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Main Components

 

Figure 2: TEB0729-02 03 main components (picture shows PCB REV02).

  1. 5V barrel jack, J12
  2. RJ-45 Gigabit Ethernet MegJack, J3
  3. RJ-45 10/100-BaseT Ethernet MegJack, J4
  4. RJ-45 10/100-BaseT Ethernet MegJack, J5
  5. VG96 connector placeholder, J9
  6. XMOD (TE0790) header, JB3
  7. 2-pin header for VBAT-IN supply-voltage, J2
  8. 2x6 pin header for setting VCCIO_33, J6
  9. 2x6 pin header for setting VCCIO_13, J7
  10. MicroSD Card socket, J1
  11. Red LED, D1
  12. Push Button, S1
  13. Micro USB2.0 B Receptacle (optional USB2.0 Type A socket)
  14. VG96 connector placeholder, J8
  15. B2B Connector, JB1
  16. B2B Connector, JB2
  17. 4-bit DIP-switch, S2

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On the VG96 connector J9 are signals assigned to control the SoM and the interfaces of the SoM's Zynq chip device and of its on-module peripherals:

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VG96 ConnectorControl Signals and InterfacesCount of IO'sNotes
J8User IO24 single ended-
48 single ended or 24 differential-
J9

User IO

54 single ended-
10 single ended or 5 differential-
'NRST_IN' (pin J9-A29), 'RST_STATUS' , pins (pin J9-A29, J9-B30)2

These pins are dedicated to the specific Reset-functionality of the TE0729 SoM.

'BOARD_STAT' , pins (pin J9-B32)1-
'BOOT_MODE1' (pin J9-C31), 'BOOT_MODE2' , pins J9-C31, (pin J9-C32)2Binary bootmode code of SoM, also connected to DIP S2
I²C, pins J9-A30, J9-A312I²C1 interface of module
GbE SGMII4SGMII interface of on-module GbE PHY

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JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JB3. With the TE0790 XMOD USB2.0 to JTAG adapter, the Zynq chip device on the mounted SoM can be programed via USB2.0 interface.

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The SD IO interface of the SoM's Zynq chip device (MIO-bank) is routed to the on-board MicroSD Card socket J1. By this interface, the Zynq chip device can be booted from an inserted MicroSD Card:

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Note

Use Xilinx compatible TE0790 adapter board (designation TETE0790-0790-xx with out 'L') to program the Zynq device.

The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download.

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DIP-switches S2Signal Schematic Net NameFunctionNote
S2-1JTAGSEL

Select Zynq chip device or SC CPLD programming of mounted SoM:

OFF:  Zynq device in JTAG chain
ON:    CPLD in JTAG chain

Refer also to the TE0729 SC CPLD documentation for detailed information about JTAG update
S2-2BOOT_MODE1Select first bit of boot mode codeRefer to TE0729 TRM and SC CPLD documentation for detailed information about boot modes
S2-3BOOT_MODE2Select second bit boot mode code
S2-4xxnot used

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Table 15: Boot Modes configuration via DIP-switch S2 with default TE0729 CPLD Firmware

VCCIO

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Selection Jumper

The Carrier Board VCCIO for the PL IO-banks of the mounted SoM are selectable by the jumpers J6 and J7.

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The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq chipdevice.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

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Figure 3: Board power distribution diagram.

Power Rails

The voltage direction of the power rails is directed at on-board connectors' view:

Module Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes
JB1

VIN33

Out

1, 2, 3, 4, 5, 6

3.3V module supply voltage
VCCIO_13Out101, 102PL IO-bank VCCIO
VCCIO_33Out29, 30PL IO-bank VCCIO
3.3VIn65, 66voltage output from module
JB2

1.8V

In

49

voltage output from module
2.5VIn13voltage output from module
USB-VBUSOut107USB Host supply voltage
VBAT_INOut118RTC buffer voltage

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Jumper / Header DesignatorVCC / VCCIODirectionPinsNotes
J6VCCIO_33OutIn2, 4, 6-
1.8VInOut5-
2.5VInOut3-
3.3VInOut1-
J7

VCCIO_13

OutIn2, 4, 6-
1.8VInOut5-
2.5VInOUt3-
3.3VInOut1-

Table 20: Power Pin description of VCCIO selection jumper pin header.

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Main Power Jack and Pins DesignatorVCC / VCCIODirectionPinsNotes
J125VINIn

-1

-
J95VINIn / OutA1, A2also usable as '5VIN' power supply to the Carrier Board as alternative to J12
J2VBAT_INIn1Attention: Pin 2 connected to ground. VBAT_IN voltage on this pin cause short-circuit.

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Peripheral Socket DesignatorVCC / VCCIODirectionPinsNotes
J10 / J11USB-VBUSIn / Out1Direction depends on USB2.0 Type A socket / Micro USB2.0 B socketmode
J1VIN33Out4MikroSD Card socket VDD

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Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
-REF-189019-02BTE-060-01-L-D-A-K-TRModule connector5 mmhttp://suddendocs.samtec.com/catalog_english/bte.pdfStandard connector
used on module
26663REF-189019-01BSE-060-01-L-D-A-TRBaseboard connector5 mmhttp://suddendocs.samtec.com/catalog_english/bse.pdfStandard connector
used on board

Table 24: B2B Connectors.


Connector SpecificationsValue
Insulator material

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Liquid crystal polymer
Stacking height

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5 mm
Contact material

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Phosphor-bronze
Plating

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Au or Sn over 50 μ" (1.27 μm) Ni
Current rating

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2 A per pin (1 pin powered per row)
Operating temperature range

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-55 °C to +125 °C
Voltage rating

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225 VAC with 5 mm stack height
Max cycles

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100
RoHS compliantYes

Table 25: B2B Connector specifications.: Yes

Variants Currently In Production

 Module Variant

Operating Temperature

USB SocketTemperature Range
TEB0729-03-A-40°C to +125°CUSB2.0 Type A socket fittedIndustrial
TEB0729-03-B-40°C to +125°CMicro USB2.0 B socket fittedIndustrial

Table 2526: Module Board variants.

Technical Specifications

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Parameter

MinMax

Units

Reference Document

5VIN supply voltage

 -0.3 7

V

MP5010A, EN6347QI data sheet

Storage temperature

 -65

150

°C

-

Table 2627: Module absolute maximum ratings.

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ParameterMinMaxUnitsReference Document
5VIN supply voltage 4.755.25 VUSB2.0 specification concerning 'VBUS' voltage
Operating temperature -40125°C-

Table 2728: Module recommended operating conditions.

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DateRevision

Notes

PCNDocumentation Link
-

01

  • First Production Release
 -TEB0729-01
-02
  • Second Production Release
  • HW-Modification since 22.08.2017
  • Refer to Changes list in Schematic

    for further details in changes to REV01

-TEB0729-02
-03
  • Rework Reset-Signals by Pin-Swap
  • Refer to Changes list in Schematic for
    further details in changes to REV02
-TEB0729-03

Table 2829: Module hardware revision history.

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Date

Revision

Contributors

Description

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd



Ali Naseri
  • update TRM to board revision 03

2017-10-27

v.14
Ali Naseri
  • initial document to board revision 02

Table 2930: Document change history.

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