
• Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
• System management and power sequencing
• AES bit-stream encryption
• eFUSE bit-stream encryption

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Key Features

• Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
• PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
• FMC High Pin Count (HPC) connector
• 8 FPGA MGT lanes available on PCIe interface
• DDR3 SO-DIMM SDRAM socket
• 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
  • FPGA
  • JTAG port (SPI indirect, bus width x4)
• External clock input via SMA coaxial connector
• 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
• FPGA configuration through:
  • JTAG connector
  • Quad SPI Flash memory
• Programmable quad clock generator
• TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
• On-board high-efficiency DC-DC converters
• Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
• System management and power sequencing
• AES bit-stream encryption
• eFUSE bit-stream encryption

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Figure 1: TEC0330-03 block diagram.

Main Components

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Figure 2: FPGA board TEC0330-03.

1. PCI Express 2.0 x8 connector, J1
2. FPGA JTAG connector, J9
3. User button, S2
4. SO-DIMM socket, U2
5. Xilinx Virtex-7 XC7VX330T-2FFG1157C FPGA, U1
6. ANSI/VITA 57.1 compliant FMC HPC connector, J2
7. SMA coaxial connector for external clock input, J3
8. System Controller CPLD JTAG connector, J8
9. I²C connector for LT LTM4676 step-down DC-DC regulator, J10
10. IDC header for access to 5 x high-speed data lanes (LVDS pairs), J7
11. 4-wire PWM fan connector, J4
12. 6-pin 12V power connector, J5
13. Reference clock generator @10.0 MHz (P5146) , U11
14. LDO DC-DC regulator @3.3V (LMK_3V3) (TI TPS74901RGWR), U21
15. 256 Mbit Quad SPI Flash Memory (Micron N25Q256A), U12
16. Cooling fan 5VDC M1 (45X5MM, 0.7W, 1.06CFM)
17. System Controller CPLD (Lattice Semiconductor LCMXO2-1200HC), U5
18. Ultra low jitter clock synthesizer (TI LMK04828B), U9
19. Step-down DC-DC regulator @1.0V (LT LTM4676), U4
20. Step-down DC-DC regulator @1.5V (VCC1V5) (LT LTM4676, U3
21. I²C Programmable quad clock generator (Silicon Labs Si5338A), U13
22. 4A PowerSoC DC-DC converter @1.8V (Altera EN6347QI, U20
23. LDO DC-DC regulator @1.0V (MGTAVCC_FPGA) (TI TPS74401RGW), U18
24. LDO DC-DC regulator @1.2V (MGTAVTT_FPGA) (TI TPS74401RGW), U17
25. 4A PowerSoC DC-DC converter @3.3V (3V3FMC) (Altera EN6347QI), U15
26. 4A PowerSoC DC-DC converter @1.8V (FMC_VADJ) (Altera EN6347QI), U7

Initial Delivery State

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The high-pin count (HPC) FMC (FPGA Mezzanine Card) connector (J2) is a standard ANSI/VITA 57.1 modular interface to the FPGA and provides access to numerous FPGA I/O pins for use by other mezzanine modules and expansion cards. The FMC connector supports single ended I/O (with several VCCIO voltages available) and LVDS I/O signaling.

The I/O signals are routed from the FPGA I/O banks to the FMC connector as LVDS pairs:

Table 2:   FMC connector pin-outs of available logic banks Overview of the FPGA I/O bank signals routed to the FMC.

The FMC connector provides also access to the MGT banks of the FPGA. There are also 10 high-speed data links MGT lanes (Xilinx GTH transceiver) available composed as differential signaling pairs for both directions (RX/TX), means from card to (mezzanine) module and vice versa.The MGT banks have also clock input-pins which are exposed to the FMC connector. Following MGT lanes are available transceivers) from different FPGA MGT banks routed to the FMC connector. Following MGT lanes are available on the FMC connector:

Table 3:   FMC connector pin-outs of available MGT lanes of the FPGAOverview of MGT banks lanes routed to the FMC connector.

The FMC connector has also two reference clock input pairs (LVDS) routed to the FPGA MGT bank 117, see also section MGT lanes.

There are also JTAG, I²C interface and power good control signals routed between FMC connector and provides further interfaces like 'JTAG' and 'I²C' to the System Controller CPLD:

Table 4:  FMC connector pin-outs of available interfaces to the System Controller CPLD.

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FPGA bank 17 and 18 clock inputs from FMC connector:

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Several VCCIO voltages are available on the FMC connector for FPGA I/O banks:

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The TEC0330 FPGA board is also a PCI Express card designed to fit in computing into systems with PCI Express x8 slots (PCIe 2.0 or higher) and is PCIe Gen. 2 capable. 8 See next section for the overview of FPGA MGT lanes are routed to the PCIe interface composed of .

MGT Lanes

MGT (Multi Gigabit Transceiver) lane consists of one receive and one transmit (RX/TX LVDS pairs for each lane:

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MGT-lanes count
(RX/TX LVDS-pairs)

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1 reference clock from  programmable quad PLL clock generator
U13 to bank's pins AB6/AB5

1 reference clock from PCIe interface J1 to bank's pins AD6/AD5

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Table 7: MGT lanes available on PCIe interface.

JTAG Interfaces

JTAG interfaces are accessible on the TEC0330 board  to program the FPGA or the System Controller CPLD:

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CPLD JTAG

VCCIO: 3V3PCI

Connector: J8

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J8-4

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FPGA JTAG

VCCIO: 1V8

Connector: J9

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FMC JTAG

VCCIO: 3.3VPCI

Connector: J2

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Table 8: JTAG Interface on TEC0330 board.

SO-DIMM Socket for DDR3-RAM

The TEC0330 board can be upgraded with a DDR3 SO-DIMM (204-pin). For this purpose the board is equipped with a 204-pin SO-DIMM socket U2. The DDR3 memory interface is routed to the FPGA banks 34, 35 and 36.

The reference clock signal for the DDR3 interface is generated by the quad programmable reference clock U13 and is applied to bank 35.

There is also a I²C-interface between the System Controller CPLD and the DDR3 memory interface:

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) differential pairs, four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, FMC connector pin connection and FPGA pin connection information.

FPGA to FMC Connector MGT lanes

Table 8: FPGA to FMC connector MGT lanes overview (continue on next page).

FPGA to FMC Connector MGT lanes (continued)

Table 8: FPGA to FMC connector MGT lanes overview.

FPGA to PCIe Connector MGT lanes

Table 9: FPGA to PCIe connector MGT lanes overview.

Following table lists reference clock sources of the MGT banks.

Table 10: MGT banks reference clock sources.

JTAG Interfaces

There are three JTAG interfaces available on the TEC0330 board:

Table 11: JTAG interfaces on TEC0330 board.

On-board Peripherals

System Controller CPLD

The System Controller CPLD is the central system management unit that provides numerous interfaces between the on-board peripherals

Table 9: I²C-interface between SC CPLD and DDR3 memory.

System Controller CPLD

The System Controller CPLD is the central system management unit that provides numerous interfaces between the on-board peripherals and to the FPGA module. The signals routed to the CPLD will be linked by the logic implemented in the CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. So some interfaces between the on-board peripherals and to the FPGA module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence, the proper programing of the FPGA module and to display its programming state.

Table 1012: VCCIO voltages of CPLD banks.

Following table describes the interfaces and functionalities established by of the CPLD, which weren't discussed System Controller CPLD not described elsewhere in this TRM:

Table 11: System Controller CPLD functionalities.

Clocking

Table 13: Overview of the System Controller CPLD functions.

SO-DIMM Socket for DDR3 SDRAM

The TEC0330 board supports additional DDR3 SO-DIMM via 204-pin socket U2. The DDR3 memory interface is routed to the FPGA banks 34, 35 and 36.

The reference clock signal for the DDR3 interface is generated by the quad programmable clock generator U13 and is applied to the FPGA bank 35.

There is also a I²C interface between the System Controller CPLD and the DDR3 SDRAM memory:

Table 14: I²C-interface between SC CPLD and DDR3 SDRAM memory.

Quad SPI Flash Memory

An 256 Mbit (32 MByte) Quad SPI Flash Memory (Micron N25Q256A, U12) is provided for FPGA configuration file storage. After configuration process completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency. The memory can be accessed indirectly by the FPGA JTAG port (J9) by implementing the functional logic for this purpose inside the FPGA.

Clock sources

The TEC0330 FPGA board has a sophisticated clock generation and conditioning system to meet the requirements of the Xilinx Virtex-7 GTH units with data transmission rates up to 13.1 Gb/s.

Clock sources

List of on-board and external reference clock signals of the TE0330 board:

Table 1215: Clock generator sources overview.

Programmable

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Clock Generator

There is a Silicon Labs I²C programmable quad PLL clock generator Si5338A (U13) on-board. It's output frequencies can be programmed by using the are programmable via FPGA I²C -bus with address 0x70interface using slave device address 0x70 (corresponding I²C logic has to be implemented in FPGA design).

A 25 MHz (U14) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.Once running, the frequency and other parameters can be changed by programming the device using the I²C-bus connected between the FPGA (master) and clock generator (slave). Logic needs to be generated inside the FPGA-module to utilize I²C-bus correctly3 (IN3) and is used to generate the output clocks.

Table 1316: I/O pin description of PLL programmable clock generator Si5338A.

Ultra low-noise high-performance clock synthesizer

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Logic needs to be generated inside the FPGA module to utilize SPI bus correctly.

Table 14: Pin description of clock synthesizer TI LMK04828B.

32 MByte Quad SPI Flash Memory

Table 17: Pin description of clock synthesizer TI LMK04828BAn 256 Mbit (32 MByte) Quad SPI Flash Memory (Micron N25Q256A, U12) is provided for FPGA configuration file storage. After configuration process completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency. The memory can be accessed indirectly by the FPGA JTAG port (J9) by implementing the functional logic for this purpose inside the FPGA.

Power and Power-On Sequence

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Table 1518: Maximum current of Typical power suppliesconsumption.

TBD  - To Be Determined.

Power-On Sequence

The on-board voltages of the TEC0330 FPGA board will be are powered - up in order of a determined predefined sequence after the external voltages ' 12V ' on connector J5 and ' 3V3PCI ' on connector J1 are become available.

Core voltages and main supply voltages have to reach stable state and their "Power Good" - signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.

Following diagram clarifies describes the sequence of enabling the particular on-board voltages:

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Figure 3: FPGA board TEC0330-03 Powerpower-On on sequence diagram.

Bank Voltages

Table 1619: Range of FPGAs bank voltages.

See Xilinx Virtex-7 datasheet (DS183) for the voltage ranges allowed.

Power Rails

Table 1720: Power rails and corresponding connectors of the FPGA board on accessible connectors.

Technical Specifications

Absolute Maximum Ratings

Table 1821: Absolute maximum ratings.

Recommended Operating Conditions

Table 1922: Recommended operation conditions.

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All dimensions are given in millimeters.

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Figure 4: Physical dimensions of the TEC0330-03 board.

Weight

156 g - Plain board.

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Hardware Revision History

Table 2023: Hardware revision history.

Hardware revision number is printed on the PCB board together with the model number separated by the dash.

Figure 5: TE0330 board hardware revision number.

Document Change History

Table 2124: Document change history.

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