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Overview

The Trenz Electronic TE0726 is an industrial/extended grade module based on AMD Zynq 7 Series. It is Raspberry Pi form-factor compatible.

Refer to http://trenz.org/te0726-info for the latest online version of this manual and other available documentation.

Key Features

  • SoC/FPGA/Module
    • Package:                      CLG225
    • Device:                        Z-7007S, Z-7010, 1)
    • Temperature ranges:  Commercial / Extended / Industrial 1)
    • Speed grades:            -3, -2, -1 1)

  • RAM/Storage
    • 512 MByte DDR3L ECC RAM 1)
    • 16 MByte QSPI Flash 1)
    • 2 KBit EEPROM for FTDI
    • 2 KBit EEPROM for Ethernet & USB HUB
  • On Board
    • System Controller CPLD
    • USB ULPI Transceiver
    • 10/100 Ethernet Transceiver with USB hub
    • USB to JTAG / UART FTDI
  • Interface
    • 1x Micro USB (UART/JTAG)
    • 4x USB 2.0
    • 1x microSD Card socket
    • 1x Boot Select DIP switch
    • 1x Ethernet RJ45 socket
    • 1x TRRS Audio Jack 3.5mm with microphone (PWM audio only)
    • 1x HDMI Connector
    • 1x CSI-2 Connector (Camera Serial Interface)
    • 1x DSI Connector (Display Serial Interface)
    • 1x5 Pin Header for I²C
    • 2x20 Pin Header with 26 GPIO, 1x I²C , 5 and 3.3 V
    • 3 additional Pinheaders for CPLD access, Reset and PUDC (SoC Boot IO State) changes
  • Power
    • via Micro USB
    • via 5V Pin header
  • Dimension
    • 56 mm x 85 mm, like Raspberry Pi
  • Notes
    1) Depends on assembly variant

Block Diagram


TE0726 block diagram

Main Components

TE0726 main components
  1. AMD 7 Series Zynq,  U1
  2. DDR3L ECC RAM,  U8
  3. SPI Flash,  U5
  4. System Controller CPLD,  U11
  5. FTDI USB to multipurpose JTAG/FIFO,  U3
  6. USB Transceiver,  U18
  7. Ethernet Transceiver LAN9514 with 4 port USB Hub ,  U2
  8. EEPROM,  U6 , U9
  9. I2C Multiplexer,  U10
  10. Power Supply,  U16, U17, U19, U20
  11. USB power switch,  U15 , U21
  12. Oscillator, U14 , U13 , U7
  13. LED,  D1 , D2
  14. Micro USB B receptacle,  J1
  15. microSD card,  J9
  16. 2x USB A,  J11 , J12
  17. RJ-45 Ethernet connector,  J10
  18. HDMI connector,  J6
  19. DSI LCD connector,  J4
  20. CSI camera connector,  J3
  21. 3.5mm RCA audio jack,  J7
  22. +5V Power Connector,  J5
  23. Boot DIP switch, S1
  24. JTAG Port select header,  J15
  25. Boot IO State select header,  J14
  26. Externer reset header,  J13
  27. 2x20 pin header,  J8

Initial Delivery State

Storage device name

Content

Notes

Quad SPI Flash

 not programmed


EEPROM FTDI preprogrammed


EEPROM ETH not programmed
System Controller CPLD preprogrammed
Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector TypeDesignatorInterfaceIO CNTNotes
2x 20 2.54 mm Pin HeaderJ8

GPIO (HR)

26
2x 20 2.54 mm Pin HeaderJ8I²C2Multiplexer U10

2x 2.54 mm Pin Header

J15

JTAG select

1SoC or SC select

2x 2.54 mm Pin Header

J14

Boot IO State
select

1

2x 2.54 mm Pin Header

J13

External reset

1

2x USB A stacked

J11, J12

USB 2.0

12To USB PHY (ULPI)

5x 2.54 mm Pin Header

J2

I²C

2

Multiplexer U10,
I²C shared with J4

5x 2.54 mm Pin Header

J2

Interrupt

1Multiplexer U10
DIP switchS1

Boot select

1

Shared with SPI

FCC

J4

MIPI DSI

6 (3 pairs)


FCC

J4

I²C

2

Multiplexer U10
FCCJ3

I²C

2

Multiplexer U10
FCC J3

MIPI CSI-2

8 (4 pairs)


HDMIJ6

HDMI

8 (4 pairs)
HDMIJ6

I²C

2Multiplexer U10
HDMIJ6

Interrupt

1Multiplexer U10

Micro-USB 2.0 B

J1

JTAG

2 (1 pair)SoC or SC selectable
microSD CardJ9

Interrupt

1

Multiplexer U10
microSD Card J9

SD

5


RJ-45 Ethernet

J10

10/100 ETH

12To USB PHY (ULPI)

TRRS 3.5 mm

J7

RCA Audio

2

TRRS 3.5 mm

J7

RCA Mic

1
Board Connectors


Test Points

Test PointSignalNotes
TP1TDI
TP23.3V
TP3TDO
TP41.8V

TP5

TCK
TP61.0V
TP7TMS
TP81.35V
TP95V
TP10GND
TP11GND
TP12GND
TP13GND
TP14POR BZync SoC reset signal
TP15PG_1.35VPower good signal
TP16PG_1.8VPower good signal
TP17PG_3.3VPower good signal
TP18PG_1.0VPower good signal
TP19PUDCZynq SoC IO State during boot process
TP20SPI0_DQ3/M0Boot source select signal


Test Points Information


On-board Peripherals

Chip/InterfaceDesignatorConnected ToNotes

DDR3L RAM

U8
  • Zynq SoC DDR Interface PS Bank 502

System Controller CPLD

U11
  • Zynq SoC MIO Bank 35
  • MIDI DSI J4
  • MIDI CSI J3
  • FTDI U7
  • LEDs

USB-PHY

U18
  • Zynq SoC MIO and Zynq SoC USB ULPI

USB Ethernet Hub

J10
  • USB PHY
  • USB A connectors J11 and J12
  • Power switch for USB A connectors U15, U21
  • ETH connector J10
  • EEPROM U9

FTDI

U3
  • JTAG to System Controller and Zynq SoC
  • EEPROM U6

I²C Expander

U10
  • Zynq MIO (Bus master)
  • DDR3L via Voltage Bridge U12 shared with
    MIDI CSI J3
  • MIDI DSI J4 and Pin Header J2
  • HDMI socket J6
  • Pin header J8

I²C Interrupts

U10
  • Zynq MIO (Bus master)
  • microSD Card socket J9 inseration detection
  • HDMI J6 inseration detection
  • Pin header J2

Oscillator

U14
  • Zynq SoC - PS
33.3 MHz

Oscillator

U9
  • USB PHY
25 MHz

Oscillator

U7
  • FTDI
12 MHz
On board peripherals

Configuration and System Control Signals

Connector

Signal Name

Direction1)Description
S1SPI0_DDQ3 / MOIN

Boot source switch, SPI flash or SD Card

J13EXTRST , POR_B , nRSTINReset Zynq SoC
J14PUDCINState of Zynq SoC IO lines during boot
J15JMODE , BDBUS7INJTAG endpoint selction, System Controller or Zynq SoC

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Controller signal.

Power and Power-On Sequence


Power Rails

Power Rail Name/ Schematic NameConnector + PinDirection1)Notes
USB_B_Vbus

J1

INDefault power supply 5V 

5V

J5.1

IN/OUT2x Pin Header, intended for alternative powering
5V

J2.1
J8.2 , J8.4

OUT5x Pin Header
2x 20 Pin Header

5V_HDMI

J6.18

OUTHDMI, reverse current protection diode D11

V_BUS_A , V_BUS_B , V_BUS_C , V_BUS_D  

J11.A1 , J11.B1 ,
J12.A1 , J12.B1  

OUT2x USB A socket
3.3VJ8.1 , J8.17
J3.15
J4.15
J9.4
OUT2x 20 Pin Header
FCC CSI
FCC DSI
microSD Card socket

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Module power rails.

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
1USB_B_Vbus5V (± 5 %)-

Main Power supply via Micro-USB J1.



Main module power supply. 0.5 A minimum. Power consumption depends mainly on design and cooling solution. If more current is needed use J5 for external power supply.

23.3V--Module generated output voltage.


3---

External components which are connected to J8 should be powered up with 3.3V from module.

See link:
https://docs.amd.com/v/u/en-US/ds187-XC7Z010-XC7Z020-Data-Sheet
, page 8 "PL Power‐On/Off Power Supply Sequencing" for PL IO usage
Baseboard Design Hints


Technical Specifications

Absolute Maximum Ratings *)

Power Rail / Schematic NameDescriptionMinMaxUnit
USB_B_VbusDetermined through "USB 2.0 VBUS Max Limits"4.755.5V
5VDetermined through "USB 2.0 VBUS Max Limits"4.755.5V


Absolute maximum ratings

*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
   or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be differ depending on the assembly version.  Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

  • Variants of modules are described here: Article Number Information
  • Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
  • Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
  • Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
  • The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.

ParameterMinMaxUnitsReference Document
USB_B_Vbus4.755.25VSchematic of this board. SCH-TE0726-04-41C94-A.PDF page 3, table "Supported Voltage Ranges"
5V4.755.25VSchematic of this board. SCH-TE0726-04-41C94-A.PDF page 3, table "Supported Voltage Ranges"
Recommended operating conditions.

Physical Dimensions

  • Module size: 85 mm × 56 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.57 mm ± 10 %.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0726 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

Board hardware revision number.

DateRevisionChangesPCN LinkDocumentation Link
2023-06-1004

Page Numbers refer to the schematic for this revision

  • EOL components U16, U17 , U19, U20 (EN5311QI) were replaced by MPM3834CGPA
  • Added MIC bias power L12, C114 , R151 (Page 16)
  • Added Legal notices (Page 1)
  • Added power diagram (Page 4)
  • Added S1 switch and R152 for "JTAG only mode" enable (Page 8)
  • The signals were renamed:
    • SPI-DQ0/M0 ---> SPI-DQ0/M3
    • SPI-DQ3/M3 ---> SPI-DQ3/M0
  • ECC function has been added for U8 (Page 11)
  • Added I2C level shifter U12 for DDR3 ECC function (Page 11)
  • Added Buffers U24, U25 to match the level of signals (Page 6)
  • Added Diode D7, resistors R155, R160
  • EOL components L1, L2, L3, L4, L6, L7, L9, L10 BKP0603HS121-T replaced by MPZ0603S121HT000

  • EOL components D8, D9 SP5001-04TTG replaced by EMI8042MUTAG

  • Resistors R80-R82 replaced by 10 kOhm (was 1k43)

  • Added Testpoints TP15 - TP20

  • The type of testpoints TP1 - TP14 was updated. Diameter changed from 0.8 mm to 1 mm

  • CEC function is not supported. L11 was removed. C127, D5, R140, R42 are DNP

  • Power-up sequencing was updated for new DC-DC supplies

  • Capacitors C29, C32, C33 replaced by 470 nF (was 100 nF)

PCN-20230619 TE0726-03 to TE0726-04 Hardware Revision ChangeTE0726-04
2021-01-2103
  • Change DDR3 RAM (U8) from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI
  • Clock Revision Change (U7, U14) from SiT8008AI-... to SiT8008BI-...
  • Clock Revision Change (U13) from SiT8008AI-... to SiT8008BI-...
  • LEDs D1 and D2 changed to 19-213/G6C-BM1N2/DT and 19-213/R6C-AL1M2VY/3T 
  • Set S/N to not fitted
PCN-20210121 TE0726-03 DDR3 Change and Product UpdateTE0726-03
2019-04-0803
  • VBUS Resistor R94 replaced by 10 kOhm (was 12k1)
-TE0726-03
2016-05-0603
  • Introduced new variants:
    • Default with DDR3L 128 Mb
    • TE0726-03M with DDR3L 512 Mb
    • TE0726-03L with DDR3L 128 Mb, 
      without usb's, eth_phy, RJ-45, CSI, DSI, HDMI and 3.5mm jack connectors
  • Changed FTDI to 56 pins package
  • Moved LED's into Raspberry Pi 3 layout
  • Replaced POWER connector on right angle connector
  • Corected conection PUDC pin
  • Replace HDMI, DSI/CSI connector, USB stacked connectors, RJ-45, power connector)
-TE0726-03
2016-01-2602
  • CSI CLK line moved to MRCC pin, CSI lanes swap
  • CSI camera GPIO moved to MIO GPIO
  • RPi GPIO 14,15 moved from MIO to PL
  • Added 47 µF capacitor for SD Card VCC (required by SD spec) 
  • Added 47 µF capacitor for RPi camera - prevent voltage drop at camera init
  • Fixed MODE pin strapping
  • LED change 0603
  • Added POWER connector 2 pin
  • Change HDMI ESD to ESD+EMI 
  • Fixed HDMI HPD and backpower
  • DSI find solution for LS mode
  • Fixed XADC power caps
  • Changed LPDRR2 to DDR3L
-TE0726-02
 -

01

  • Inital board release
--
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

 

DateRevisionContributorDescription

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  • Removed editing bar from 2 pictures

2024-04-16

v.54

John Hartfiel

  • Updated to new TRM style.
  • Updated to board REV04.
2017-11-10
v.52
John Hartfiel
  • rework J8 header
2017-11-10v.51Ali Naseri
  • Updated Power section
  • added Power-Distribution diagram
2017-05-30

v.40

Jan Kumann
  • Absolute maximum ratings
  • Layout redesign
  • Wiki link fixed
  • SoC model removed from BD

2017-05-24

v.1

Jan Kumann

  • Initial version

--

all

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  • --
Document change history.


Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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