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Table of Contents

Table of Contents

Overview


Scroll Only (inline)
Refer to https://wiki.trenz-electronic.de/display/

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PD/TE0722+TRM for downloadable version of this manual and additional technical documentation of the product.

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The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx Zynq-7000 SoC.

...

  • Xilinx Zynq XC7Z010 SoC
  • Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
  • 16 MByte quad Quad SPI Flash
  • Micro SD Card socket with card detect signal
  • 34 I/Os on DIP40 header pins
  • System status LED (DONE)
  • RGB LED connected to PL I/O
  • Green user LED connected to ARM CPU GPIO
  • Proximity and ambient light sensor
  • DIP40 form factor (size 18 x 51 mm)

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Image Modified

Figure 1: TE022-02 block diagram.

Main Components

Image Modified

Figure 2: TE0722-02 PCB top side.

Image Modified

Figure 3: TE0722-02 PCB bottom side.

  1. Xilinx Zynq XC7Z010 or Zynq XC7Z007S SoC, U1
  2. Micro SD card socket with card detect, J8
  3. Red LED, D3
  4. Green LED, D2
  5. Red LED, D6
  6. 20-pin connector placeholder, P1
  7. Red LED, D5
  8. Proximity/ambient light sensor, U4
  9. RGB LED, D4
  10. Red LED, D1
  11. 20-pin connector placeholder, P2
  12. Ultra-low supply-current voltage monitor, U4
  13. 2 x 5-pin connector placeholder, J1
  14. 2 x 5-pin connector placeholder, J2
  15. 2 x 5-pin connector placeholder, J3
  16. 16 MByte QSPI Flash memory, U5
  17. Low-power programmable oscillator @ 33.333333 MHz, U8
  18. 1A PowerSoC DC-DC converter (1.0V), U2
  19. 1A PowerSoC DC-DC converter (1.8V), U3

Initial Delivery State

Storage device name

Content

Notes

Quad SPI Flash

Empty

 

Table 1: . Initial delivery state of programmable devices on the module

Boot Process

By default the ... supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector JM..

...

High or open

...

SD Card

...

Low or ground

...

QSPI Interface

The 7 boot mode strapping pins (MIO2 ... MIO8) of the Xiliny Zynq Z-7010 device are hardware programmed on the board. They are evaluated by the Zynq device soon after the 'POR_B'.signal is deasserted to begin the boot process.

The TE0722-02 FPGA board is hardware programmed to boot initially from the on-board QSPI flash memory U5. The JTAG interface of the module is provided for storing the data to the QSPI flash memoryTable 2: Selecting power-on boot device.

Signals, Interfaces and Pins

I/O Signals on Connectors

Overview of the PL I/O banks signals routed to the external connectors:

BankTypeConnectorI/O Signal CountVoltageNotes
34HRP183.3VSignal Schematic names: 'P0' - 'P7'
34HRP283.3VSignal Schematic names: 'P24' - 'P31'
34HRP210 , 5 LVDS single ended I/O's or 5 differential pairs3.3V -
34HRJ163.3VSignal Schematic names: 'X2A' - 'X2F'
34HRJ223.3V -
34HRJ343.3VSignal Schematic names: 'X1A' - 'X1D'
35HRP18 , 4 LVDS single ended I/O's or 4 differential pairs3.3V -

Table 3: Zynq SoC PL I/O signals overview

Zynq SoC PL/PS Banks

BankTypeVCCIOI/O's CountAvailable on ConnectorsNotes
34HR3.3V413838 user I/O's, 3 I/O's used for controlling the RGB LED D4. 
35HR3.3V888 single ended or 4 differential.
500PS MIO3.3V706 MIO-pins used for QSPI flash memory interface, 1 MIO-pin connected to green LED D2.
501PS MIO3.3V1007 MIO-pins used for SD Card interface, 3 MIO-pins connected to light sensor U4.
0Config3.3V504 I/O's are dedicated to JTAG interface, 'DONE'-signal is indicated by red LED D6.

Table 4: General overview of Zynq SoC PL/PS banks

JTAG Interface

JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector.:

JTAG Signal

J2 Connector Pin

TCK 4
TDI 9
TDO 10
TMS 8

Table 45: JTAG interface signals.

Quad SPI Interface

Quad SPI Flash memory (U5) is connected to the Zynq SoC PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.:

U5 Pin17
Zynq SoC's MIO-pinU5 PinSignal Schematic Name
MIO11SPI0-CS
MIO225SPI0-DQ0/M0
5MIO332SPI0-DQ1/M1
2MIO443SPI0-DQ2/M2
3MIO557SPI0-DQ3/M3
MIO66SPI0-SCK

Table 6

...

Table 5: Quad SPI interface signals and connections.

SD Card Interface

TE0722 module board has on-board 3.3V SD Card socket (J8) with card detect switch wired to the Zynq SoC PS MIO bank 501, pins MIO28 .. MIO33 and MIO49.

Zynq SoC's MIO-pinConnected ToJ8 pinSignal Schematic Name
28MIO28J8-7DAT0
29MIO29J8-3CMD
30MIO30J8-5CLK
31MIO31J8-8DAT1
32MIO32J8-1DAT2
33MIO33J8-2CD/DAT3
49MIO49J8-G4Card detect switch

Table 67: SD card interface signals.

...

I²C Interface

I2C interface pins SCL and SDA from the Zynq SoC PL bank 34 PS MIO-bank 501 (MIO36, MIO37) are connected to the connector J1. There are no on-board I2C slave devices.ambient / proximity light sensor (U4).

Zynq SoC's MIO-pinConnected ToU4 pinSignal Schematic Name
MIO36U4-2SCL
MIO37U4-1SDA

Table 78: Zynq SoC I2C interface signals.

Default PS MIO Mapping

-
MIO-pinFunctionConnector PinNotes7GPIOto
MIO1QSPIQSPI flash memory, pin 1
MIO2QSPIQSPI flash memory, pin 5
MIO3QSPIQSPI flash memory, pin 2
MIO4QSPIQSPI flash memory, pin 7
MIO5QSPIQSPI flash memory, pin 3
MIO6QSPIQSPI flash memory, pin 6
MIO7GPIOGreen LED D2
39GPIO-Si1143 INT pin
MIO28SDIOSC Card socket. pin J8-5
MIO29SDIOSC Card socket. pin J8-3
MIO30SDIOSC Card socket. pin J8-7
MIO31SDIOSC Card socket. pin J8-8
MIO32SDIOSC Card socket. pin J8-1
MIO33SDIOSC Card socket. pin J8-2
MIO36I²CAmbient / Proximity Light Sensor U4, pin 2
MIO37I²CAmbient / Proximity Light Sensor U4, pin 1
MIO39GPIOAmbient / Proximity Light Sensor U4, Interrupt pin 4
MIO49GPIOSC Card socket card detect pin J8-G4

Table 9: Default mapping of Zynq PS MIO-bank pinsTable 8: .

On-board Peripherals

Quad SPI Flash Memory

On-board QSPI flash memory (U5) is provided by Cypress Semiconductor Serial Flash Memory S25FL127SABMFV101 with 128 MBit (16 MByte) storage capacity. This non volatile memory is used to store initial configuration data. Besides initial configuration data, remaining free flash memory can be used for user application and data storage.

Proximity and Ambient Light Sensor

...

The TE0722-02 Zynq SoC board is equipped with the Si1143 infrared proximity and ambient light sensor. On-board three red LEDs D1, D3 and D5 are connected to the light sensor to use the proximity sensing functionality. For more details and how to configure and use this chip, refer to the Si1141/42/43 data sheet.

Oscillator

The Zynq SoC board one reference clocking signal as system clock provided by on-board oscillator U8:

Clock SourceFrequencyClock Input Destination
SiTime SiT8008AI Oscillator, U833.333333 MHzZynq PS Bank 500, pin C7

Table 10: Clock sources overview

On-board LEDs

There are 6 LEDs fitted on the Zynq SoC board. The LEDs are user configurable to indicate for example any system status.

LEDColorConnected TotoSignal Schematic NameDescription and Notes
D1RedLED2, U4Light sensor U4, pin 6- Proximity sensing functionality of light sensor U4 
D2

Green

Zynq PS bank 500MIO7, U1User controlled, default OFF (when PS7 has not been booted).user configurable
D3

RedLED1,

Light sensor U4, pin 9- Proximity sensing functionality of light sensor U4 
D4RGBZynq PL bank 34,
pins J15, L14, K12

RGB_R, U1,

RGB_G, U1,

RGB_B, U1

 user configurable
D5RedLED3, U4Light sensor U4, pin 7- Proximity sensing functionality of light sensor U4 

D6

Green

Zynq config bank 0

DONE, U1

Reflects inverted DONE signal. ON when FPGA is not configured,
OFF as soon as PL configuration is finished.

Table 9:11: LEDs of the board

Connectors

All connectors are for 100mil (2.54mm pitch) headers, all connector locations are in 100mil grid. The module's PCB provides footprints to mount and solder optional pin headers, if those are not factory-fitted on module.

Power and Power-On Sequence

Power Consumption

Power To power-up a module, power supply with minimum current capability of 1A is recommended.

Power Supply

TE0722-02 needs one single power supply with nominal of 3.3V at all variants. Following diagram shows the dependencies of the power supply:

Image Added

Figure 4: Module power supply dependencies

Power Consumption

Board VariantFPGADesignTypical Power, 25°C ambient
TE0722-02IXC7Z010-1CLG225INot configuredTBD*
TE0722-02XC7Z010-1CLG225CNot configuredTBD*
TE0722-02-07S-1CXC7Z007S-1CLG225CNot configuredTBD*

Table 12: Module power consumption

*TBD - To Be Determined.

for system startup is recommended. The maximum power consumption of the module mainly depends on the design running on the Zynq SoC's FPGA and ambient temperature.

Xilinx provide a power estimator excel sheets to calculate power consumption. It is also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Typical power consumption is to be determined.

 

Power-On Sequence

There is no specific or special power-on sequence, single power source is needed as 3... diagram will be here soon ...3V as power supply voltage.

Variants Currently in Production

 Module  Board VariantXilinx Zynq SoC

ARM Cores

PL Cells

LUTsFlip-FlopsBlock RAM

DSP Slices

Zynq SoC Operating

Temperature

Temperature

Temp.

Temp. Range

TE0722-02IXC7Z010-1CLG225IA9+ Dual-core28K17,6K35,2K2.1 MBytes80

–40°C to +85°C100°C

Industrial
TE0722-02XC7Z010-1CLG225CA9+ Dual-core28K17,6K35,2K2.1 MBytes80

0°C to +70°C85°C

Commercial
TE0722-02-07S-1CXC7Z007S-1CLG225CA9+ Single-core23K14,4K28,8K1.8 MBytes66

0°C to +70°C85°C

Commercial

Table 813: Module Board variants.

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN

3.3 supply voltage

-0.
5
33.6

V

EN5311QI datasheet / Xilinx datasheet DS187
, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics".
HR PL I/O banks input voltage (VCCIO single ended)-0.4VCCO + 0.55VXilinx datasheet DS187 (VCCO 3.3V nominal)

Storage temperature

-40

+85

°C

Silicon Labs Si1141/42/43 datasheet.

Table 914: Module Board absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
Supply
3.3 supply voltage1.143.465 VXilinx datasheet DS187
, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics".

Table 10: Module recommended operating conditions.

 

HR PL I/O banks input voltage (VCCIO single ended)-0.20VCCO + 0.20VXilinx datasheet DS187 (VCCO 3.3V nominal)

Operating Temperature Commercial
(Variant TE0722-02 and TE0722-02-07S-1C)

0+85°CXilinx datasheet DS190

Operating Temperature Industrial
(Variant TE0722-02I)

-40+85
Xilinx datasheet DS190

Table 15: Board recommended operating condition

Note
Please check Xilinx datasheet DS187 for complete list of absolute maximum and recommended operating ratings for the Zynq-7 device
Note
Assembly variants for higher storage temperature range are available on request.

Physical Dimensions

  • Module size: 18 17.9 mm × 51 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: 1.6 65 mm.

  • Highest part on PCB approx. 4 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

 Image Modified

Figure 45: TE0722-02 Board physical dimensions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Revision History

Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
2015-10-2302 - -TE0722-02
 -

01

 First production release - -

Table 11: TE0722 module Board hardware revision history.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Image RemovedImage Added

Figure 56: TE0722 module hardware revision number.

Document Change History

Date

Revision

Contributors

Description

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd



Ali Naseri, Jan Kumann

Initial document.
  • First TRM Release

Table 12: Document change history.

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