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eMMC Flash memory device(U15) is connected to the Zynq PS MIO bank 501 pins MIO46..MIO51 (see also 54395765 Variants Currently in Production for options). Depending on the module variant, different make and model of eMMC chips are available.

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Variants Currently in Production

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B2B Connector

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Note: Only table was changed, chapter must be updated in case of TRM Style update


Trenz shop TE0720 overview page
English pageGerman page

Table 21: Module variants currently in production.

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Table 21: Module variants currently in production.

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

-0.36.5

V

EP53F8QI datasheet.
3.3VIN supply voltage-0.13.75VTPS27082L and LCMXO2-1200HC datasheets.
Supply voltage for PS MIO banks-0.53.6VSee Xilinx DS187 datasheet.
I/O input voltage for MIO banks-0.4VCCO_MIO + 0.55V

See Xilinx DS187 datasheet.

(VCCO_MIO0_500, VCCO_MIO1_501)

Supply voltage for HR I/Os banks-0.53.6V

See Xilinx DS187 datasheet.

(VCCIO13, VCCIO33, VCCIO34, VCCIO35)

I/O input voltage for HR I/O banks-0.4VCCIO + 0.55VSee Xilinx DS187 datasheet.

Storage temperature

-40

+85

°C

-
Storage temperature without the ISL12020MIRZ, eMMC Flash and 88E1512 PHY installed-55+100°CNB! Module variants using Nanya SDRAM chips, max temperature limit is +125 °C.

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dateFormatyyyy-MM-dd
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infoTypeCurrent version
prefixv.
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infoTypeModified by
typeFlat

  • changed currently available chapter to new style
2021-06-21v.93Mohsen Chamanbaz
  • fix typo for LED location on main component section
2019-02-05v.92John Hartfiel
  • small document update

2018-07-05

v.89John Hartfiel
  • Update power rail section
2017-11-10

v.85

John Hartfiel
  • Replace B2B connector section
2017-09-07

v.84

John Hartfiel
  • Correction of Boot Mode section
2017-08-31

v.83

Jan Kumann
  • Initial document.

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infoTypeModified users
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