Page History
...
- Xilinx XC7Z SoC (XC7Z020 or XC7Z014S)
- Processing system (PS):
- XC7Z020: Dual-core ARM Cortex-A9 MPCore™ with CoreSight™
- XC7Z014S: Single-core ARM Cortex-A9 MPCore™ with CoreSight™
- L1 cache: 32 KByte instruction, 32 KByte data per processor
- L2 cache: Unified 512 KByte
- Programmable logic (PL): Artix-7 FPGA
- Programmable logic cells: 85K (XC7Z020), 65K (XC7Z014S)
- Block RAM: 4.9 MByte (XC7Z020), 3.8 MByte (XC7Z014S)
- DSP slices: 220 (XC7Z020), 170 (XC7Z014S)
- Peak DSP performance: 276 GMACs (XC7Z020), 187 GMACs (XC7Z014S)
- 2x 12 bit, MSPS ADCs with up to 17 Differential Inputsdifferential inputs
- Processing system (PS):
- 54 multiuse I/O (MIO) pins
- 152 High-Range (HR) I/O pins (SelectIO interfaces)
- System Controller CPLD (Lattice LCMXO2-1200HC)
- 1 GByte DDR3/L memory, 2 x 256 Mbit x 16 (32-bit wide)
- 32 MByte Quad SPI Flash memory
- Gigabit Ethernet transceiver PHY (Marvell 88E1512)
- MAC address serial EEPROM with EUI-48™ node identity (11AA02E48)
- Highly integrated full-featured hi-speed USB 2.0 ULPI transceiver (Microchip USB3320C-EZK)
- 3-axis accelerometer and 3-axis magnetometer (ST Microelectronics LSM303DTR) (Optional!)
- Real time clock with embedded crystal (Intersil ISL12020M): ±5ppm accuracy
- Atmel CryptoAuthentication element (Atmel ATSHA204A)
- Up to 32 GByte eMMC, usually 4 GByte, depends on module variant and assembly option
- User LED 1 (Green), user LED 2 (Red), user LED 3 - FPGA DONE (Green)
- On-board high-efficiency DC-DC converters for all voltages used
- Trenz 4 x 5 module socket connectors (3 x Samtec LSHM series connectors)
- Evenly - spread supply pins for good signal integrity
- Rugged for shock and high vibration
...
Figure 2: Main components of the module, descriptions follow.
- Xilinx Zynq XC7Z SoC, U5
- 4 Gbit DDR3/L SDRAM, U13
- 4 Gbit DDR3/L SDRAM, U12
- Low-power RTC with battery backed SRAM, U20
- 32 MByte Quad SPI Flash memory, U7
- Red LED (LED1), D5
- Green LED (LED2), D2
- System Controller CPLD, U19
- eMMC NAND Flash, U15
- 4A high-efficiency PowerSoC DC-DC step-down Converter (1V), U1
- Green LED (DONE), D4
- B2B connector Samtec Razor Beam™ LSHM-130, JM3
- B2B connector Samtec Razor Beam™ LSHM-150, JM1
- B2B connector Samtec Razor Beam™ LSHM-150, JM2
- Hi-speed USB 2.0 ULPI transceiver, U18
- Gigabit Ethernet (GbE) transceiver, U8
- Low-power programmable oscillator @ 52.000000 MHz (OTG-RCLK), U14
- Low-power programmable oscillator @ 33.333333 MHz (PS-CLK), U6
- Low-dropout regulator (VBATT), U24
- DDR termination regulator, U4
- 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.5V), U2
- Atmel CryptoAuthentication chip, U10
- 2Kbit UNI/O® serial EEPROM with EUI-48™ node identity, U17
- Low-power programmable oscillator @ 25.000000 MHz (ETH-CLK), U9
- 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.8V), U3
- 3A PFET load switch with configurable slew rate (3.3V), Q1
...
For highest efficiency of the on-board DC-DC regulators, it is recommended to use same single 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.
...
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| VIN supply voltage | 2.5 | 5.5 | V | EN6347QI and EP53F8QI datasheets. |
| 3.3VIN supply voltage | 3.135 | 3.465 | V | 3.3V +/- 5%. |
| Supply voltage for PS MIO banks | 1.71 | 3.465 | V | See Xilinx DS187 datasheet. |
| I/O input voltage for PS MIO banks | -0.20 | VCCO_MIO + 0.20 | V | See Xilinx DS187 datasheet. |
| Supply voltage for HR I/Os banks | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. |
| I/O input voltage for HR I/O banks | -0.20 | VCCIO + 0.20 | V | See Xilinx DS187 datasheet. |
Table 23: Recommended operating conditions.
...
There is no hardware revision number marking on the module PCB.
Document Change History
Date | Revision | Contributors | Description |
|---|---|---|---|
| 2017-08-01 | Jan Kumann | Initial document. |
...
Overview
Content Tools