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  1. MAX10 FPGA, U5
  2. Programmable low jitter clock generator Si5354A, U2
  3. Status LED (green), D1
  4. 3.3V to 1.8V DCDC converter, U6
  5. Quad SFP+ cage and connectors, J4-J7
  6. 1x6 pin header for JTAG programming of FPGA (3.3V), J3
  7. 1x3 pin header for I²C (1.8V), J1
  8. XTAL 54.0000 MHz (CX3225SB), Y1
  9. Oszillator 25.000000 MHz (SiT8008B), U1
  10. HPC FMC connector, J2
  11. 128KBit EEPROM, U4
  12. Testpoints Max10, TP7-TP9
  13. Testpoints JTAG, TP1-TP4
  14. Testpoints Power, TP5, TP6, TP10

Initial Delivery State

Storage device name

Content

Notes

Max10 FPGA

..

..
Clock generator....
EEPROM....

Table 2: Initial delivery state of programmable devices on the module.

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I/O signals connected to the FPGA I/O bank and B2B connector: 

BankTypeB2B ConnectorI/O Signal CountBank VoltageNotes
3GPI/OsJ220 I/OsVADJSupplied by the carrier board.

Table 3: General overview of I/O signals connected to the B2B connectors.

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MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TD/RD) differential pairs, two signals each or four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, and HPC FMC Pin:

LaneSFP+Signal NameHPC FMC Pin
0J4
  • SFPA_RD_P
  • SFPA_RD_N
  • SFPA_TD_P
  • SFPA_TD_N
  • J2-C6
  • J2-C7
  • J2-C2
  • J2-C3
1J5
  • SFPB_RD_P
  • SFPB_RD_N
  • SFPB_TD_P
  • SFPB_TD_N
  • J2-A2
  • J2-A3
  • J2-A22
  • J2-A23
2J6
  • SFPC_RD_P
  • SFPC_RD_N
  • SFPC_TD_P
  • SFPC_TD_N
  • J2-A6
  • J2-A7
  • J2-A26
  • J2-A27
3J7
  • SFPD_RD_P
  • SFPD_RD_N
  • SFPD_TD_P
  • SFPD_TD_N
  • J2-A10
  • J2-A11
  • J2-A30
  • J2-A31

Table 4: MGT lanes.

Below are listed MGT banks reference clock sources.

Clock signalSourceHPC FMC PinNotes
GBTCLK0_PU2-51J2-D4, GBTCLK0_M2C_POn-board Si5345A.
GBTCLK0_NU2-50J2-D5, GBTCLK0_M2C_NOn-board Si5345A.
GBTCLK1_PU2-31J2-B20, GBTCLK1_M2C_POn-board Si5345A.
GBTCLK1_NU2-30J2-B21, GBTCLK1_M2C_NOn-board Si5345A.

Table 5: MGT reference clock sources.

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JTAG access to the MAX10 FPGA is provided through HPC FMC Connector and an additional pin header connector as well as testpoints.

JTAG Signal

HPC FMC Pin

Pin HeaderTestpoints
TCKJ2-D29J3-4TP2
TDIJ2-D33J3-2TP1
TDOJ2-D30J3-3TP3
TMSJ2-D31J3-1TP4

Table 6: JTAG interface signals.

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On-board I2C devices are connected to the HPC FMC Pin C30 SCL and pin C31 SDA which are reserved for I2C. Level shift and for PLL and SFP+ I²C is done by the FPGA as well as MUX for SFP+. Addresses for on-board devices are listed in the table below:

I2C DeviceI2C AddressNotes
 J4, SFP+  
 J5, SFP+

 J6, SFP+

 J7, SFP+

U2, Si5345A1101001Level shifted via MAX10 FPGA
U4, EEPROM10100xxLast digits determined by carrier board via HPC FMC (C34 GA0, C35 GA1).

Table 7: I2C slave device addresses.

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There is a Silicon Labs I2C programmable clock generator on-board (Si5345A, U2) to generate reference clocks for the module.

Not connected.

Si5345A Pin
Signal Name / Description
Connected ToDirectionNote

IN0

Reference input clock.

-

U1Input25.000000 MHz oscillator, Si8208AI
IN1-Not connected.InputNot used.

IN2

-

Not connected.InputNot used.

IN3

CLK2J2-K4/K5InputHPC FMC configured as C2M clock.

A1

-

GNDInputI2C slave device address LSB.
XAXB-
GND
Y1Input
Not used.
54.0000 MHz XTAL CX3225SB

OUT0

U1, R23

CLKPLL2F

U5-H6/G5Output

FPGA bank

45

2.

OUT1-
U1, P23
Not connected.Output
FPGA bank 45
Not used.
OUT2
U1, V5OutputFPGA MGT bank 225 reference clock
GBTCLK1J2-B20/B21OutputM2C via HPC FMC.
OUT3-
U1, V6
Not connected.Output
FPGA MGT bank 225 reference clock
Not used.
OUT4-
U1, AB5
Not connected.Output
FPGA MGT bank 224 reference clock
Not used.
OUT5-
U1, AB6
Not connected.Output
FPGA MGT bank 224 reference clock
Not used.
OUT6

-

Not connected.

Output

FPGA bank 45
Not used.
OUT7GBTCLK0
U1, pin T25
J2-D4/D5Output
FPGA bank 45
M2C via HPC FMC.
OUT8CLK0
OUT9CLK1
J2-H4/H5OutputM2C via HPC FMC.
OUT9CLK1J2-G2/G3OutputM2C via HPC FMC.

 Table 8: Programmable quad PLL clock generator inputs and outputs.

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The module has following reference clock signals provided by on-board oscillators and external source from carrier board:

Clock SourceSchematic NameFrequencyClock Destination
........
SiTime
SiT8008BI
SiT8008AI oscillator,
U21
U1-25.000000 MHz
Quad PLL clock generator U16, pin 3.
U2-63/64
Carrier board via HPC FMC J2-K4/K5CLK2Defined by carrier.U2-61/62

Table 9: Reference clock signals.

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A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I2C bus with slave device address 0x53.

On-board LEDs

LED ColorConnected toDescription and Notes
D1Green
 
 U5-C2 (bank 1A)  Status LED: ...

Table 10: On-board LEDs.

Power and Power-On Sequence

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The maximum power consumption of a module mainly depends on the design running on the FPGA.Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

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Typical Current


3P3VTBD*
VADJ (at 1.8V)TBD*

3P3VAUX

TBD*

Table 11: Typical power consumption.

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Figure 3: Module power distribution diagram.

Power Rails

Power Rail Name

HPC FMC Connector (J2)

Direction

Notes
3P3VD36, D38, D40, C39InputSupply voltage from carrier board.
1.8V-OutputModule on-board 1.8V voltage supply (Max 1A).
3P3VAUXD32InputSupply voltage from carrier board.

VADJ

H40, G39, F40, E39InputSupply voltage from carrier board.
12VC35, C37InputNot used supply voltage from carrier board.

Table 12: Module power rails.

Bank Voltages

Bank

Schematic Name

Voltage

Voltage Range

1A3P3V

3.3V

-
1B3P3V3.3V-
21.8V1.8V-
3VADJ
Carriercard
Carrier supplied1.2V - 3.3V
53P3V3.3V-
63P3V3.3V-
83P3V3.3V-

Table 13: Module PL I/O bank voltages.

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Variants Currently In Production

 Module VariantFPGA

Operating Temperature

Temperature Range
 TE0008-0110M08SAU169C8G0°C to +70°CCommercial

Table 14: Module variants.

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

  

V

-

Storage temperature

 

 

°C

-

Table 15: Module absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage    
Operating temperature    

Table 16: Module recommended operating conditions.

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Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
-

01


  

Table 17: Module hardware revision history.

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Date

Revision

Contributors

Description

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd



Author NameWhat changed?

Page info
modified-date
modified-date
dateFormatyyyy-MM-dd



Martin Rohrmüller

Initial document.

 

all

Jan Kumann, John Hartfiel

 

Table 18: Document change history.

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