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The Trenz Electronic TE0706 carrier board provides functionality for testing, evaluation and development purposes of company's 4 x 5 cm SoMs (System on Module). The Carrier board is equipped with various components and connectors for different configuration setups and needs. On-module functional components and multipurpose I/Os of the SoM's PL logic are connected via board-to-board connectors to the carrier board components and connectors for easy user access.

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1. 5V power connector jack, J1
2. Reset switch, S2
3. USB type A receptacle, J7
4. Micro SD card socket with detect switch, J4
5. 50 pin IDC male connector, J5
6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
8. JTAG/UART Connector, JX1
9. User DIP switch block, S1
10. VCCIO voltage selection jumper block, J10 - J12
11. External connector (VG96) placeholder, J6
12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3

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• VG96 backplane connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) to access FPGA bank's I/OIO-pins
• SDIO port expander with voltage-level translation
• Micro SD card socket, routed to B2B-connector JB1
• USB type A connector (OTG mode), routed to B2B-connecor JB3
• 1 x user-push button S2, routed to RESIN-pin on B2B-connector JB2. By default it is configured as system reset button.
• 1 x RJ45 Gigabit Ethernet MagJack J3, PHY_MDI interface routed to B2B-connector JB1.
• 1 x Marvell Alaska 88E1512 Ethernet PHY, routed to B2B-connector JB3 and accessible via RJ45 Gigabit Ethernet MagJack J2
• Barrel jack for 5 V Power Supply input
• 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3 V Power Supply
• Trenz 4 x 5 Module Socket (3 x Samtec LSHM series connectors)
• JTAG/UART-pins on 12-pin header JX1, routed to B2B-connector JB2
• user configurable DIP switch S1 to set System Controller CPLD signals on SoM
• 3 x  VCCIO selection jumper J10, J11 and J12 to set SoM's bank voltages

Initial Delivery State

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For detailed information about the B2B pin out, please refer to the Master Pin-out Table. 

JTAG/UART Interface

JTAG access to the SoMs Xilinx Zynq chip on the SoM is provided via 12-pin header JX1 and controlled by DIP switch S1-2. JTAG pins are routed to the JB2 and JX1 connectors as follows:

On connector JX1 there also two pins available, which can be used as RX-/TX-lane for UART:

Micro SD Card Socket

Micro SD Card socket is not directly wired to the B2B connector pins, but through a Texas Instruments TXS02612 SDIO port expander, which is needed for voltage translation due to the different voltage levels of the Micro SD Card and MIO bank 501 of the Xilinx Zynq 7000 chip. The Micro SD Card has 3.3 V signal voltage-level, but the MIO Bank 501 on the Xilinx Zynq 7000 chip is set to 1.8 V.

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DIP switch S1

Connector J5 and J6

On the TE0706-02 carrier board there is one 50-pin IDC male connector socket available for access to the SoM's PL IO-bank-pins. 32 module's IO-pins are also usable as 18 LVDS-pairs and 8 IO's as single-ended (MIO0, MIO9 - MIO 15), which give access to the MIO0-bank of the Zynq-module if mounted. The available VCCIOs on this connector are 3.3V and M3.3VOUT from module. This connector gives also access to the LEDs of MagJack J2.

Place-holder J6 provides the possibility to mount and solder a VG96 backplane connector te get access to SoM's PL IO-bank-pins. 82 IO's are available on this connector, which are also usable as up to 41 LVDS-pairs. The available VCCIOs on this connector are 3.3V and M3.3VOUT from module and also the selectable PL I/O bank supply-voltages VCCIOA and VCCIOC. The pins A1, A2 are connected to the barrel jack for 5 V Power Supply input.

Power and Power-On Sequence

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