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Table of Contents
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Overview
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Refer to httpshttp://wiki.trenz-electronic.de/display/PD/<name>org/tem0002-info for the current online version of this manual and other available documentation. |
The Trenz Electronic TEM0002-01 SmartBerry with Raspberry Pi form factor, is an industrial-grade module based on Microsemi SmartFusion2 SoC (System on a Chip). The Module has 128MB DDR3 SDRAM, a Gigabit Ethernet PHY, four PMODsPmods, a GPIO Pin header compatible to the Raspberry Pi pinout and a Micro USB to UART interface. SmartFusion2 combines a 166 MHz Cortex-M3 core with 256 KByte Flash, 80 KByte SRAM and a 12 kLUT FPGA core logic.
Key Features
- Microsemi SmartFusion2 SoC FPGA (M2S010)
- 128 MByte DDR3 SDRAM
- On board power converters for all needed voltages
- 40 pin header (compatible to Raspberry Pi pinout)
- 4 x 12 pin PMODsPmods
- Gigabit Ethernet PHY with RGMII interface
- JTAG and UART via Micro USB
- 3 pin header for Live Probes
- 2 x User Button
- 2 x status LED
1 x RGB LED
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
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Main Components
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- Microsemi SmartFusion2 SoC FPGA, U2
- USB to UART/FIFO (FTDI FT2232H), U3
- Gigabit ETH connector, J2
- 4x 2x6 pin PMODPmod, P1, P2, P3, P4
- GPIO pin header compatible to Raspberry Pi, J8
- Micro USB 2.0, J1
- EEPROM 4KBIT (M93C66-R), U6
- 2x User Button, S4, S5
- RGB LED, D3
- LED red, D1 and green, D2
- Live Probe pins, J4
- Reset jumper, J13
- JTAG select jumper, J6
- Board power header, J5
- 1Gb DDR3/L SDRAM, U5
- MicroSD memory card connector, J3
- Gigabit Ethernet PHY, U1
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
Microsemi SmartFusion2 SoC FPGA, U2 | Demo Design | - |
EEPROM, U6 | Programmed | FTDI (FT2232H) configuration data. |
Table 1: Initial delivery state of programmable devices on the module.
Boot Process
The SmartBerry supports configuration of the system via JTAG by the FTDI USB bridge.
Signals, Interfaces and Pins
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I/Os
26 I/O signals provided on the Rasperry Pi compatible header are connected to bank 2 of the Microsemi SoC.
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Table 2: General overview of I/O signals connected to the SoC.
Further I/Os are provided via the PMOD connectors descriebed below.
PMODs
The module provides four 2x6 female PMOD connectors. Two of the headers (P2 and P3) are arranged to use as dual 12 pin PMOD. According to the standard on all four headers Pin 5 and 11 are connected to ground, 6 and 12 to 3.3V.
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PMOD Signal
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PMOD Signal
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connected to banks with 3.3V. Dpending on the configuration of the SoC, also GPIOs of the Microprocessor subsystem can be routet to the SoC Pins.
FPGA SoC Signal | SOC Pin | Header Pin | Raspberry Pi Signal |
---|---|---|---|
MSIO19PB2 | U2-H16 | 3 | GPIO2 |
MSIO16PB2 | U2-J17 | 5 | GPIO3 |
MSIO2PB2 | U2-T18 | 7 | GPIO4 |
MSIO1PB2 | U2-U18 | 8 | GPIO14 |
MSIO5NB2 | U2-R18 | 10 | GPIO15 |
MSIO11NB2 | U2-M17 | 11 | GPIO17 |
MSIO6PB2 | U2-P18 | 12 | GPIO18 |
MSIO14PB2 | U2-L15 | 13 | GPIO27 |
MSIO17PB2 | U2-K16 | 15 | GPIO22 |
MSIO11PB2 | U2-N16 | 16 | GPIO23 |
MSIO27NB1 | U2-B19 | 18 | GPIO24 |
MSIO25NB1 | U2-C20 | 19 | GPIO10 |
MSIO25PB1 | U2-D20 | 21 | GPIO9 |
MSIO22NB1 | U2-F18 | 22 | GPIO25 |
MSIO20NB2 | U2-F20 | 23 | GPIO11 |
MSIO20PB2 | U2-G19 | 24 | GPIO08 |
MSIO18PB2 | U2-H19 | 26 | GPIO07 |
MSIO28PB1 | U2-A20 | 27 | ID_SDA |
MSIO28NB1 | U2-A19 | 28 | ID_SCL |
MSIO16NB2 | U2-J18 | 29 | GPIO05 |
MSIO15NB2 | U2-J20 | 31 | GPIO06 |
MSIO15PB2 | U2-K20 | 32 | GPIO12 |
MSIO14NB2 | U2-L16 | 33 | GPIO13 |
MSIO13NB2 | U2-L19 | 35 | GPIO19 |
MSIO13PB2 | U2-L20 | 36 | GPIO16 |
MSIO8PB2 | U2-N20 | 37 | GPIO26 |
MSIO8NB2 | U2-M19 | 38 | GPIO20 |
MSIO4NB2 | U2-N19 | 40 | GPIO21 |
Table 2: General overview of I/O signals connected to the SoC.
Further I/Os are provided via the Pmod connectors descriebed below.
Pmods
The module provides four 2x6 female Pmod connectors. Two of the headers (P2 and P3) are arranged to use as dual 12 pin Pmod. According to the standard on all four headers Pin 5 and 11 are connected to ground, 6 and 12 to 3.3V.
FPGA SoC Signal | Pin | Pmod Signal | Pmod Pin |
---|---|---|---|
MSIO71PB7 | U2-F3 | PB-01 | P1-1 |
MSIO71NB7 | U2-F4 | PB-02 | P1-2 |
MSIO68NB7 | U2-E3 | PB-03 | P1-3 |
MSIO80NB7 | U2-H4 | PB-04 | P1-4 |
MSIO75PB7 | U2-G4 | PB-05 | P1-7 |
MSIO75NB7 | U2-F5 | PB-06 | P1-8 |
MSIO67NB7 | U2-E5 | PB-07 | P1-9 |
MSIO78NB7 | U2-G3 | PB-08 | P1-10 |
MSIO79PB7 | U2-G1 | PC-01 | P2-1 |
MSIO79NB7 | U2-F1 | PC-02 | P2-2 |
MSIO70NB7 | U2-E2 | PC-03 | P2-3 |
MSIO64PB7 | U2-C1 | PC-04 | P2-4 |
MSIO78PB7 | U2-G2 | PC-05 | P2-7 |
MSIO70PB7 | U2-E1 | PC-06 | P2-8 |
MSIO68PB7 | U2-D2 | PC-07 | P2-9 |
MSIO64NB7 | U2-C2 | PC-08 | P2-10 |
MSIO117NB4 | U2-Y16 | PA-01 | P3-1 |
MSIO117PB4 | U2-Y15 | PA-02 | P3-2 |
MSIO112PB4 | U2-W13 | PA-03 | P3-3 |
MSIO110PB4 | U2-V12 | PA-04 | P3-4 |
MSIO118PB4 | U2-W15 | PA-05 | P3-7 |
MSIO112NB4 | U2-W14 | PA-06 | P3-8 |
MSIO105NB4 | U2-Y13 | PA-07 | P3-9 |
MSIO104PB4 | U2-V11 | PA-08 | P3-10 |
MSIO4PB2 | U2-P20 | PD-01 | P4-1 |
MSIO3NB2 | U2-R20 | PD-02 | P4-2 |
MSIO2NB2 | U2-T19 | PD-03 | P4-3 |
MSIO0PB2 | U2-V20 | PD-04 | P4-4 |
MSIO6NB2 | U2-P19 | PD-05 | P4-7 |
MSIO3PB2 | U2-T20 | PD-06 | P4-8 |
MSIO1NB2 | U2-U19 | PD-07 | P4-9 |
MSIO0NB2 | U2-V19 | PD-08 | P4-10 |
Table 3: Overview of Pmod signals connected to the SoC.
JTAG Interface
JTAG access to the SoC components is provided through the micro usb connector via the FTDI usb to UART bridge. Depending on the jumper J6 the JTAGSEL signal SW3 switches the JTAG interface to either the FPGA fabric TAP (OPEN, high) or the Cortex-M3 JTAG debug interface (CLOSED, low). JTAG signals are powered by 3.3V.
FTDI signal | pin | JTAG Signal | Microsemi SmartFusion2 SoC pin |
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ADBUS0 | U3-12 | TCK | U2-W19 |
ADBUS1 | U3-13 | TDI | U2-V16 |
ADBUS2 | U3-14 | TDO | U2-Y20 |
ADBUS3 | U3-15 | TMS | U2-V17 |
Table 4: JTAG interface signals.
SD Card Interface
The SD Card interface is connected to bank 2 of the SoC
FPGA / SoC Pin | Connected To | Signal Name | Notes |
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U2-H16 | J3-9 | SD_CD | Card detect switch |
U2-N15 | J3-7 | SD_D0 | |
U2-G18 | J3-8 | SD_D1 | |
U2-R16 | J3-1 | SD_D2 | |
U2-R17 | J3-2 | SD_D3 | |
U2-R15 | J3-3 | SD_CMD | |
U2-P15 | J3-5 | SD_CLK |
Table 5: SD Card interface signals and connections.
Ethernet Interface
PHY Pin | Signal | Microsemi SmartFusion2 SoC signal | Pin | Notes |
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U1-25 | ETH_TXCK | MSIOD84PB6 | U2-K7 | |
U1-23 | ETH_TXCTL | MSIOD87NB6 | U2-K3 | |
U1-26 | ETH_TXD0 | MSIOD93PB6 | U2-L1 | |
U1-28 | ETH_TXD1 | MSIOD97NB6 | U2-M2 | |
U1-29 | ETH_TXD2 | MSIOD97PB6 | U2-M1 | |
U1-30 | ETH_TXD3 | MSIOD95PB6 | U2-M3 | |
U1-22 | ETH_RRXCK | MSIOD84PB6 | U2-J2 | |
U1-21 | ETH_RRXCTL | MSIOD93NB6 | U2-K1 | |
U1-20 | ETH_RRXD0 | MSIOD86PB6 | U2-K5 | |
U1-18 | ETH_RRXD1 | MSIOD82PB6 | U2-H1 | |
U1-17 | ETH_RRXD2 | MSIOD82NB6 | U2-H2 | |
U1-16 | ETH_RRXD3 | MSIOD83PB6 | U2-J4 | |
U1-31 | ETH_MDC | MSIOD99PB6 | U2-N1 | |
U1-33 | ETH_MDIO | MSIOD99NB6 | U2-N2 | |
U1-34 | ETH_MDINT | MSIOD98PB6 | U2-N4 | |
U1-35 | ETH_RST | MSIO114PB4 | U2-R13 | |
U1-36 | PHY_RCLKOUT | MSIO102NB4/CCC_NE1_CLKIO | U2-W10 | |
U1-39 | PHY_LED0 | MSIO104NB4 | U2-U11 | |
U1-38 | PHY_LED1 | MSIO116PB4 | U2_T14 |
Table 6: Ethernet PHY signals and connections.
I2C Interface
There are no on-board I2C devices. For Raspberry Pi compability the device detection I2C bus is routed from the header J8-27/28 to Bank 1 U2-A20/A19 (SDA/SCL).
I2C Device | I2C Address | Notes |
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Header J8 | 0x50 | Device detection/identification. |
Table 7
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PB-08
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PC-07
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PC-08
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JTAG Interface
JTAG access to the SoC components is provided through the micro usb connector via the FTDI usb to UART bridge. Depending on the jumper J6 the JTAGSEL signal SW3 switches the JTAG interface to either the FPGA fabric TAP (open, high) or the Cortex-M3 JTAG debug interface (closed, low). JTAG signals are powered by 3.3V.
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FTDI signal
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JTAG Signal
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Microsemi SmartFusion2 SoC FPGA pin
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Table 5: JTAG interface signals.
SD Card Interface
The SD Card interface is connected to Bank 2 of the SoC
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Table 6: SD Card interface signals and connections.
Ethernet Interface
On board Gigabit Ethernet PHY is provided with ...
Ethernet PHY connection
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Table x: ...
I2C Interface
On-board I2C devices are connected to MIO.. and MIO.. which are configured as I2C... by default. I2C addresses for on-board devices are listed in the table below:
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Table x: I2C slave device addresses.
On-board Peripherals
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DDR Memory
TEM0002 has 1Gb industrial grade DDR3 SDRAM (U5) in a . A 16-bit wide memory bus providing total of 128 MBytes of on-board RAM. The Datasheet notes Specification is 800 MHz clocking resulting in 1600 Mb/s data rate and timing specification timings of 11-11-11 (CL-TRCD-TRP).
Gigabit Ethernet PHY
On-board Gigabit Ethernet PHY (J2) is provided by Microsemi VSC8531 chip (U1). The Ethernet PHY RGMII interface is connected to Bank bank 6 of the Microsemi SOC. I/O voltage is fixed at 1.5V. The reference clock input of the PHY is supplied from an external 25.000000 MHz oscillator (U11).
Oscillators
The module has following reference clock signals provided by on-board oscillators:
Clock Source | Schematic Name | Frequency | Clock Destination |
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Crystal CX3225CA25000D0HSSCC | Y1 | 25.000 MHz1 | SmartFusion2 SoC U2 Main XTAL |
Crystal ECX-31B | Y2 | 32.768 KHz | SmartFusion2 SoC U2 AUX XTAL |
SiTime SiT8008AI oscillator | U11 | 25.000000 MHz | Gb Ethernet Copper PHY U1A |
SiTime SiT8008AI oscillator | U14 | 25.000000 MHz | SmartFusion2 SoC U2-Y12 Bank 4 |
Table 8: Reference clock signals.
1In REV02, Y1 will be replaced by a 12MHz 12 MHz crystal.
On-board LEDs
LED | Color | Connected to | SoC FPGA Signal | Description and Notes |
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D1 | Red | U2-G16 Bank 1 | MSIO21PB1 | |
D2 | Green | U2-G17 Bank 1 | MSIO21NB1 | |
D3 | RGB | U2-H5 Bank 7, U2-F6 Bank 7, U2-H6 Bank 7 | ||
J2 | Green, Yellow | U2-Y10 Bank 4, U2-U12 Bank 4 | Ethernet: LED1A, LED1B | |
J2 | Green, Yellow | U2-V14 Bank 4 , U2- U14H6 Bank 4 | Ethernet: LED2A, LED2B |
Table : On-board LEDs.
Power and Power-On Sequence
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Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
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Table : Typical power consumption.
* TBD - To Be Determined soon with reference design setup.
Power supply with minimum current capability of ...A for system startup is recommended.
For the lowest power consumption and highest efficiency of the on-board DC-DC regulators it is recommended to power the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
Power Distribution Dependencies
Regulator dependencies and max. current.
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Figure : Module power distribution diagram.
See Xilinx data sheet ... for additional information. User should also check related base board documentation when intending base board design for TE07xx module.
Power-On Sequence
The TE07xx SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DC-DC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.
Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:
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Figure : Module power-on diagram.
Voltage Monitor Circuit
If the module has one, describe it here...
Power Rails
NB! Following table with examples is valid for most of the 4 x 5 cm modules but depending on the module model and specific design, number and names of power rails connected to the B2B connectors may vary.
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Power Rail Name
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B2B JM1 Pins
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B2B JM2 Pins
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7 | MSIO80PB7, MSIO67PB7, MSIO81NB7 | |||
J2 | Green, Yellow | U2-Y10 Bank 4, U2-U12 Bank 4 | MSIO102PB4, MSIO110NB4 | Ethernet: LED1A, LED1B |
J2 | Green, Yellow | U2-V14 Bank 4, U2-U14 Bank 4 | MSIO115PB4, MSIO115PB4 | Ethernet: LED2A, LED2B |
Table 9: On-board LEDs.
On-board Buttons
Button | Connected to | SoC FPGA Signal |
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S4 | U2-E17 Bank 1 | MSIO24PB1 |
S5 | U2-E16 Bank 1 | MSIO24NB1 |
Table 10: On-board Buttons.
Power and Power-On Sequence
There is no specific power on Sequence. Just supply with 5V via the micro USB J1 or the J5 PWR_IN with current rating sufficient for your Design.
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Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
Power Input | Typical Current |
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VIN | TBD* |
3.3VIN | TBD* |
Table 11: Typical power consumption.
* TBD - To Be Determined soon with reference design setup.
Power supply with minimum current capability of ...A for system startup is recommended.
For the lowest power consumption and highest efficiency of the on-board DC-DC regulators it is recommended to power the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
Power Distribution Dependencies
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Power Rails
Power Rail Name | Connector pin | Direction | Notes |
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VIN | J5-1 | Input | Main supply voltage. |
5V | J8-2, J8-4 | Output | |
3.3V | J8-1, J8-17 | Output | |
1.5V | - | Output | |
1.2V | - | Output | |
GND | J5-2, J8-9/25/39/6/14/20/30/34 |
Table 12: Module power rails.
Bank Voltages
Bank | Schematic Name | Voltage | Voltage Range |
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0 (DDR3) | 1.5V | 1.5V | - |
1 | 3.3V | 3.3V | - |
2 | 3.3V | 3.3V | - |
3 | 3.3V | 3.3V | - |
4 | 3.3V | 3.3V | - |
5 | 1.5V | 1.5V | - |
6 | 1.5V | 1.5V | - |
7 | 3.3V | 3.3V | - |
Table 13: I/O bank voltages.
Variants Currently In Production
Module Variant | FPGA / SoC | Operating Temperature | Temperature Range |
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TEM0002-01 | M2S010 | 0°C to +70°C | commercial |
Table 14
Table : Module power rails.
Different modules (not just 4 x 5 cm ones) have different type of connectors with different specifications. Following note is for Samtec Razor Beam™ LSHM connectors only, but we should consider adding such note into included file in Board to Board Connectors section instead of here.
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Bank Voltages
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Voltage
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Voltage Range
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Table : Module PL I/O bank voltages.
Board to Board Connectors
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Variants Currently In Production
NB! Note that here we look at the module as a whole, so you just can't rely only on junction temperature or max voltage of particular SoC or FPGA chip on the module. See examples in the table below.
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Operating Temperature
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Table : Module variants.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | -0.3 | 6.0 | V | - |
Storage temperature1 | -25 | 70 | °C | - |
Table 15: Module absolute maximum ratings.
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1Boundary determined by the specification of the buttons, all other components have at least a range of -40°C to 85°C.
Recommended Operating Conditions
Parameter | Min | Max | Units | Reference Document |
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VIN supply voltage | 2.4 | 5.5 | V | - |
Operating temperature1 | 0 | 70 | °C | - |
Table 16: Module recommended operating conditions.
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1Upper bound is determined by the buttons, all other components have at least a upper bound of 85 °C.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Extended grade: 0°C to +85°C.
Industrial grade: -40°C to +85°C.
Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: 85 mm × 56 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.55 mm.
Highest part on PCB: top approx. 13.3 mm (Ethernet), bottom 1.57mm (SD-Card)Please download the step model for exact numbers.
All dimensions are given in millimeters.
given in millimeters.
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Revision History
Hardware Revision History
Date | Revision | Notes | PCN | Documentation Link |
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- | 01 | Prototypes |
Table 17: Module hardware revision history.
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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model number separated by the dash.
draw.io Diagram border false viewerToolbar true fitWindow false diagramName Pic_REV_number simpleViewer true width 200 links auto tbstyle top lbox true diagramWidth 1571 revision 3
Figure 5Figure : Module hardware revision number.
Document Change History
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Date | Revision | Contributors | Description | |||||||||||||||||
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| John Hartfiel | Remove Link to Download | 2017-05-30 | v.1 | Jan Kumann |
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all | Jan Kumann, John Hartfiel |
Table 18: Document change history.
Disclaimer
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