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The Trenz Electronic TEBB0714 is a Carrier Board for testing, evaluation and development purposes, especially for the Multi Gigabit Transceiver units of the TE0714 module. Although this base-board is dedicated to the TE0714 module, it is also compatible with other Trenz Electronic 4 x 3 cm SoMs. See page "4 x 3 cm carriers" to get information about the SoMs supported by the TEBB0714 Carrier Board.

This base-board provides also through hole pads for pin headers to get access to the PL I/O-bank pins and further interfaces of the mounted TE 4 x 3 SoM.

Key Features

  • SFP+ connector (Enhanced small form-factor pluggable), support data transmission rates up to 10 Gbit/s
  • 4 Hirose Ultra small SMT coaxial connectors, support data transmission rates up to 6 Gbit/s
  • TE 4 x 3 cm SoM programmable by XMOD header (JX1)
  • 2 x user LEDs routed to I/O-pins of the SoM
  • Solder pads J17 and J20 for optional pin headers for access to SoM's PL I/O-bank pins, usable as LVDS pairs
  • Solder pads J3 and J4 for optional pin headers for access to further interfaces and I/O's of the SoM

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TEBB0714-01 Block Diagram.

Main Components

Figure 2TEBB0714-01 Carrier Board.

  1. 6-pin header J26 for selecting PL-bank I/O voltage
  2. 6-pin header J27 for selecting XMOD/JTAG VCCIO
  3. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
  4. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
  5. XMOD header, JX1
  6. Ultra small SMT coaxial connector, J5
  7. Ultra small SMT coaxial connector, J6
  8. Ultra small SMT coaxial connector, J7
  9. Ultra small SMT coaxial connector, J8
  10. User LED D1 (green)
  11. User LED D2 (red)
  12. LED D3 (red) indicating FPGA's 'Programming DONE'-signal
  13. SFP+ Connector, J1
  14. 10-pin header solder pads J4 for access to SoM's PL I/O-banks (LVDS pairs possible)
  15. 16-pin header solder pads J3, JTAG/UART header with ADC and MGT clock input
  16. 50-pin header solder pads J20 for access to SoM's PL I/O-banks (LVDS pairs possible)
  17. 50-pin header solder pads J17 for access to SoM's PL I/O-banks (LVDS pairs possible)

Initial Delivery State

Board is shipped in following configuration:

  • VCCIO voltage selection jumpers are all set to 1.8 V.
  • Pin headers (not soldered to the board, but included in the package as separate component)

Different delivery configurations are available upon request.

Signals, Interfaces and Pins

B2B Connector

With the TEBB0714 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/O's are also usable as differential pairs. The connectors provide also VCCIO voltages to operate the I/O's properly.

Following table gives a summary of the available I/O's, interfaces and differential pairs of the B2B connectors JB1, JB2 and JB3:

B2B ConnectorInterfacesCount of I/O'sNotes
JM1User I/O54 single ended or 27 differential-
MGT lanes4 differential pairs, 2 lanes-
MGT reference clock input1-
SoM control signals2'PROG_B', 'DONE'
ADC interface1 differential pair-
JM2User I/O36 single ended or 18 differential-
SFP+ Interface control signals8-
QSPI interface6-
UART interface2-
User LEDs2Red, Green
SoM control signals1'BOOTMODE'

Table 1: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

On-board Pin Header

The TEBB0714 Carrier Board has 4 footprints as soldering pads to mount 2.54mm grid size pin headers to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these pin headers, SoM's PL-I/O's are available to the user, a large quantity of these I/O's are also usable as  differential pairs.

Following table gives a summary of the pin-assignment, available interfaces and functional I/O's of the pin headers:

On-board Pin Header
Control Signals and InterfacesCount of I/O'sNotes
J17User I/O36 single ended or 18 differential-
QSPI interface6-

User I/O

42 single ended or 21 differential-
SoM control signals2'BOOTMODE', 'PROG_B'
ADC1 differential pair-
MGT reference clock input1 differential pairAC decoupled on-board (100 nF capacitor)
SoM control signals2'BOOTMODE', 'PROG_B'
J4User I/O6 single ended or 3 differential3.3V, 3.3V_OUT voltage level available on header

Table 2: General overview of PL I/O signals, SoM's interfaces and control signals connected to the on-board connectors.

SFP+ Connector

The TEBB0714 Carrier Board is equipped with one SFP+ connector J1 (board-rev. 01: Molex 74441-0001). The connector is embedded into a SFP cage J2 (board-rev. 01: Molex 74737-0009).

The differential RX/TX data lanes are connected to B2B connector JM1, the control-lines are connected to B2B connector JM2.

Following table describes the pin-assignment of the SFP+ connector in detail:

SFP+ pinPin Schematic NameB2BFPGA DirectionDescriptionNote
Transmit Data + (pin 18)MGT_TX2_PJM1-14OutputSFP+ transmit data differential pair

Transmit Data - (pin 19)MGT_TX2_NJM2-16Output-
Receive Data + (pin 13)MGT_RX2_PJM1-7InputSFP+ receive data differential pair

Receive Data - (pin 12)MGT_RX2_NJM1-9Input-
Receive Fault (pin 2)SFP0_TX_FAULTJM2-42InputFault / Normal OperationHigh active logic
Receive disable (pin 3)SFP0_TX_DISJM2-44OutputSFP Enabled / DisabledLow active logic
MOD-DEF2 (pin 4)SFP0_SDAJM2-46BiDir2-wire Serial Interface data3.3V pull-up on-board
MOD-DEF1 (pin 5)SFP0_SCLJM2-48Output2-wire Serial Interface clock3.3V pull-up on-board
MOD-DEF0 (pin 6)SFP0_M-DEF0JM2-40InputModule present / not presentLow active logic
RS0 (pin 7)SFP0_RS0JM2-38OutputFull RX bandwidthLow active logic
LOS (pin 8)SFP0_LOSJM2-34InputLoss of receiver signalHigh active logic
RS1 (pin 9)SFP0_RS1JM2-32OutputReduced RX bandwidthLow active logic

Table 3: SFP+ connector pin-assignment.

Ultra Small SMT Coaxial Connectors

4 HIROSE Ultra Small Surface Mount Coaxial Connectors (up to 6 Gbit/s transmission rate) are present on the Carrier Board available for access to one MGT lane of the SoM. The connectors have the manufacturer designation 'U.FL-R-SMT-1', mating hight: 2.4 mm.

Each conductor of the RX and TX differential pair is routed to one coaxial connector:

Connector DesignatorConnected toB2B Connector

Table 4: Pin-assignment of the coaxial connectors.

JTAG Interface

JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JX1 and pin header J3. With the TE0790 XMOD USB2.0 to JTAG adapter, the device of the mounted SoM can be programed via USB2.0 interface.

JTAG Signal

B2B Connector Pin

XMOD Header JX1Pin Header J3Note

Table 5: JTAG interface signals.

XMOD FTDI JTAG-Adapter Header JX1

The JTAG interface of the mounted SoM can be accessed via XMOD header JX1, so in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM can be programmed via USB2.0 interface. The TE0790 board provides also an UART interface to the SoM's Zynq device which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted.

Following table describes the signals and interfaces of the XMOD header JX1:

Pin Schematic NameXMOD Header JX1 PinB2BNote
TCKC (pin 4)JM1-90-
TDOD (pin 8)JM1-88-
TDIF (pin 10)JM1-86-
TMSH (pin 12)JM1-92-
B14_L25A (pin 3)JM2-97UART (output from module to XMOD Programmer)
B14_L0B (pin 7)JM2-99UART (input to module from XMOD Programmer)
BOOTMODEE (pin 9)JM2-100-
PROG_BG (pin 11)JM1-94-

Table 6: XMOD header JX1 signals and connections.

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCC and VCCIO will be sourced by the Carrier Board's and module's 3.3V supply voltage. Set the XMOD DIP-switch with the setting:

XMOD DIP-switchesPosition
Switch 1ON
Switch 2OFF
Switch 3OFF
Switch 4


Table 7: XMOD adapter board DIP-switch positions for voltage configuration.

The I/O-voltage of the XMOD adapter board with the schematic name 'V_CFG' and pin-name 'VIO' (pin 6) on XMOD header JX1 can be selected via Jumper J27:

V_CFG Value

Jumper J27 SettingNote
1.8Vpins 1-2 connectedModule's output voltage.
V_CFG0*pins 3-4 connectedInternal module VCCIO: 3.3V or 1.8V (Settable by 0-Ohm-Resistor on TE0714 module).
3.3V_OUTpins 5-6 connectedModule's output voltage.

*Default setting, do not changed, if V_CFG0 Bank power is sourced by module itself.

Table 8: Setting of reference I/O-voltage XMOD header.

Use Xilinx compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx Zynq devices.

The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download.


As alternative to the XMOD header JX1, on the Carrier Board pin header J3 is present with 4 additional pins as differential pairs to supply the mounted SoM with an external MGT reference clock signal and to provide differential analog signal input:

Pin Schematic NameHeader J3 PinB2BNote
B14_L253JM2-97UART (output from module)
B14_L07JM2-99UART (input to module)
XADC_P13JM1-25Analog input differential pair
CLK0_N15JM1-4AC decoupled on-board (100 nF capacitor)

Table 9: JTAG/UART header J3 signals and connections.

UART Interface

UART interface is available on B2B connector JM2. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals:

UART Signal Schematic NameB2BXMOD Header JX1Pin Header J3Note
B14_L0JM2-99JX1-7J3-7UART (input to module)
B14_L25JM2-97JX1-3J3-3UART (output from module)

Table 10: UART interface signals.

QSPI Interface

The QSPI interface (if available) of the mounted SoM is routed to the pin header J17. The reference I/O-voltage of the module have to be noticed when using this interface.

SD IO Signal Schematic NameB2BPin Header J17Note
SPI-DQOJM2-68J17-24QSPI data
SPI-DQ1JM2-71J17-27QSPI data
SPI-DQ2JM2-73J17-28QSPI data
SPI-DQ3JM2-70J17-23QSPI data
SPI-CLKJM2-67J17-26QSPI clock
SPI_CSJM2-69J17-25QSPI chip select

Table 11: QSPI interface signals.

On-board Peripherals

On-board LEDs

The on-board LEDs are available to the user and can be used to indicate system status and activities:

LED DesignatorColorPin Schematic NameB2B ConnectorIndicating
D1greenGLEDJM2-26Available to user.
D2redRLEDJM2-24Available to user.
D3redDONEJM1-96FPGA module programmed properly.

Figure 12: On-board LEDs

VCCIO Selection Jumper

On the TEBB0714 Carrier Board the PL-bank I/O voltage (schematic name 'VCCIO34') can be selected by the jumper J26.

VCCIO34 Value

Jumper J26 SettingNote
1.8Vpins 1-2 connectedModule's output voltage.
2.5Vpins 3-4 connectedVoltage generated by on-board LDO U1.
3.3V_OUTpins 5-6 connectedModule's output voltage.

Table 13: Base-board PL-bank I/O voltage setting.

Take care of the VCCO voltage ranges of the  particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges.

It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 3 module to avoid failures and damages to the functionality of the mounted SoM.

Power and Power-On Sequence

Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current

Table 14: Typical power consumption.

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

To avoid any damage to the module, check for stabilized on-board voltages and VCCIO's before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence.

Power Supply

Power supply with minimum current capability of 3A at 3.3V for system startup is recommended.

The on-board voltages of the carrier board will be powered up with an external power-supply with nominal voltage of 3.3V.

The external power-supply can be connected to the board by the following pins:

Connector3.3V pinGND pin

JX1-5, JX1-6,

JX1-1, JX1-2
J3J3-5, J3-6J3-1, J3-2
J4J4-5J4-1, J4-2
J20J20-5, J20-46J20-1 , J20-2 , J20-49 , J20-50
J17J17-5, J17-46J17-1 , J17-2 , J17-49 , J17-50

Table 15: Connector pins capable for external 3.3V power supply

Power Distribution Dependencies

The PL-bank I/O voltages 1.8V, 2.5V and 3.3V will be available after the mounted SoM's 3.3V voltage level has reached stable state on B2B-connector pins JM1-83 and JM2-54, meaning that all on-module voltages have become stable and module is properly powered up.

Following diagram shows the distribution of the external input voltage of nominal 3.3V to the components:

Figure 3: Board power distribution diagram.

Power Rails

The voltage direction of the power rails is from board and on-board connectors' view:

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes



97, 99

3.3V module supply voltage
3.3V_OUTIn833.3V module output voltage




1.8V module output voltage
3.3V_OUTOut543.3V module output voltage
V_CFG0In/out53Direction depends on solder option of the modul: Internal module VCCIO 3.3V or 1.8V or source from carrier is possible

Table 16: Power pin description of B2B module connector.

On-board Pin Header DesignatorVCC / VCCIODirectionPinsNotes


In / Out

5, 46

3.3V external supply voltage
V_CFGOut / int6, 45direction depends on jumper 27 settings and module solder option


In / Out

5, 46

3.3V external supply voltage
VCCIO34In / Out6, 45PL IO-bank VCCIO, depends on Jumper settings

Table 17: Power Pin description of on-board connector.

Jumper / Header DesignatorVCC / VCCIODirectionPinsNotes
J26VCCIO34In1, 3, 5-
J27V_CFGIn / Out1, 3, 5direction depends on jumper 27 settings and module solder option

Table 18: Power Pin description of VCCIO selection jumper pin header.

JTAG/UART Header DesignatorVCC / VCCIODirectionPinsNotes
JX1 (XMOD)3.3VOut5Connected to 3.3V external supply voltage
VIOOut6Connected to 'V_CFG', depends on jumper 27 settings
J33.3VOut5Connected to 3.3V external supply voltage
V_CFGOut6direction depends on jumper 27 settings and module solder option

Table 19: Power pin description of XMOD/JTAG Connector.

Board to Board Connector

Board to board connectors are hermaphroditic. Odd pin numbers are connected to even pin numbers on the mating connector and vice versa.

The Trenz Electronic modules use 100-pin REF-189016-02 and 60-pin REF-189017-02 connectors which are compatible with Samtec Razor Beam LSHM type connectors (see table below). When using the same type of connectors on baseboard, mating height will be 8mm. Other mating heights are possible by using connectors with a different height.

Baseboard ConnectorCompatible ConnectorNumber of PinsMating height
REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR100 (2 x 50)6.5 mm
LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR100 (2 x 50)7.0 mm
REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR100 (2 x 50)8.0 mm
LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR100 (2 x 50)10.0mm
REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR60 (2 x 30)6.5 mm
LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR60 (2 x 30)7.0 mm
REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR60 (2 x 30)8.0 mm
LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR60 (2 x 30)10.0mm

Modules can be manufactured using different type of connectors upon request.

The LSHM connector speed rating depends on the stacking height:

Stacking HeightSpeed Rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.9 GHz / 14 Gbps
Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 3 hours 3 axis
Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf 11 01, 2017 by Jan Kumann
PDF File lshm_dv.pdf 11 01, 2017 by Jan Kumann
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf 11 01, 2017 by Jan Kumann
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf 11 01, 2017 by Jan Kumann
PDF File REF-189016-01.pdf 11 01, 2017 by Jan Kumann
PDF File REF-189016-02.pdf 11 01, 2017 by Jan Kumann
PDF File REF-189017-01.pdf 11 01, 2017 by Jan Kumann
PDF File REF-189017-02.pdf 11 01, 2017 by Jan Kumann
PDF File TC0923--2523_report_Rev_2_qua.pdf 11 01, 2017 by Jan Kumann
PDF File tc0929--2611_qua(1).pdf 11 01, 2017 by Jan Kumann

Technical Specifications

Absolute Maximum Ratings


Vin supply voltage




3.3V supply-voltage ± 5%

Storage Temperature



WL-SMCW SMD chip LED data sheet

Table 20: Absolute maximum ratings.

Recommended Operating Conditions

Vin supply voltage3.1353.465V-
Operating temperature-40+85°CMolex 74441-0001 Product Specification

Table 21: Recommended operating conditions.

Operating Temperature Ranges

Industrial grade: -40°C to +85°C.

The Carrier Board is operable within industrial grade temperature range.

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

  • Board size: PCB 46mm ×  75mm. Notice that some parts the are hanging slightly over the edge of the PCB like the the SFP+ connector, which determine the total physical dimensions of the carrier board. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors: 8mm

  • PCB thickness: ca. 1.65mm

  • Highest part on the PCB is the SFP+ connector, which has an approximately 11.3 mm overall hight. Please download the step model for exact numbers.

 The dimensions are given in mm and mil (milli inch).

Figure 4: Board physical dimensions drawing.

Revision History

Hardware Revision History



PCNDocumentation Link


  • First Production Release

Table 22: Module hardware revision history.

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Figure 5: Board hardware revision number.

Document Change History





Ali Naseri, Jan Kumann
  • First TRM release

Table 23: Document change history.


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Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).


Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.


Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

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