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Refer to https://wiki.trenz-electronic.de/display/PD/TEBB0714+TRM for the current online version of this manual and other available documentation.

The Trenz Electronic TEBB0714 is a Carrier Board for testing, evaluation and development purposes, especially for the Multi Gigabit Transceiver units of the TE0714 module. Although this base-board is dedicated to the TE0714 module, it is also compatible with other Trenz Electronic 4 x 3 cm SoMs. See page "4 x 3 cm carriers" to get information about the SoMs supported by the TEBB0714 Carrier Board.

This base-board provides also solder pads as place-holders through hole pads for pin headers as option to get access to the PL I/O-bank pins and further interfaces of the mounted TE 4 x 3 SoM.

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  1. 6-pin header J26 for selecting PL-bank I/O voltage
  2. 6-pin header J27 for selecting XMOD/JTAG VCCIO
  3. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
  4. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
  5. XMOD header, JX1
  6. Ultra small SMT coaxial connector, J5
  7. Ultra small SMT coaxial connector, J6
  8. Ultra small SMT coaxial connector, J7
  9. Ultra small SMT coaxial connector, J8
  10. User LED D1 (green)
  11. User LED D2 (red)
  12. LED D3 (red) indicating FPGA's 'Programming DONE'-signal
  13. SFP+ Connector, J1
  14. 10-pin header solder pads J4 for access to SoM's PL I/O-banks (LVDS pairs possible)
  15. 16-pin header solder pads J3, JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible pin-assignment)with ADC and MGT clock input
  16. 50-pin header solder pads J20 for access to SoM's PL I/O-banks (LVDS pairs possible)
  17. 50-pin header solder pads J17 for access to SoM's PL I/O-banks (LVDS pairs possible)

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On-board Pin Header
Control Signals and InterfacesCount of I/O'sNotes
J17User I/O36 single ended or 18 differential-
QSPI interface6-
J20

User I/O

42 single ended or 21 differential-
J3JTAG4-
UART2-
SoM control signals2'BOOTMODE', 'PROG_B'
ADC1 differential pair-
MGT reference clock input1 differential pairAC decoupled on-board (100 nF capacitor)
JX1JTAG4-
UART2-
SoM control signals2'BOOTMODE', 'PROG_B'
J4User I/O6 single ended or 3 differential3.3V, 3.3V_OUT voltage level available on header

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Pin Schematic NameXMOD Header JX1 PinB2BNote
TCKC (pin 4)JM1-90-
TDOD (pin 8)JM1-88-
TDIF (pin 10)JM1-86-
TMSH (pin 12)JM1-92-
B14_L25A (pin 3)JM2-97UART -TX (transmit line(output from module to XMOD Programmer)
B14_L0B (pin 7)JM2-99UART -RX (receive line(input to module from XMOD Programmer)
BOOTMODEE (pin 9)JM2-100-
PROG_BG (pin 11)JM1-94-

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V_CFG Value

Jumper J27 SettingNote
1.8Vpins 1-2 connectedModule's output voltage.
V_CFG0*pins 3-4 connectedInternal module VCCIO: 3.3V or 1.8V (Settable by 0-Ohm-Resistor on TE0714 module).
3.3V_OUTpins 5-6 connectedModule's output voltage.

*Default setting, do not changed, if V_CFG0 Bank power is sourced by module itself.

Table 8: Setting of reference I/O-voltage XMOD header.


Note

Use Xilinx compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx Zynq devices.

The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download.

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As alternative to the XMOD header JX1, on the Carrier Board pin header J3 is present , which has a XMOD header-compatible pin-assignment, but also with 4 additional pins as differential pairs to supply the mounted SoM with an external MGT reference clock signal and as to provide differential analog signal input:

Pin Schematic NameHeader J3 PinB2BNote
TCK4JM1-90-
TDO8JM1-88-
TDI10JM1-86-
TMS12JM1-92-
B14_L253JM2-97UART -TX (transmit line(output from module)
B14_L07JM2-99UART -RX (receive line(input to module)
BOOTMODE9JM2-100-
PROG_B11JM1-94-
XADC_P13JM1-25Analog input differential pair
XADC_N14JM1-27
CLK0_N15JM1-4AC decoupled on-board (100 nF capacitor)
CLK0_P16JM1-2

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UART Signal Schematic NameB2BXMOD Header JX1Pin Header J3Note
B14_L0JM2-99JX1-7J3-7UART -RX (receive line(input to module)
B14_L25JM2-97JX1-3J3-3UART -TX (transmit line(output from module)

Table 10: UART interface signals.

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Following diagram shows the distribution of the external input voltage of nominal 3.3V to the components:

Image Modified

Figure 3: Board power distribution diagram.

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The voltage direction of the power rails is from board and on-board connectors' view:

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes
JM1

3.3V

Out

97, 99

3.3V module supply voltage
3.3V_OUTIn833.3V module output voltage
VCCIO34Out61PL IO-bank VCCIO
JM2

1.8V

In

18

1.8V module output voltage
3.3V_OUTOut543.3V module output voltage
V_CFG0In/out53Direction depends on solder option of the modul: Internal module VCCIO
:
3.3V or 1.8V or source from carrier is possible

Table 16: Power pin description of B2B module connector.

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On-board Pin Header DesignatorVCC / VCCIODirectionPinsNotes
J17

3.3V

In / Out

5, 46

3.3V external supply voltage
V_CFGOut / int6, 45VCCIO, direction depends on jumper 27 settings and module solder option
J20

3.3V

In / Out

5, 46

3.3V external supply voltage
VCCIO34In / Out6, 45PL IO-bank VCCIO, depends on Jumper settings

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Jumper / Header DesignatorVCC / VCCIODirectionPinsNotes
J26VCCIO34In1, 3, 5-
1.8VOut2-
2.5VOut4-
3.3V_OUTOut6-
J27V_CFGIn / Out1, 3, 5-direction depends on jumper 27 settings and module solder option
1.8VOut2-
V_CFG0Out4-
3.3V_OUTOut6-

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JTAG/UART Header DesignatorVCC / VCCIODirectionPinsNotes
JX1 (XMOD)3.3VOut5Connected to 3.3V external supply voltage
VIOOut6Connected to 'V_CFG', depends on jumper 27 settings
J33.3VOut5Connected to 3.3V external supply voltage
V_CFGOut6VCCIO, direction depends on jumper 27 settings and module solder option

Table 19: Power pin description of XMOD/JTAG Connector.

Board to Board

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Connector

Include Page
PD:4 x 5 SoM LSHM B2B IN:Module ConnectorsPD:4 x 5 SoM LSHM B2B
IN:Module Connectors

Technical Specifications

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ParameterMinMaxUnitsNotes

Vin supply voltage

3.135

3.465

V

3.3V supply-voltage ± 5%

Storage Temperature

-4085

°C

WL-SMCW SMD chip LED data sheet

Table 20: Board absolute Absolute maximum ratings.

Recommended Operating Conditions

 ParameterMinMaxUnitsNotes
Vin supply voltage3.1353.465V-
Operating temperature-40+85°CMolex 74441-0001 Product Specification

Table 21: Module recommended Recommended operating conditions.

Operating Temperature Ranges

Industrial grade: -40°C to +85°C.

The TEBA0841 Carrier Board itself is capable to be operated at is operable within industrial grade temperature range.

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Physical Dimensions

  • Board size:   PCB 46mm ×  75mm. Notice that some parts the are hanging slightly over the edge of the PCB like the the SFP+ connector, which determine the total physical dimensions of the carrier board. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors: 8mm

  • PCB thickness: ca. 1.65mm

  • Highest part on the PCB is the SFP+ connector, which has an approximately 11.3 mm overall hight. Please download the step model for exact numbers.

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DateRevision

Notes

PCNDocumentation Link
-

01

  • First Production Release
-TEBB0714-01

Table 22: Module hardware revision history.

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