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B2B ConnectorInterfacesCount of I/O'sNotes
JB1User I/O42 single ended or 21 differential-
SD IO6-
MIO8-
SoM control signals1'BOOTMODE'
JB2MGT lanes8 differential pairs, 4 lanes-
MGT reference input clock1 differential pair
USB2.0 (OTG and device mode)4-
JB2User I/O42 single ended 21 differential--
JTAG4-
Red user LED1-
SoM control signals1'RESIN'

Table 1: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

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The TEBA0841 carrier board is mainly designed for the 4 x 5 SoMs TE0841 and TE0741. This SoMs have GTX-Transceiver units on their FPGA-modules with up to 8 available MGT-lanes. To test this MGT-lanes, 5 RX/TX differential pairs are bridged on-board, hence the transmitted data on this MGT-lanes flows back to their sources in a loop-back circuit without intentional processing or modification. 

The MGT lane pins are bridged on-board as fellows, if 4 x 5 SoM TE0741 is mounted on carrier board:

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The voltage direction of the power rails is from board and on-board connectors' view:

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes
JB1

3.3V

Out

2, 4, 6, 14, 16

3.3V module supply voltage
VCCIOAOut10, 12PL IO-bank VCCIO
M1.8VOUTIn401.8V module output voltage
JB2

3.3V_OUT

In

9, 11

3.3V module output voltage
3.3V
1.8V
Out

2, 4

1, 3, 5, 73.3V
1.8V
module supply voltage
VCCIODOut8, 10PL IO-bank VCCIO
3.3V_OUTIn
9, 113.3V module output voltage
JB3USB-VBUSOut56USB Host supply voltage

Table 15: Power pin description of B2B module connector.

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C32 module output voltageC31 module
On-board Pin Header DesignatorVCC / VCCIODirectionPinsNotes
J5J17

3.3V

In / Out

65, 4548

3.3V module external supply voltage
VCCIODM3.3VOUTIn / Out5, 463.3V module output voltage6, 45J6

VCCIOA

Out

B32

PL IO-bank VCCIO
VCCIOCOutB1PL IO-bank VCCIO
, depends on Jumper settings
J20M3.3VOUTIn

3.3V

3.3VOut

In / Out

5, 48

3.3V external supply voltage
5VINVCCIOAIn / OutA16, A2Carrier Board supply power45PL IO-bank VCCIO, depends on Jumper settings

Table 16: Power Pin description of on-board connector.

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J10
Jumper / Header DesignatorVCC / VCCIODirectionPinsNotes
J26VCCIOAOutIn2, 4, 6-
1M1.8V8VOUTOut1-
M32.3VOUT5VOut3-
3.3V_OUTOut5-
J27

VCCIOD

In2, 4, 6J11

VCCIOB

Out2-
1M1.8V8VOUTOut1-
M32.3VOUT5VOut3-
3.3V_OUTJ12VCCIOCOut25-
J413.8V3VOut15-
M3M1.3VOUT8VOUTOut3-

Table 17: Power Pin description of VCCIO selection jumper pin header.

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6-

Table 17: Power Pin description of VCCIO selection jumper pin headerTable 18: Main Power jack and pins description.


Peripheral Socket DesignatorVCC / VCCIODirectionPinsNotes
J7 / J8J10USB-VBUSOutIn1USB2.0 Type A socket / Micro USB2.0 B socketJ4M3.3VOUTOut4MikroSD Card socket VDDUSB Host supply voltage

Table 19: Power pin description of peripheral connector.

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-not
XMOD Header DesignatorVCC / VCCIODirectionPinsNotesPinsNotes
JX13.3VOut5 connected to 3.3V external supply voltage
VIOOut6
J3JX13.3VOut5connected to 3.3V external supply voltage
3.3VVIOOut6connected to 'VCCJTAG' (pin JB2-92)

Table 20: Power pin description of XMOD/JTAG Connector.

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Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnits
Reference Document
Notes
5VIN

Vin supply voltage

 -0 

3.135

3.465
 7

V

MP5010A, EN6347QI, EN5311QI data sheet

Storage temperature

V

3.3V supply-voltage ± 5%

Storage Temperature

-55
+85
105

°C

Marvell 88E1512 data sheet
Molex 74441-0001 Product Specification

Table 22: Module Board absolute maximum ratings.

Recommended Operating Conditions

Parameter
 ParameterMinMaxUnits
Reference Document
Notes
5VIN
Vin supply voltage
 4
3.
75
135
5
3.
25
465
 VUSB2.0 specification concerning 'VBUS' voltage
V-
Operating temperature
 
-40+85°CMolex 74441-0001 Product Specification

Table 23: Module recommended operating conditions.

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Industrial grade: -40°C to +85°C.

The TE0706 TEBA0841 Carrier Board itself is capable to be operated at industrial grade temperature range.

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Physical Dimensions

  • Board size:  PCB 100mm ×  64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm56.47 mm ×  75 mm. Notice that some parts the are hanging slightly over the edge of the PCB like the mini USB-jacks and the SFP+ connector, which determine the total physical dimensions of the carrier board. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors: 8mm

  • PCB thickness: ca. 1.65mm

  • Highest parts part on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mmis the SFP+ connector, which has an approximately 11.3 mm overall hight. Please download the step model for exact numbers.

 All The dimensions are given in millimetersmm and mil (milli inch).

Image Added

Figure 6: Board physical dimensions drawing.

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TE0706-01
  • Refer to Changes list in Schematic

    for further details in changes to REV01

    • DateRevision

    Notes

    		PCNDocumentation Link2016-06-28

    01

    • Prototypes
    		 -
    -02

    01

    • First Production Release
    • PCB patch on SFP+ connector
    		 -TEBA0841-01-TE0706-02

    Table 24: Module hardware revision history.


    Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

    Image Added

    Figure 7: Board hardware revision number.

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    Date

    Revision

    Contributors

    Description

    Page info
    modified-date
    modified-date
    dateFormatyyyy-MM-dd

    		Ali Naseri
    • TRM revision to new common style

    2017-07-06

    v.52



    		Ali Naseri, Jan Kumann
    • Hardware revision 02 specific changes.
    		2017-01-06v.1Ali Naseri
    • initial document to board revision 02First TRM release

    Table 25: Document change history.

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