Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.

...

Page properties
hiddentrue
idComments

Template Revision 272.7

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"

...

Page properties
hiddentrue
idComments

Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.


Scroll pdf ignore

Table of Contents

Table of Contents

Overview

he The Trenz Electronic TEI0006 is an Industrial industrial grade module based on Intel® Cyclone 10 GX. Intel  Intel® Cyclone 10 GX device family delivers higher core, transceiver, and I/O performance than the previous generation of low cost FPGAs.

...

  • Intel® Cyclone 10 GX Industrial [10CX220YF780I5G]
    • Package: FBGA-780-FBGA
    • Speed Grade: 5 (Fastest)
    • Temperature: -40°C ~ to 100°C
    • Package compatible device 10CX150 and 10CX105 as assembly variant on request possible
  • 2x SDRAM DDR3L Memory IC 8Gb, 800MHz 8 Gbit (1 GByte), Half rate: 533 MHz; Quarter rate: max. 800 MHz
  • 2x SPI Flash, 1 Gb
  • 2x Transceiver Full Ethernet 64-QFN 
  • Programmable Oscillator
  • EEPROM Memory, 2Kb
  • 4x User LED 

  • Gbit (128 MByte)
  • 1x Gigabit Ethernet
  • 10-Channel, Any-Frequency, Any-Output Jitter Attenuator/Clock Multiplier
  • Intel® MAX 10 as System Controller (CPLD)
  • 2 Kbit EEPROM Memory
  • 4x User LED 

  • I/O interfaces: 226/94/46 (IOs/DIFF. Pairs/LVDS Pairs)
  • 12 x 12.5Gbps Transceiver
  • Board to Board (B2B) Connection: Plug-on module with 3 x 160-pin Samtec Razor Beam (ST5) connectors

  • 5 V Power Supply:

    5V

  • Others:

    Dimension: 80m x 60m

Block Diagram

Page properties
hiddentrue
idComments

add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


...

Scroll Title
anchorFigure_OV_BD
titleTEI0006 block diagram


Scroll Ignore
draw.io Diagram
borderfalse
viewerToolbartrue
fitWindowfalse
diagramDisplayName
lboxfalse
revision24
diagramNameTEI0006_OV_BD
simpleViewerfalse
width
linksauto
tbstylehidden
lboxdiagramWidthtrue
diagramWidth638
revision13
639



Scroll Only

Image Modified


Main Components

...

Scroll Title
anchorFigure_OV_BD
titleTEI0006 main components


Scroll Ignore

draw.io Diagram
borderfalse
viewerToolbartrue
fitWindowfalse
diagramDisplayName
lboxfalse
revision8
diagramNameTEI0006_OV_MC
simpleViewerfalse
width
linksauto
tbstylehidden
lboxtrue
diagramWidth641revision3


Scroll Only

Image Modified



  1. Intel® MAX 10, U18
  2. DC/DC convertor, U4...11
  3. SDRAM DDR3 Memory, U12 ...13- U13
  4. User LEDs, D1...4
  5. Ethernet TrancieverTransceiver, U2- U14
  6. SPI Flash Memory, U1 - U3
  7. Intel® Cyclone 10 GX, U23
  8. EEPROM, U64
  9. Buffer, U16
  10. 10-Channel Clock Multiplier, U14
  11. CryptoAuthentication Device (optional), U19

Initial Delivery State

Page properties
hiddentrue
idComments

Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

...

Scroll Title
anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Storage device name

Content

Notes

Intel® MAX 10ProgrammedSee CPLD Firmware

Quad SPI Flash

Not Programmed


EEPROMProgrammed

Ethernet MAC

DDR3 SDRAMNot Programmed



Configuration Signals

Page properties
hiddentrue
idComments
  • Overview of Boot Mode, Reset, Enables.

The TEI00006 TEI0006 module can be configured using different modes. Mode selection can be done using MSEL[2:0]. MSEL2 is potentially connected to GND so mode selection can be done using MSEL[1:0] which are connected to Bank 3 of Intel Max 10.

Scroll Title
anchorTable_OV_BP
titleBoot process.

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

MODE Signal State

MSEL2MSEL1MSEL0Boot Mode

MSEL[2:0]

010

AS

x4

/ Fast

011

AS

x1

/ Standard

000PS and FPP / Fast
001PS and FPP / Standard
Scroll Title


By tying the CONF_DONE, NSTATUS, and NCONFIG pins together, the devices initialize and enter user mode at the same time. If any device in the chain detects an error, configuration stops for the entire chain and you must reconfigure all the devices. For example, if the first device in the chain flags an error on the NSTATUS pin, it resets the chain by pulling its NSTATUS pin low.

I/O
Scroll Title
anchoranchorTable_OV_BP_RSTCS
titleReset processConfiguration signals.

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Signal
Signals
B2B
Connected toDescriptionNote

Signals, Interfaces and Pins

Page properties
hiddentrue
idComments

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

NCONFIG1.8VConfiguration triggerFrom U18 (Intel MAX 10) - Bank 3
CONF_DONE1.8VConfiguration done To U18 (Intel MAX 10) - Bank 3
NSTATUS1.8VConfiguration status To U18 (Intel MAX 10) - Bank 3
DCLKU1Configuration clock 

To U1 (Flash Memory)

From U18 (Intel MAX 10) - Bank 3

AS_DATA0...3U1Configuration dataFrom U1 (Flash Memory)



Scroll Title
anchorTable_SIPOV_B2BRST
titleGeneral PL I/O to B2B connectors informationReset process.

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

FPGA

Signal

FPGA Bank
B2B
ConnectorI/O Signal CountVoltage LevelNotesIntel Cyclone 10 GXBank 1CJ324 Single ended (12 Diff pair)0.95V

Bank 1D

J324 Single ended (12 Diff pair)0.95VBank 2AJ21 Single ended1.8VPERSTBank 2JJ246 Single ended (23 Diff pair)1.8VBank 2KJ146 Single ended (23 Diff pair)VCCIO2KBank 2LJ146 Single ended (23 Diff pair)3.0VBank 3A--1.35VVDD_DDRBank 3B--1.35VVDD_DDRIntel Max 10Bank 1AJ28 Single ended3.3VBank 1BJ25 Single ended3.3VBank 2J32 Single ended1.8VIOBank 3--1.8VIOBank 5J24 Single ended3.3VBank 6J22 Single ended3.3VBank 8J225 Single ended3.3V

...

JTAG access to the TExxxx SoM through B2B connector JMX.

...

anchorTable_SIP_JTG
titleJTAG pins connection

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

...

JTAG Signal

...

B2B Connector

...

J2-157

...

MIO Pins

...

hiddentrue
idComments

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

Connected toNote

PERST

J2-99Bank A2


Signals, Interfaces and Pins

Page properties
hiddentrue
idComments

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Scroll Title
anchorTable_SIP_B2B
titleGeneral PL I/O to B2B connectors information

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

FPGAFPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

Intel Cyclone 10 GX

Bank 1C

J3

12 Diff pair

0.95V

GXBL1C_RX0...5 N/P, GXBL1C_TX0...5 N/P

Bank 1D

J3

12 Diff pair

0.95V

GXBL1D_RX0...5 N/P, GXBL1D_TX0...5 N/P

Bank 2A

J2

2 Single ended

1.8V

PERST, CLKUSR

Bank 2J

J2

46 Single ended (23 Diff pair)

VCCIO2J


Bank 2K

J1

46 Single ended (23 Diff pair)

VCCIO2K


Bank 2L

J1

48 Single ended (24 Diff pair)

VADJ up to 3 V


Bank 3A

-

-

1.35V

VDD_DDR

Bank 3B

-

-

1.35V

VDD_DDR

Intel Max 10

Bank 1A

J2

8 Single ended

3.3V


Bank 1B

J2

5 Single ended

3.3V


Bank 2

J3

1 Single ended

1.8VIO


Bank 3

-

-

1.8VIO


Bank 5

J2

3 Single ended

3.3V


Bank 6

J2

2 Single ended

3.3V


Bank 8

J2

23 Single ended

3.3V




JTAG Interface

JTAG access to the TEI0006 SoM is through B2B connector J2. JTAGEN is pulled up to 3.3V and after power on, JTAG for MAX 10 CPLD is enabled. JTAG port of Cyclon 10 GX device is routed to MAX10 CPLD IOs. The default Firmware connects the JTAG port of the Cyclon 10 GX to the IO pins of the JTAG port in user IO mode. Setting JTAGEN to GND enables JTAG for the Cyclon 10 GX device.

Scroll Title
anchorTable_SIP_JTG
titleJTAG pins connection

scroll-

...

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

...

anchorTable_OBP_MIOs
titleMIOs pins

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

...

Page properties
hiddentrue
idComments

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
Page properties
hiddentrue
idComments

Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

Scroll Title
anchorTable_OBP
titleOn board peripherals

scroll-tablelayout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Chip/InterfaceDesignatorNotes

SDRAM DDR3 Memory, U12...13

U12...13EEPROMU64SPI Flash MemoryU1- U3Ethernet TrancieverU2- U14Intel® Max 10U18

User LEDs

D1...4D1 (Red), D2...4 (Green)

...

JTAG Signal

B2B Connector

Note
TMSJ2-160
TDIJ2-159
TDOJ2-158
TCK

J2-157


JTAGENJ2-105Pulled up to 3.3V.


MIO Pins

Page properties
hiddentrue
idComments

Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

...

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



U?? Pin
Scroll Title
anchorTable_OBP_SPIMIOs
titleQuad SPI interface MIOs and pins

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

MIO Pin
Schematic
Connected toB2BNotes