Page History
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- MAX10 FPGA, U5
- Programmable low jitter clock generator Si5354A, U2
- Status LED (green), D1
- 3.3V to 1.8V DCDC converter, U6
- Quad SFP+ cage and connectors, J4-J7
- 1x6 pin header for JTAG programming of FPGA (3.3V), J3
- 1x3 pin header for I²C (1.8V), J1
- XTAL 54.0000 MHz (CX3225SB), Y1
- Oszillator 25.000000 MHz (SiT8008B), U1
- HPC FMC connector, J2
- 128KBit EEPROM, U4
- Testpoints Max10, TP7-TP9
- Testpoints JTAG, TP1-TP4
- Testpoints Power, TP5, TP6, TP10
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
Max10 FPGA | .. | .. |
Clock generator | .. | .. |
EEPROM | .. | .. |
Table 2: Initial delivery state of programmable devices on the module.
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I/O signals connected to the FPGA I/O bank and B2B connector:
Bank | Type | B2B Connector | I/O Signal Count | Bank Voltage | Notes |
---|---|---|---|---|---|
3 | GPI/Os | J2 | 20 I/Os | VADJ | Supplied by the carrier board. |
Table 3: General overview of I/O signals connected to the B2B connectors.
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MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TD/RD) differential pairs, two signals each or four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, and HPC FMC Pin:
Lane | SFP+ | Signal Name | HPC FMC Pin |
---|---|---|---|
0 | J4 |
|
|
1 | J5 |
|
|
2 | J6 |
|
|
3 | J7 |
|
|
Table 4: MGT lanes.
Below are listed MGT banks reference clock sources.
Clock signal | Source | HPC FMC Pin | Notes |
---|---|---|---|
GBTCLK0_P | U2-51 | J2-D4, GBTCLK0_M2C_P | On-board Si5345A. |
GBTCLK0_N | U2-50 | J2-D5, GBTCLK0_M2C_N | On-board Si5345A. |
GBTCLK1_P | U2-31 | J2-B20, GBTCLK1_M2C_P | On-board Si5345A. |
GBTCLK1_N | U2-30 | J2-B21, GBTCLK1_M2C_N | On-board Si5345A. |
Table 5: MGT reference clock sources.
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JTAG access to the MAX10 FPGA is provided through HPC FMC Connector and an additional pin header connector as well as testpoints.
JTAG Signal | HPC FMC Pin | Pin Header | Testpoints |
---|---|---|---|
TCK | J2-D29 | J3-4 | TP2 |
TDI | J2-D33 | J3-2 | TP1 |
TDO | J2-D30 | J3-3 | TP3 |
TMS | J2-D31 | J3-1 | TP4 |
Table 6: JTAG interface signals.
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On-board I2C devices are connected to the HPC FMC Pin C30 SCL and pin C31 SDA which are reserved for I2C. Level shift and for PLL and SFP+ I²C is done by the FPGA as well as MUX for SFP+. Addresses for on-board devices are listed in the table below:
I2C Device | I2C Address | Notes |
---|---|---|
J4, SFP+ | ||
J5, SFP+ | ||
J6, SFP+ | ||
J7, SFP+ | ||
U2, Si5345A | 1101001 | Level shifted via MAX10 FPGA |
U4, EEPROM | 10100xx | Last digits determined by carrier board via HPC FMC (C34 GA0, C35 GA1). |
Table 7: I2C slave device addresses.
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There is a Silicon Labs I2C programmable clock generator on-board (Si5345A, U2) to generate reference clocks for the module.
Not connected.
Si5345A Pin | Signal Name / Description | Connected To | Direction | Note |
---|---|---|---|---|
IN0 | Reference input clock. |
U1 | Input | 25.000000 MHz oscillator, Si8208AI | ||
IN1 | - | Not connected. | Input | Not used. |
IN2 | - | Not connected. | Input | Not used. |
IN3 | CLK2 | J2-K4/K5 | Input | HPC FMC configured as C2M clock. |
A1 | - | GND | Input | I2C slave device address LSB. |
XAXB | - |
Y1 | Input |
54.0000 MHz XTAL CX3225SB |
OUT0 |
CLKPLL2F | U5-H6/G5 | Output | FPGA bank |
2. | |
OUT1 | - |
Not connected. | Output |
Not used. |
OUT2 |
GBTCLK1 | J2-B20/B21 | Output | M2C via HPC FMC. |
OUT3 | - |
Not connected. | Output |
Not used. | |
OUT4 | - |
Not connected. | Output |
Not used. | |
OUT5 | - |
Not connected. | Output |
Not used. | |||
OUT6 | - | Not connected. | Output |
Not used. | |
OUT7 | GBTCLK0 |
J2-D4/D5 | Output |
M2C via HPC FMC. | |
OUT8 | CLK0 |
J2-H4/H5 | Output | M2C via HPC FMC. | ||
OUT9 | CLK1 | J2-G2/G3 | Output | M2C via HPC FMC. |
Table 8: Programmable quad PLL clock generator inputs and outputs.
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The module has following reference clock signals provided by on-board oscillators and external source from carrier board:
Clock Source | Schematic Name | Frequency | Clock Destination |
---|
SiTime |
SiT8008AI oscillator, |
U1 | - | 25.000000 MHz |
U2-63/64 | |||
Carrier board via HPC FMC J2-K4/K5 | CLK2 | Defined by carrier. | U2-61/62 |
Table 9: Reference clock signals.
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A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I2C bus with slave device address 0x53.
On-board LEDs
LED | Color | Connected to | Description and Notes |
---|---|---|---|
D1 | Green |
U5-C2 (bank 1A) | Status LED: ... |
Table 10: On-board LEDs.
Power and Power-On Sequence
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The maximum power consumption of a module mainly depends on the design running on the FPGA.Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
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3P3V | TBD* |
VADJ (at 1.8V) | TBD* |
3P3VAUX | TBD* |
Table 11: Typical power consumption.
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Figure 3: Module power distribution diagram.
Power Rails
Power Rail Name | HPC FMC Connector (J2) | Direction | Notes |
---|---|---|---|
3P3V | D36, D38, D40, C39 | Input | Supply voltage from carrier board. |
1.8V | - | Output | Module on-board 1.8V voltage supply (Max 1A). |
3P3VAUX | D32 | Input | Supply voltage from carrier board. |
VADJ | H40, G39, F40, E39 | Input | Supply voltage from carrier board. |
12V | C35, C37 | Input | Not used supply voltage from carrier board. |
Table 12: Module power rails.
Bank Voltages
Bank | Schematic Name | Voltage | Voltage Range |
---|---|---|---|
1A | 3P3V | 3.3V | - |
1B | 3P3V | 3.3V | - |
2 | 1.8V | 1.8V | - |
3 | VADJ |
Carrier supplied | 1.2V - 3.3V | ||
5 | 3P3V | 3.3V | - |
6 | 3P3V | 3.3V | - |
8 | 3P3V | 3.3V | - |
Table 13: Module PL I/O bank voltages.
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Variants Currently In Production
Module Variant | FPGA | Operating Temperature | Temperature Range |
---|---|---|---|
TE0008-01 | 10M08SAU169C8G | 0°C to +70°C | Commercial |
Table 14: Module variants.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | V | - | ||
Storage temperature |
| °C | - |
Table 15: Module absolute maximum ratings.
Recommended Operating Conditions
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | ||||
Operating temperature |
Table 16: Module recommended operating conditions.
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Hardware Revision History
Date | Revision | Notes | PCN | Documentation Link |
---|---|---|---|---|
- | 01 |
Table 17: Module hardware revision history.
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Date | Revision | Contributors | Description | ||||||||
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| Author Name | What changed? | |||||||||
| Martin Rohrmüller | Initial document. | |||||||||
all | Jan Kumann, John Hartfiel |
Table 18: Document change history.
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