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  • SoC/FPGA
    • Xilinx UltraScale+ RFSoC (XCZU25DR-1FFVE1156E)
      • Package: E1156
      • Speed: -1 (slowest)
      • Temperature: Extended (0 to +100  °C)
  • RAM/Storage
    • 4x 8Gb DDR4 
    • 2x 512Mb SPI Flash
  • On Board
    • Lattice iCE40 MachXO2  CPLD
    • Programmable Clock Generator
    • 3x Oscillators
  • Interface
    • 2x Samtec ST5 (2x80 pol) Board to Board Connectors
  • Power
    • 5V Input Supply Voltage
  • Dimension
    • 90 x 65 mm

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Scroll Title
anchorFigure_OV_MC
titleTE0835 main components


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  1. Xilinx UltraScale+ MPSoC XCZU25DR, U1
  2. 8Gb DDR4 SDRAM, U2,U3,U5,U9
  3. Voltage Regulators, U4,U6,U7
  4. Programmable Glock Generator, U15
  5. Lattice MachXO2 CPLD, U31
  6. ...
  7. Dual SPI Flash, U24-U25
  8. USB2.0 Transceiver, U11
  9. Pin Header 3x1, J3 (not Soldered)
  10. Gigabit Ethernet Transceiver, U20
  11. EEPROM, U23
  12. B2B Connector, J2
  13. B2B Connector, J1...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Scroll Title
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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

2x SPI Flash

Not Programmed


System Controller CPLDProgrammed
EEPROM?
2x DDR4Not Programmed
Programmable Clock GeneratorProgrammed


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Scroll Title
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titleJTAG pins connection

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JTAG Signal

B2B Connector

TMS
TDI
TDO
TCK


JTAG_EN


MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI


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