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Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TE0720-03 block diagram.

Components and connections marked with dashed lines are optional or may be missing on some module variants, please contact us for additional information.

Main Components

Figure 2: Main components of the module, description below.

1. Xilinx Zynq XC7Z SoC, U5
2. 4 Gbit DDR3/L SDRAM, U13
3. 4 Gbit DDR3/L SDRAM, U12
4. Low-power RTC with battery backed SRAM, U20
5. 32 MByte Quad SPI Flash memory, U7
6. Red LED (LED1), D5
7. Green LED (LED2), D2
8. System Controller CPLD, U19
9. eMMC NAND Flash, U15
10. 4A high-efficiency PowerSoC DC-DC step-down Converter (1V), U1
11. Green LED (DONE), D4
12. B2B connector Samtec Razor Beam™ LSHM-130, JM3
13. B2B connector Samtec Razor Beam™ LSHM-150, JM1
14. B2B connector Samtec Razor Beam™ LSHM-150, JM2
15. Hi-speed USB 2.0 ULPI transceiver, U18
    
16. Gigabit Ethernet (GbE) transceiver, U8
17. Low-power programmable oscillator @ 52.000000 MHz (OTG-RCLK), U14
18. Low-power programmable oscillator @ 33.333333 MHz (PS-CLK), U6
19. Low-dropout regulator (VBATT), U24
20. DDR termination regulator, U4
21. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.5V), U2
22. Atmel CryptoAuthentication chip, U10
23. 2Kbit UNI/O® serial EEPROM with EUI-48™ node identity, U17
24. Low-power programmable oscillator @ 25.000000 MHz (ETH-CLK), U9
25. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.8V), U3
26. 3A PFET load switch with configurable slew rate (3.3V), Q1

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Table 1: Initial state of programmable devices on module on delivery.

Signals, Interfaces and Pins

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Table 2: General PL I/O to B2B connectors information.

PS MIO bank 500 and 501 signal connections to B2B JM1 connector, 14 PS MIOs total.

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