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Template Revision 272.7

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"

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Table of Contents

Table of Contents

Overview

he The Trenz Electronic TEI0006 is an Industrial industrial grade module based on Intel® Cyclone 10 GX. Intel  Intel® Cyclone 10 GX device family delivers higher core, transceiver, and I/O performance than the previous generation of low cost FPGAs.

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  • Intel® Cyclone 10 GX Industrial [10CX220YF780I5G]
    • Package: FBGA-780-FBGA
    • Speed Grade: 5 (Fastest)
    • Temperature: -40°C ~ 100°Cto 100°C
    • Package compatible device 10CX150 and 10CX105 as assembly variant on request possible
  • 2x SDRAM DDR3L Memory IC 8Gb, 800MHz 8 Gbit (1 GByte), Half rate: 533 MHz; Quarter rate: max. 800 MHz
  • 2x SPI Flash, 1 Gb
  • 2x Transceiver Full Ethernet 64-QFN 
  • Programmable Oscillator
  • EEPROM Memory, 2Kb
  • 4x User LED 

  • Gbit (128 MByte)
  • 1x Gigabit Ethernet
  • 10-Channel, Any-Frequency, Any-Output Jitter Attenuator/Clock Multiplier
  • Intel® MAX 10 as System Controller (CPLD)
  • 2 Kbit EEPROM Memory
  • 4x User LED 

  • I/O interfaces: 226/94/46 (IOs/DIFF. Pairs/LVDS Pairs)
  • 12 x 12.5Gbps Transceiver
  • Board to Board (B2B) Connection: Plug-on module with 3 x 160-pin Samtec Razor Beam (ST5) connectors

  • 5 V Power Supply:

    • 5V

  • Others:

    Dimension: 80m x 60m

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTEI0006 block diagram


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Main Components

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titleTEI0006 main components


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  1. Intel® MAX 10, U18
  2. DC/DC convertor, U4...11
  3. SDRAM DDR3 Memory, U12 ...13- U13
  4. User LEDs, D1...4
  5. Ethernet TrancieverTransceiver, U2- U14
  6. SPI Flash Memory, U1 - U3
  7. Intel® Cyclone 10 GX, U23
  8. EEPROM, U64
  9. Buffer, U16
  10. 10-Channel Clock Multiplier, U14
  11. CryptoAuthentication Device (optional), U19

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Intel® MAX 10ProgrammedSee CPLD Firmware

Quad SPI Flash

Not Programmed


EEPROMProgrammed

Ethernet MAC

DDR3 SDRAMNot Programmed



Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

The TEI00006 TEI0006 module can be configured using different modes. Mode selection can be done using MSEL[2:0]. MSEL2 is potentially connected to GND so mode selection can be done using MSEL[1:0] which are connected to Bank 3 of Intel Max 10.

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titleBoot process.

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MODE Signal State

MSEL2MSEL1MSEL0Boot Mode

MSEL[2:0]

010

AS

x4

/ Fast

011

AS

x1

/ Standard

000PS and FPP / Fast
001PS and FPP / Standard


By tying the CONF_DONE, nSTATUSNSTATUS, and nCONFIG NCONFIG pins together, the devices initialize and enter user mode at the same time. If any device in the chain detects an error, configuration stops for the entire chain and you must reconfigure all the devices. For example, if the first device in the chain flags an error on the nSTATUS pinNSTATUS pin, it resets the chain by pulling its nSTATUS NSTATUS pin low.

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titleConfiguration signals.

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SignalsConnected toDescriptionNote
nCONFIGNCONFIG1.8VConfiguration triggerFrom U18 ( Intel MAX 10Intel MAX 10) - Bank 3
CONF_DONE1.8VConfiguration done Configuration done To U18 ( Intel MAX 10Intel MAX 10) - Bank 3
nSTATUSNSTATUS1.8VConfiguration status status To U18 ( Intel MAX 10) Intel MAX 10) - Bank 3
DCLKU1,U3Configuration clock clock 

To U1 (Flash Memory)

From U18 ( Intel MAX 10Intel MAX 10) - Bank 3

AS_DATA0...3U1Configuration dataTo From U1 (Flash Memory)



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titleReset process.

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Signal

B2BConnected toNote

PERST

J2-99Bank A2


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titleGeneral PL I/O to B2B connectors information

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FPGAFPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

Intel Cyclone 10 GX

Bank 1C

J3

24 Single ended (

12 Diff pair

)

0.95V

GXBL1C_RX0...5 N/P, GXBL1C_TX0...5 N/P

Bank 1D

J3

24 Single ended (

12 Diff pair

)

0.95V

GXBL1D_RX0...5 N/P, GXBL1D_TX0...5 N/P

Bank 2A

J2

1

2 Single ended

1.8V

PERST, CLKUSR

Bank 2J

J2

46 Single ended (23 Diff pair)

1.8V

VCCIO2J


Bank 2K

J1

46 Single ended (23 Diff pair)

VCCIO2K


Bank 2L

J1

46

48 Single ended (

23

24 Diff pair)

VADJ up to 3

.0V

V


Bank 3A

-

-

1.35V

VDD_DDR

Bank 3B

-

-

1.35V

VDD_DDR

Intel Max 10

Bank 1A

J2

8 Single ended

3.3V


Bank 1B

J2

5 Single ended

3.3V


Bank 2

J3

2

1 Single ended

1.8VIO


Bank 3

-

-

1.8VIO


Bank 5

J2

4

3 Single ended

3.3V


Bank 6

J2

2 Single ended

3.3V


Bank 8

J2

25

23 Single ended

3.3V




JTAG Interface

JTAG access to the TEI0006 SoM is through B2B connector JM2J2. JTAGEN is pulled up to 3.3V and after power on, JTAG for MAX 10 CPLD is enabled. JTAG port of Cyclon 10 GX device is routed to MAX10 CPLD IOs. The default Firmware connects the JTAG port of the Cyclon 10 GX to the IO pins of the JTAG port in user IO mode. Setting JTAGEN to GND enables JTAG for the Cyclon 10 GX device.

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JTAG Signal

B2B Connector

Note
TMSJ2-160
TDIJ2-159
TDOJ2-158
TCK

J2-157

JTAG_EN

JTAGENJ2-105
Connected
Pulled up to 3.3V.


MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



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MIO PinConnected toB2BNotes
MAX_IO1...20, 22U18 (Intel MAX 10) - Bank 8J2
MAX_IO23..., 25, 26U18 (Intel MAX 10) - Bank 85
J2



On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

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titleOn board peripherals

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Chip/InterfaceDesignatorNotes
SPI

QSPI Flash Memory

U1 - U3U1- AS configuration
EEPROMU64
DDR3 SDRAM
DDR3
MemoryU12
...13
- U13
Ethernet
Tranciever
PHYU2
- U14


Intel Max 10U18System controller

User LEDs

D1...4D1 (Red), D2...4 (Green)
OscillatorsU14, U15, U17, U21

...


QSPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

The TEI0006 is equipped with two Micron SPI flash memory. On-board SPI flash memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency.

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titleQuad SPI interface MIOs and pins

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AS Configuration PinAS Configuration DataAS Configuration Data
DesignatorSchematicConnected toNotes
U1



NCSOCSS Bank (Configuration Bank)Used when you are not configuring using AS
DCKDCLKAS Configuration Clock
AS_DATA0CSS Bank (Configuration Bank)
AS_DATA1CSS Bank (Configuration Bank)
AS Configuration DataAS_DATA2CSS Bank (Configuration Bank)
AS_DATA3CSS Bank (Configuration Bank)
U3QSPI_CSBank 2A
QSPI_CKBank 2A
QSPI_DATA0Bank 2A
QSPI_DATA1Bank 2A
QSPI_DATA2Bank 2A
QSPI_DATA3Bank 2A


...

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titleI2C EEPROM interface MIOs and pins

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Schematic

U64 EEPROM Pin

B2B

U18 Intel Max 10 Pin

Notes
I2C_SCLSCLJ3-135
Connected to
Bank 2
of Intel Max 10
- K2
I2C_SDASDAJ3-137
Connected to
Bank 2
of Intel Max 10
- L2



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titleI2C address for EEPROM

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PinsI2C AddressDesignatorNotes
I2C_SCL, I2C_SDA0x53U64


DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TEI0006 SoM has two 1 Gb GByte volatile DDR3 SDRAM IC for storing provided by Integrated Silicon Solution Inc for storing user application code and data.

  • Part number: IS43TR16512BL
  • Supply voltage: 1.35V35 V
  • Speed800MHz: Half rate: 533 MHz; Quarter rate: max. 800 MHz
  • Temperature:  0 ° C -40 °C to 95 ° C°C

Ethernet PHY

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titleEthernet PHY to Zynq Intel Cyclone 10 GX SoC connections

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Signal NameConnected toB2BSignal Description

PHY1_MDI0_P

PHY1_MDI0_N

-

-

J2-93

J2-91


PHY1_MDI1_P

PHY1_MDI1_N

-

-

J2-87

J2-85


PHY1_MDI2_P

PHY1_MDI2_N

-

-

J2-81

J2-79


PHY1_MDI3_P

PHY1_MDI3_N

-

-

J2-75

J2-73


ETH1_RSTU23, Bank 2A-Connected Pulled-up to DVDDH Voltage.
ETH1_MDCU23, Bank 2A-Connected Pulled-up to DVDDH Voltage.
ETH1_MDIOU23, Bank 2A-Connected Pulled-up to DVDDH Voltage.
ETH1_TXD0...7U23, Bank 2A-8 bit Transfer
ETH1_RXD0...7U23, Bank 2A-Recieve8 bit Receive
ETH1_GTXCKU23, Bank 2A-
ETH1_TXCLKU23, Bank 2A-
ETH1_TXEN-U23, Bank 2A-
ETH1_TXER-U23, Bank 2A-
ETH1_RXCKU23, Bank 2A-Connected to GNGPulled-down to GND.
ETH1_RXDVU23, Bank 2A-Connected to GNGPulled-down to GND.
PHY1_INT--Connected Pulled-up to DVDDH Voltage.
PHY1_LED1U18, Bank 2

-J2

Pulled-69Connected up to DVDDH Voltage.
PHY1_LED2U18, Bank 2-J2Pulled-67Connected to GNGdown to GND.
ETH1_CRSU23, Bank 2A-
ETH1_XTAL_INETH_CLKIN-From U21 (25MHz MEMS Oschillator25 MHz Oscillator)


Intel MAX 10

The TEI0006 is equipped with an Intel MAX 10 device an Intel MAX 10 device which is a single-chip, non-volatile low-cost programmable logic device (PLD) to integrate the optimal set of system components. Intel MAX 10 (U18) is power and configuration controller on TEI0006 SoM. 

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Intel Max 10 BankSignalsConnected to DescriptionNotes
Bank 1AAIN0...7B2B- J2

Bank 1BTCK, TDO, TMS, TDI, JTAGENB2B- J2

Bank 2

PHY1_LED1

PHY1_LED2

U23(Ethernet )PHY, U2U23(

Ethernet )PHY, U2

Ethernet LED

Ethernet LED

Pulled-up to DVDDH.

Pulled-down Tight to GNDTight to DVDDH.

F_TCK, F_TDO, F_TDI, F_TMSU23(Intel Cyclone 10 GX (U23) - Bank CSSIntel Cyclone 10 JTAG signals
I2C_SDA, I2C_SCL

EEPROM, U64(EEPROM)J3 (

B2B), J3 

U14 (Programmable Oscillator), U14

I2C EEPROM signals
PLL_RST

U14 (Programmable Oscillator), U14

Oscillator reset signal
Bank 3nSTATUSNSTATUS, nCONFIGNCONFIG, CONF_DONEU23(Intel Cyclone 10 GX (U23) - Bank CSSIntel Cyclone 10 Configuration signals
DCLK

U23(Intel Cyclone 10 GX (U23) - Bank CSS

U1(SPI Flash), U1

Intel Cyclone 10

Configuration clock from Flash memory


MSEL0...1U23(Intel Cyclone 10 GX (U23) - Bank CSS

Intel Cyclone 10

Configuration mode signals


DEV_CLRN, INIT_DONEU23(Intel Cyclone 10 GX (U23) - Bank 2A

M10_IO0...4U23(Intel Cyclone 10 GX (U23) - Bank 2A

Bank 5

DIS_GROUP1...4N-Channel MOSFET, T1...4 (N- Channel MOSFET)Fast Discharching
MAX_IO23...26B2B, J2 (B2B)Intel MAX 10 GPIO

PG_0.95V, EN_0.95V

PG_1.8VIO, EN_1.8VIO

U7(Voltage Regulator), U7U7(

Voltage Regulator), U6

Power control signals
Bank 6




M10_CLKU21(25MHz Oscillator)25 MHz Oscillator, U21Intel MAX 10 Clock

VADJ_VS0...2, VADJ_EN

PG_1.35V, EN_1.35V

PG_1.8V, EN_1.8V

PG_VTT, EN_VTT

PG_0V9, EN_0V9

U11(Voltage Regulator), U11U8(

Voltage Regulator), U8U5(

Voltage Regulator), U5U9(

Voltage Regulator), U9U4(

Voltage Regulator), U4

Power control signals
PHY1_33LED1...2

B2B, J2 (B2B)

Ethernet LED

LED_FP_1

LED_FP_2...4

D1

D2...4

User LEDs

Red LED

Green LED

Bank 8

M10_nSTATUS, M10_nCONFIG, M10_CONF_DONE

B2B, J2J2(B2B)Intel MAX 10 configuration signals
MAX_IO1...20, 22B2B, J2(B2B)Intel MAX 10 GPIO


LEDs

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DesignatorColorConnected toActive LevelNote
D1RedLED_FP_1Active high
D2GreenLED_FP_2Active high
D3GreenLED_FP_3Active high
D4GreenLED_FP_4Active high


Clock Sources

The TEI0006 has one crystal, three MEMS oscillator oscillators and a programmable clock generator. 

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titleOsillators

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DesignatorDescriptionFrequency
Note
U14
Connected to
U21MEMS Oscillator25MHzU2 Ethernet
U15MEMS Oscillator25MHzIN0 of U14
U17MEMS Oscillator
48MHz
100 MHzU23, BANK2A USRCLK
Y1Crystal Oscillator50MHzcrystal input of U14
U14
Programmable OscillatorVariable-



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SignalsClock TypeIn/ OutConnected toFrequencyNote
IN1

IN0_P

IN1

IN0_N

Differential

In

In

Oscillator, U15

(Oscillator)

GND

25 MHz
IN1..3 

IN3 DifferentialInB2B, J3
(B2B)
Variable

XA

, XB

Differential

Oscillator, Y1

50 MHz

CLK0

XB

Differential

U17 (Oscillator)

GND

48 MHz
OutIntel Cyclone 10 GX (U23)- Bank 2AUserDefault off

CLK1

CLK0

...4

DifferentialOut
J3(B2B)25MHz
B2B, J3UserDefault off
REFCLK_EMIFPDifferentialOutIntel Cyclon 10 GX (U23)-
Bank 3BUserDefault off
Variable
CLK6...7DifferentialOut
U23 (
Intel Cyclon 10 GX (U23)- Bank 1DUser
Variable
Default off
CLK8...9DifferentialOut
U23 (
Intel Cyclon 10 GX (U23)- Bank 1C
Variable

Power and Power-On Sequence

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hiddentrue
idComments

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

UserDefault off


CryptoAuthentication

ATECC608A (U19) is a CryptoAuthentication device connected to the I2C bus. This chip is optional, for further description see datasheet of manufacturer.

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titleI2C Interface of CryptoAuthentication

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Schematic

U19 Pin

B2B

U18 Intel Max 10 Pin

Notes
I2C_SCLSCLJ3-135Bank 2 - K2-
I2C_SDASDAJ3-137Bank 2 - L2-


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 1 A for system startup is recommended.

Power Consumption

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titlePower Consumption

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FPGATypical Current
Intel Cyclone 10 GXTBD*
Intel MAX 10TBD*


* TBD - To Be Determined

Power Distribution Dependencies

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

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* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution

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titlePower SequencyDistribution


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Power-On Sequence

Voltage regulators can be enabled through U18 (Intel MAX 10) - Bank 5 and 6.

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titleModule power rails.Power Sequence


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9
Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

Voltage LevelDirectionNotes
VCCIO2K53, 54--1.8 VInputVADJ140,142--3.0 VOutputVCCIO2J-29,301.8 VInput

3.3V

-149,150-3.3 VOutput1.8_VIO--1391.8 VOutput

Bank Voltages

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titleZynq SoC bank voltages.

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Bank 1D

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Power Rails

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Power Rail Name

B2B Connector

J1 Pin

B2B Connector

J2 Pin

B2B Connector

J3 Pin

Voltage LevelDirectionNotes
VIN145, 147,149, 151, 153, 155, 157, 159--5 VInput
VCCIO2K53, 54--1.2 V, 1.25 V, 1.35 V, 1.5 V or 1.8 VInput
VADJ140,142--adjustable between 1.8 V - 3.0 VOutputVoltages according to EP53A8HQI datasheet but restricted to allowed bank voltage
VCCIO2J-29,30-1.2 V, 1.25 V, 1.35 V, 1.5 V or 1.8 VInput

3.3V

-149,150-3.3 VOutput
1.8_VIO--1391.8 VOutput


Bank Voltages

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FPGAFPGA BankVoltage LevelNotes
Intel Cyclone 10 GXBank 1C0.95 V

Bank 1D

0.95 V
Bank 2A1.8 V1.8VIO
Bank 2J1.2 V, 1.25 V, 1.35 V, 1.5 V or 1.8 VVCCIO2J
Bank 2K1.2 V, 1.25 V, 1.35 V, 1.5 V or 1.8 VVCCIO2K
Bank 2Ladjustable between 1.8 V - 3.0 VVoltages according to EP53A8HQI datasheet
Bank 3A1.35 VVDD_DDR
Bank 3B1.35 VVDD_DDR
Intel Max 10Bank 1A3.3 V
Bank 1B3.3 V
Bank 21.8 V1.8VIO
Bank 31.8 V1.8VIO
Bank 53.3V
Bank 63.3V
Bank 83.3V



Board to Board Connectors

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    6 x 6 SoM LSHM B2B Connectors
    6 x 6 SoM LSHM B2B Connectors

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6 x 8 SoM SS5/ST5 B2B Connectors
6 x 8 SoM SS5/ST5 B2B Connectors

Technical Specifications

Absolute Maximum Ratings

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SymbolsDescriptionMinMaxUnitNote
VINPower supply-0.36.0VDetemined by U10.
VCCIO - 3 V I/OI/O buffers power supply-0.54.10V

Intel Cyclone 10 GX

VCCIO - LVDS I/OI/O buffers power supply-0.52.46V

Intel Cyclone 10 GX

VADJAdjustable voltage-0.54.10V

Intel Cyclone 10 GX

T_STGStorage temperature-4085°C


use "include page" macro and link to the general B2B connector page of the module series,

...

TEI0006 module has three Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.

  • 3x REF-192552-02 (160-pins, 80 pins per row) 
  • ST5 Mates with SS5

Operating Temperature: -55°C ~ 125°C
Current Rating: 1.6 A per ContactNumber of Positions: ??

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Technical Specifications

Absolute Maximum Ratings

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Recommended Operating Conditions

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0.93
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ParameterMinMax
Units
UnitReference Document
VCC
VIN5.05.
87
0
.93
V
See Intel Cyclone 10 GX datasheet.VCCP0.87

VCCIO2.853.15V
See Intel
See Intel Cyclone 10 GX datasheet.
VCCERAM
VADJ
0
2.
87
85
0
3.
93
15V
See Intel Cyclone 10 GX datasheet.VCCPT1.711.89VSee Intel Cyclone 10 GX datasheet.VCCPGM1.711.89VSee Intel Cyclone 10 GX datasheet.VCCIO2.853.15VSee Intel Cyclone 10 GX datasheet.VCCA_PLL1.711.89VSee Intel Cyclone 10 GX datasheet.T_J085°CSee Intel Cyclone 10 GX datasheet.