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See also section FPGA IO Banks Pin Mapping, pins DSI_XA and DSI_XB.
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HDMI Interface
HDMI interface is routed from Zynq SoC bank 34 to the external connector J6 via EMI4192 ESD protector/EMI filters.
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Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content. |
4-Channel I2C Multiplexer
Zynq MIO pin 48 (MUX_SCL) and pin 49 (MUX_SDA) are connected to the 4-channel I2C multiplexer chip TCA9544A from Texas Instruments having I2C address of 0x70. It has four slave I2C channels which are routed as follows:
| Channel | Connected To |
|---|---|
| 0 | Connector J8, pin 27 (ID_SDA) and pin 28 (ID_SCL). |
| 1 | DSI connector J4, pin 12 (DSI_SDA) and pin 11 (DSI_SCL). |
| 2 | HDMI connector J6, pin 16 (SDA) and pin 15 (SCL). |
| 3 | CSI-2 camera connector J3, pin 14 (CSI_SDA) and pin 13 (CSI_SCL). |
Each slave channel of TCA9544A has its own dedicated interrupt signal in order for the master to detect an interrupt on the INT output pin that can result from any of the slave devices connected to the INT0-INT3 input pins.
Boot Process
Xilinx Zynq devices in CLG225 package do not support SD Card boot directly from ROM bootloader.
At least FSBL must be loaded from on-board SPI Flash, later all boot process can continue from SD Card. The easiest solution is to let FSBL to load bitstream and u-boot from SPI Flash, and then let u-boot to load Linux or any other OS image from SD Card.
Boot Modes
Xilinx Zynq devices in CLG225 package do not not support SD Card boot directly from ROM bootloader.
At least FSBL must be loaded from on-board SPI Flash, later all boot process can continue from SD Card. The easiest way is to let FSBL to load bitstream and u-boot from SPI Flash, and then let u-boot to load linux or any other OS image from SD Card.
Power and Power-On Sequence
To power-up a module, 5.0V power supply with minimum current capability of 1A is recommended.
Power Supply
TE0726 needs one single power source via micro-USB jack J1. However it is recommended to not use any USB equipment below USB standard 2.0 to power the module. Also two-pin header J5 can be used to provide power source if needed.
Power-On Sequence
There is no specific power-on sequence.
Power Rails and Bank Voltages
Rail/Bank | Name | Voltage | Notes |
|---|---|---|---|
| VCCINT | VCCINT | 1.0V | |
| VCCPLL | VCCPLL | 1.8V | |
| VCCBATT_0 | VCCBATT_0 | 1.8V | |
| VCCAUX | VCCAUX | 1.8V | |
| VCCPAUX | VCCPAUX | 1.8V | |
| VCCADC_0 | VCCADC_0 | 1.8V | |
| RSVDVCC1..3 | RSVDVCC1..3 | 3.3V | |
| 0 | VCCO_0 | 3.3V | Configuration bank. |
34 | VCCO_34 | 3.3V | |
| 35 | VCCO_35 | 1.8V |
|
| 500 | VCC_MIO_500 | 3.3V | |
| 501 | VCC_MIO_501 | 3.3V | |
502 | VCCO_DDR_502 | 1.35V | DDR3L SDRAM power-supply. |
Variants Currently in Production
| TE0726 Variant | Zynq SoC | RAM | Flash | Ethernet | Temperature Range |
|---|---|---|---|---|---|
| TE0726-03R | XC7Z010-1CLG225C | 128 MByte | 16 MByte | - | Commercial grade |
| TE0726-03M | XC7Z010-1CLG225C | 512 MByte | 16 MByte | 10/100 Mbit | Commercial grade |
| TE0726-03-07S-1C | XC7Z007S-1CLG225C | 512 MByte | 16 MByte | 10/100 Mbit | Commercial grade |
Technical Specifications
Physical Dimensions
Normally TE0726 module is powered by micro-USB connector J1 VBUS pin, which voltage level is controlled by host according to the USB standards and should be 5V, so there is not much user can control here if using standard USB equipment. However if power.
Absolute Maximum Ratings
Parameter | Min | Max | Units | Notes |
|---|---|---|---|---|
Power supply voltage | 2.7 | 5.5 | V | See AP2152SG-13 datasheet. Not applicable if TE0726 module is powered by micro-USB connector J1 as VBUS pin voltage level of 5V is controlled by the supplying side equipment. |
Storage temperature | -55 | +125 | °C | - |
Recommended Operating Conditions
| Parameter | Min | Max | Units | Notes |
|---|---|---|---|---|
| Power supply voltage | 2.7 | 5.5 | V | See AP2152SG-13 datasheet. |
| Operating temperature | 0 | 70 | °C | - |
Physical Dimensions
Module size: 40 mm × 30 mm. Please download the assembly diagram for exact numbers.Module size: 40 mm × 30 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm
PCB thickness: 1.6 mm
Highest part on PCB: approximately 2.5 mm. Please download the step model for exact numbers.
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Date | Revision | Contributors | Description |
|---|---|---|---|
| 2017-05-24 | John Hartfiel | Weight | |
2017-05-24 | V.1 | Jan Kumann | Initial version. |
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