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Overview

The Trenz Electronic TE0835 is an extended-grade module based on AMD Zynq UltraScale+ RFSoC. 

The Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure (DOCSIS) into an SoC platform that contains a feature-rich 64-bit quad-core Arm Cortex-A53 Application Processing Unit and dual-core Arm Cortex-R5 Real-Time Processing Unit. It integrates the necessary RF-ADCs and RF-DACs.

The module is equipped with DDR4 SDRAM Memory, SPI Flash Memory, USB2.0, Ethernet Transceiver, and 2x Samtec Razor Beam Board to Board (B2B) Connectors. The System Controller (SC) is provided by Lattice MachXO2. A Jitter Attenuator/Clock Multiplier to ITU-T G.8262.1 standard is onboard for high performance applications.

Refer to http://trenz.org/te0835-info for current online available documentation.

Key Features

  • SoC/FPGA/Module
    • AMD SoC:                  XCZU25DR / XCZU27DR / XCZU28DR / XCZU43DR / XCZU47DR / XCZU48DR

    • Speedgrade:              -1 / -2 / -L1 / -L2 1)
    • Temperature Range:  Industrial / Extended 1)
    • Package:                    FFVE1156 / FSVE1156 2)
  • RAM/Storage

    • DDR4 SDRAM 4x 8 Gbit (64 bit bus width) 3)
    • QSPI Flash 2x 512 Mbit (with XiP support) 3)
    • EEPROM with unique "EUI-48 ™ Node Identity" / MAC address and 192 Byte usable storage
  • On Board

    • 1 Gbit Ethernet Transceiver
    • USB 2.0 ULPI Transceiver
    • Clock Generator / Jitter Cleaner for SoC logic, ADC, DAC and External Periphery on the Baseboard
    • Secure Authentication device

  • Interface
    • 3x Pin Header 2.54 mm for I2C
    • 2x B2B Connector (Samtec ST5) for Trenz 6.5 x 9 SoM socket
      • PS: 32x MIO
      • HD: 16x IOs / 8x DIFF
      • HP: 24x IOs / 12x DIFF
      • MGT:
        • 4x GTR
        • 8x GTY
      • ADC: 8x DIFF
      • DAC: 8x DIFF
  • Power
    • 5 V ... 12 V Input Supply Voltage 
  • Dimension
    • 90 x 65 mm
  • Notes
    1) Available as assembly variant or upon request.
    2) Sockets FFVE1156 and SFVE1156 are Footprint-compatible.
    3)
    Other sizes/devices, which are pin/package-compatible, upon request.

Block Diagram


TE0835 block diagram

Main Components


TE0835 main components
  1. AMD Zync UltraScale+ RFSoC, U1
  2. DDR4 SDRAM, U2, U3, U5, U9
  3. System Controller, U31
  4. QSPI Flash, U24, U25
  5. LEDs, red, user, LED0, LED1, LED2, LED3
  6. LEDs, red, SoC status, D6, D7
  7. LED, green, SoM Power, D1
  8. Clock generator/Jitter cleaner, U15
  9. USB 2.0 ULPI Transceiver, U11
  10. 1 Gbit Ethernet, U20
  11. I2C EEPROM, I2C Secure authentification, U23, U27
  12. Oscillators, U12, U14, U21, U22
  13. Crystal, Y1
  14. B2B Connectors J1, J2
  15. Pin Header 2.54 mm for I2C, J3

Initial Delivery State

Storage device name

Content

Notes

QSPI Flash, U24, U25

Not programmed


EEPROM, U23

Not programmed

Contains write protected Unique Node ID / MAC .

System Controller, U31

ProgrammedVisit TE0835 CPLD Firmware
 / TE0835 CPLD for further information / 
firmware description.

DDR4 SDRAM, U2, U3, U5, U9

Not programmed

Programmable Clock Generator, U15

Not programmed
Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO CNT

Notes

B2BJ1MIO32
B2BJ1JTAG4For SoC and SC, selectable via JTAGEN.
B2BJ1SC IO4

B2B

J1

CLK MGT / GTR reference

2Clock input to Bank 505
B2BJ1MGT / GTR16 (8 DIFF)Bank 505 GTR
B2BJ1

CLK MGT / GTY reference

2Clock input to Bank 128
B2BJ1MGT / GTY16 (8 DIFF)Bank 128

B2B

J1

CLK MGT / GTY reference

2Clock input Bank 129
B2BJ1MGT / GTY16 (8 DIFF)Bank 129
B2BJ1ETH MDI8 (4 DIFF)
B2BJ1USB OTG5
B2BJ1CLK Gen output2
B2BJ2IO24 SE / 12 DIFF
B2BJ2IO16 SE / 8 DIFF
B2BJ2CLK DAC

4 (2 DIFF)


B2BJ2DAC16 (8 DIFF)
B2BJ2CLK ADC8 (4 DIFF)
B2BJ2ADC24 (8 DIFF + Common mode voltage)
B2BJ2CLK Gen input12 (6 DIFF)
B2BJ2CLK Gen output2 (1 DIFF)
B2BJ2CLK SoC input2 (1 DIFF)
Pin HeaderJ312C22.54 mm

B2B

J1ETH PHY LED3


Board Connectors


Test Points

Test Point

REV03

REV02REV01

Top

Bottom

Notes

Signal

- = Test Point not used
Designator and or only net name
TP1
xVoltage Regulator U8 outputV_1V8_IOU7 CLKOUTU7 CLKOUT
TP2
xProgrammable Clock Generator U15 reset inputPLL_RSTN
TP3

x

Voltage Regulator U13 output

V_0V9_MGTY_AVCC

-

3.3V_CPLD

TP4x

DDR Termination Regulator U48 reference voltage output

DDR_VREFA

3.3V_CPLD

CPLD_JTAGEN

TP5
x

B2B J1 / SC U31

JTAG_TDO
TP6
x

B2B J1 / SC U31

JTAG_TDI
TP7
x

B2B J1 / SC U31

JTAG_TCK
TP8
x

B2B J1 / SC U31

JTAG_TMS
TP9
x
GND
TP10


x

SoC U1 Bank 88

IO_L1P_AD15P_88

TP11


x

SoC U1 Bank 88

IO_L4P_AD12P_88

TP12
xB2B J1VIN
TP13
x
GND
TP14
x
GND
TP15
x

I2C SCL

MIO32_I2C1_SCL
Tp16
x

I2C SDA

MIO33_I2C1_SDA
TP17
x
GND
TP18
xLDO Voltage Regulator U38 output
V_2V5_DDRVPPU8 ADC_AVCCU8 ADC_AVCC
TP19
xDDR4 U2 TEN inputDDR4-TENU10 ADC_AVCCAUXU10 ADC_AVCCAUX
TP20x

B2B J1 / SC U31

V_3V3_AO

3.3V_CPLD

-
TP21x

B2B J1 / SC U31

CPLD_JTAGEN

GND

-
TP22x

B2B J1

VIN--
TP23
x

Voltage Regulator U7 output

V_1V2--
TP24x

Voltage Regulator U44 output

V_4V5_BIAS--
TP25
x

RAM reset signal

DDR4-RESET--
TP26

Voltage Regulator U44 output

V_4V5_BIAS--
TP27x

Voltage Regulator U44 output

V_4V5_AO--
TP28
x

Voltage Regulator U44 output

V_4V5_AO--
TP29x

LDO Voltage Regulator U33 output

V_3V3_AO--
TP30
x

LDO Voltage Regulator U33 output

V_3V3_AO--
TP31x

LDO Voltage Regulator U30 output

V_1V8_AO--
TP32
x

LDO Voltage Regulator U30 output

V_1V8_AO--
TP33x
Voltage Regulator U8 outputV_1V8_IO--
TP34x
LDO Voltage Regulator U38 output
V_2V5_DDRVPP--
TP35x
RAM Termination Regulator U48 output
DDR_VTT--
TP36
xRAM Termination Regulator U48 outputDDR_VTT--
TP37x

Voltage Regulator U7 output

V_1V2--
TP38x

Voltage Regulator U10 output

V_3V3_IO--
TP39
x

Voltage Regulator U10 output

V_3V3_IO--
TP40x

Voltage Regulator U13 output

V_0V9_MGTY_AVCC--
TP41x

Voltage Regulator U16 output

V_0V925_DAC_AVCC--
TP42
x

Voltage Regulator U16 output

V_0V925_DAC_AVCC--
TP43x

Voltage Regulator U16 output

V_0V925_DAC_AVCC--
TP44
x

Voltage Regulator U16 output

V_0V925_DAC_AVCC--
TP45x

LDO Voltage Regulator U17 output

V_DAC_AVTT--
TP46
x

LDO Voltage Regulator U17 output

V_DAC_AVTT--
TP47x

Voltage Regulator U18 output

V_1V8_DAC_AVCCAUX--
TP48
x

Voltage Regulator U18 output

V_1V8_DAC_AVCCAUX--
TP49x

Voltage Regulator U18 output

V_1V8_DAC_AVCCAUX--
TP50
x

Voltage Regulator U18 output

V_1V8_DAC_AVCCAUX--
TP51x

Voltage Regulator U35 output

V_0V85--
TP52
x

Voltage Regulator U35 output

V_0V85--
TP53
x

RAM Termination Regulator U48 reference voltage output

DDR_VREFA--
TP54x

Voltage Regulator U7 CLKOUT. No net name.

---
TP55
x

Voltage Regulator U8 CLKOUT. No net name.

---
TP56
x

Voltage Regulator U10 CLKOUT. No net name.

---
TP57x

Voltage Regulator U16 CLKOUT. No net name.

---
TP58x

Voltage Regulator U18 CLKOUT. No net name.

---
TP59x

Voltage Regulator U18 output

V_1V8_DAC--
TP60
x

Voltage Regulator U18 output

V_1V8_DAC--
TP61x

Voltage Regulator U16 output

V_0V925_RF--
TP62
x

Voltage Regulator U16 output

V_0V925_RF--


Test Points Information

On-board Peripherals

Chip/Interface

Designator

Connected To

Notes

Zynq UltraScale+ RFSoC

U1
  • DDR4 SDRAM U2, U3, U5, U9
  • QSPI Flash U24, U25
  • I2C
  • B2B J1, J2


DDR4 RAM

U2, U3, U5, U9
  • Zynq SoC U1

QSPI Flash

U24, U25
  • Zynq SoC U1

System Controller

U31
  • Zynq SoC U1
  • B2B J1

USB 2.0 ULPI Transceiver

U11
  • Zynq SoC U1
  • Oscillator U12
  • B2B J1

Gigabit Ethernet transceiver

U20
  • Zynq SoC U1
  • Oscillator U21
  • B2B J1

EEPROM with EUID/MAC   

U23
  • I2C

Secure authentication

U27
  • I2C

Clock Synthesizer/Jitter Cleaner

U15
  • Zynq SoC U1
  • Oscillator U14
  • I2C
  • B2B J2, J3

Oscillator

U22
  • Zynq SoC U1
33 ⅓ MHz

Oscillator

U12
  • USB 2.0 ULPI Transceiver U11
52 MHz

Oscillator

U14
  • Clock Synthesizer U15
25 MHz

Oscillator

U21
  • Gigabit Ethernet transceiver U20
25 MHz

Crystal

Y1
  • Clock Synthesizer U15
54 MHz
On board peripherals

Configuration and System Control Signals

Signal Name

Connector.Pin

Direction1)

Description

CPLD_JTAGENJ1.30INJTAG. Selects the interface target between the SoC and SC.
RESETNJ1.36IN

SoM reset signal to SC (Active low).

MIO33_I2C1_SDA/SDLJ3.1 / J3.2Signal dependend12C
USB0_VBUSJ1.155INUSB Bus voltage signal.
USB0_CPENJ1.157OUTUSB Bus voltage enable.
SEL_2V5_DAC--Voltage level selection for DAC_AVTT

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidrectional signal.
    • Signal dependend: A Signal can have different functions and directions as part of a Bus.
Controller signal.

Power and Power-On Sequence

Power Rails

Power Rail Name/ Schematic Name

Connector.Pin

Direction1)

Notes

VINJ1.1 / J1.3 / J1.5 / 1.2 / J1.4 / J1.6 / J1.8INSoM supply.
PSBATTJ1.14IN

PS battery-backed RAM and battery-backed real-time clock (RTC) supply voltage.

V_3V3_AOJ1.16OUTSystem Controller supply.
ADC0/../7_VCM

J1.30 / J1.32 / J1.42 / J1.44 / J1.48 / J1.50 / J1.60 / J1.62 / J1.66 / J1.68 / J1.78 / J1.80 / J1.84 / J1.86 / J1.96 / J1.98

OUTADC common mode voltage.

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

Module power rails.

Recommended Power up Sequencing

A good starting point into your own custom carrier board design can be the familiarization with Trenz Electronic's Carrier designs for the TEB0835. The Trenz 4 x 5 SoM Integration Guide and our FAQ - PCB Design hold valuable information.

See also AMD datasheet AMD datasheets and guides for additional information.

Sequence

Net name

Recommended Voltage Range

Pull-up/down

Description

Notes

1VIN5.0 V (± 5 %)-Apply power to the SoM.
2RESETN3.3 V (± 5 %)-1)Release (set low) signal when to begin with the SoM startup.
3CPLD_IO33.3 V (± 5 %)-1)Signals power good, use to enable periphery.

1) Firmware dependent. Refer to TE0835 CPLD Firmware / TE0835 CPLD for further information. 

Baseboard Design Hints

Board to Board Connectors

The module has two 160-pin double-row REF-192552-02 connector on the bottom side. The counterpart REF-192552-01 is placed on the Baseboard.

Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
27220REF-192552-02ST5-80-1.50-L-D-P-TRModule connector5 mmhttp://suddendocs.samtec.com/catalog_english/st5.pdfStandard connector
used on module
27219REF-192552-01SS5-80-3.50-L-D-K-TRBaseboard connector5 mmhttp://suddendocs.samtec.com/catalog_english/ss5.pdfStandard connector
used on board
Connectors.

 With different connectors from the used series other mating heights are possible (according to the Datasheet). The module and base board can be manufactured using other connectors upon request.

Connector SpecificationsValue
Insulator materialLiquid crystal polymer
Stacking height5 mm
Contact materialPhosphor-bronze
PlatingAu or Sn over 50 μ" (1.27 μm) Ni
Current rating1.6 A per pin (2 pins powered)
Operating temperature range-55 °C to +125 °C
RoHS compliantYes
Connector specifications.
Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm, Single-Ended 13.5GHz /  27Gbps
5 mm, Differential 20GHz / 40Gbps
4 mm, Single-Ended 13GHz /  26Gbps
4 mm, Differential 13.5GHz / 27Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ SS5/ST5 B2B connectors is 1.6A per pin (2 pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms sawtooth wave
  • Vibration: 7.56G 'RMS', 2 hours per axis, 3 axes total
Manufacturer Documentation



Technical Specifications

This TRM is generic for all variants.

  • The voltage ranges are generally the same across variants (exceptions are possible, depending on custom requests).
  • The temperature range can differ depending on the assembly version.
  • The combination of a carrier and a SoM might have different requirements.

Variants of modules are described here: Article Number Information. Please contact us for options.

Absolute Maximum Ratings *)

Power Rail Name/ Schematic Name

Description

Min

Max

Unit

VIN

Supply power from carrier.

0

18

V

PSBATT

PS battery-backed RAM and real-time clock (RTC) supply voltage.

-0.5

2.00

V

Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial temperature grade are equipped with components that cover at least the ambient temperature range of 0°C to 75°C.
  • Modules with extended temperature grade are equipped with components that cover at least the ambient temperature range of 0°C to 85°C.
  • Modules with industrial temperature grade are equipped with components that cover at least the ambient temperature range of -40°C to 85°C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC/FPGA design.
  • Cooling solution, active and or passive cooling.
  • Climate or enviromental conditions besides ambient temperature range.
  • Module orientation, neigboring assemblies, neither other heat sources nor the SoC/FPGA as heat source to other components.

Temperature range

This SoM's components are capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to +85 °C.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components.

The Operating temperature range depends also on customer design and cooling solution.

Voltage rails

Parameter

Min

Max

Units

Reference Document

VIN4.755.25

V


PSBATT 1.2001.500 

V

See AMD DS926 datasheet.
Recommended operating conditions.

Physical Dimensions

  • Module size: 90 mm × 65 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

  • PCB thickness: : 2.027mm ±10 %.

All dimensions are shown in millimeters.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0835 overview page*

English page

German page

*)  Module article name encoding table: Zynq Ultrascale+ based modules (MPSoC, RFSoC)

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

The hardware revision number is located on the PCB next to the module identifier, separated by a dash.

Board hardware revision number.


Date

Revision

Changes

Documentation Link

2024-0403

1. Added Legal Notices.
2. Added Power Diagram.
3. Added a DC-DCs synchronization circuit to spread spectrum.
4. Changed the core power supply schematic to 4 phases to increase current and reduce noise.
5. The power supply circuit of the module supports input voltage 5...12V.
6. EOL components are replaced:
6.1. L10, L12, L13, L14, L16 Ferrit beads BKP0603HS121-T replaced with MPZ0603S121HT000.
7. Updated layerstack to enhance power supply circuits and improve signal impedance matching.
8. Added POR_OVERRIDE configuration.
9. U25 (Pin 33) PS_SRST_B signal was removed. POR_OVERRIDE_N connected.
10. Added transistor T2A.
11. C180 is removed from schematic.
12. Networks to power the banks have been renamed.
13. Added Level shifter U19.
14. LEDs renamed: D1 --> LED0; D2 --> LED1; D3 --> LED2; D4 --> LED3 and connected to V_3V3_IO. Resistors R77A, R77B, R77C, R77D (39 R) replaced with R77, R130, R132, R134 (1K) respectively according to new shematic.
15. Added pull-up resistors R157, R158, R159, R161, R162, R163 to synchronise the power supplies.
16. Added resistors R142-R145.
17. U23 connected to V_3V3_IO (was 1.8V).
18. ZU_PWR: L9 removed from shematic.
19. Added resistors R46, R90, R98, R146, R149.
20. Added U44.
21. U33 (ADP7102ACPZ) replaced with MIC5504-3.3YMT.
22. Added two capasitors 4.7uF C355 and C488 on DDR_VTT.
23. Added signal SEL_2V5_DAC to Bank 65HP. Pin AD16.
24. Capasitors C24, C32, C97, C130-136, 150-152, 155, 190,191, C203, C204, C214, C216 are replaced with 100 nF.
25. Y1 CX3225SB54000 is EOL, it is replaced with ECS-540-8-33-JTN-TR
26. Added a VIN voltage sensor R121, R124, R150, R122, R153, C489.
27. Added R154, R155 to implement I2C interface between SC and RFSoC.
28. Clock CLK0A_100MHz renamed to PLL_CLKOUT

29. Changed CPLD LCMXO2-640HC-4SG48C (U31) to LCMXO2-640HC-4SG48I.

 REV03

PCN

2020-0702

1. Added a VRP resistor on bank 65.
2. LDO U33 is changed on ADP7102ACPZ.
3. Signal FPGA IO0 is connected on AE18 pin of FPGA.
4. Signal DBG_LED3 is connected on AD18 pin of FPGA.
5. Signal MIO13_25 connected to J1 pin 33 instead MIO25.
6. Resistor R84 is removed.
7. LED D1 moved on edge of PCB.
8. Added THT testpoints J4 on CPLD_JTAGEN, R76 was removed.
9. Signals B49_XX_X are renamed in B88_XX_X.
10. C241 is changed on 1nF.
11. Length of CLK signals on RFADC and RFDAC are adjusted.
12. Wrong connection on U8 is fixed (PCB).
13. Wrong connection PGOOD1 pin of U7 is fixed.
14. R17 is changed from 35,5K to 33K for VCC_PL_PS correction.

15. APRE_3V3 ranamed to APRE_4V5, voltage of the power rail incrised from 3.3V to 4,58V.
16. Resistor R15 is changed from 13,3K to 9,09K. AN: 24671→25969.
17. Capasitor C27 is changed from 100uF x 4V to 47uF x 6,3V. AN: 28940->24718.

REV02

PCN

2019-0601Initial revision

REV01

Hardware Revision History

Document Change History

DateRevisionContributorDescription

Kilian Jahn

  • Added DDR4 bus width.
2025-06-16


v.77

Kilian Jahn

  • Fixed a link, altered a datum and added a Configuration and Controll signal

2025-06-16

v.74

Kilian Jahn

  • Updated to TRM version 4.3
  • Updated TRM to hardware revision 03
  • Minor error corrections
  • Adepted link "Download PDF version of this document."
  • Block Diagramm: Corrected LED name error and moved signal names above the arrows
2024-08-27

v.61

John Hartfiel

  • Board to Board Connector Section: Bugfix Include Macro

2024-02-19

v.60

Martin Rohrmüller

  • Bugfix Overview Picture
2021-12-21v.58John Hartfiel
  • Bugfix B2B section
  • Replace GTH with GTY
2021-05-28v.55John Hartfiel
  • Style update

  • Bugfix PDF Link
  • Key features update
2020-11-23v.51Pedram Babakhani
  • Update to REV02

--

all

  • --
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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