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Table of Contents

Table of Contents

Overview

The Trenz Electronic TEI0023 is a commercial-grade, low cost and small size module integrated with Intel® MAX 10.  Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Actualize Link

Refer to httpsRefer to http://wiki.trenz-electronic.de/display/PD/TEI0023+Resourcesorg/tei0023-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Intel® MAX 10 Commercial FPGA [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C (Commercial)

    • Package compatible device 10M0210M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 64Mb, 166MHz32 Mbyte (8Mbyte default)

  • USB 2.0 Dual High Speed USB to Multipurpose UART/FIFO IC

  • 64 Mb Quad SPI Flash

  • 4Kb EEPROM Memory

  • 8x User LED 

  • Micro USB2 Receptacle 90

  • (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)
  • 8x User LED's
  • 18 Bit 2 MSPS Analog 18 Bit 2 MSPS Analog to Digital Converter
  • 2x SMA Female Connector

  • I/O interface: 23x GPIO - Arduino MKR compatible

  • Power Supply: 5V

  • Dimension: 86.5mm x 25mm

  • Fully-Differential Programmable-Gain Instrumentation Amplifier

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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titleTExxxx TE0023 main components


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  1. SMA Connector, J5...SMA Connector, J5...6

  2. Amplifier, U12

  3. Series Voltage Reference, U8

  4. Analog to Digital Converter, U6

  5. Voltage Regulator, U4 - U10 - U13 - U16

  6. Switching Voltage Regulator, U11

  7. SDRAM Memory, U2

  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)

  10. Oscillator, U7 - U19

  11. FTDI USB2 USB to JTAG/UART FIFO Adapter, U3

  12. User LEDs, D2...9

  13. FTDI Configuration EEPROM, U9

  14. Configuration/Status LED (Red) , D10

  15. Power-On LED (Green), D1

  16. Push Button, S1...2

  17. Micro USB Connector, J9

  18. 1x14 Pin Header, J2 (Not assembled)

  19. 1x6 Pin Header, J4 (Not assembled)

  20. 1x4 Pin Header, J3 (Not assembled)

  21. 1x14 Pin Header, J1 (Not assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI SPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Not Programmed

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not

Programmed

populated

EEPROM ProgrammedProgrammed

FTDI configuration

SDRAM


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (QSPI flash memory U5) or (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

Reset process must be done FPGA Reconfigration can be triggered by pressing push button S1.

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Signal

Push Button

Pin Header

Note

RESET

S1

J2Connected to nCONFIG


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

I/Os on Pin Headers and Connectors

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FPGA BankConnector DesignatorI/O Signal CountVoltage LevelNotes
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET

...


FPGA I/O Banks

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



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FPGA BankI/O Signal CountConnected toNotes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


112MHz Oscillator, U7CLK12M
41x14 Pin header, J1D2...5
4A2D, U6ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
3Amplifier, U12AMP_A0, AMP_A1, AMP_A2
1A2D, U6ADC_PWR_EN1
1100MHz Oscillator, U19CLK_EN
Bank 322SDRAM, U2RAM_ADDR_CMD
21A2D, U6ADC_PWR_EN1, PDB_AMP
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
1A2D, U6PDB_REF
Bank 8



8User Red LEDs, D2...9LED1...8
6SPI Flash, U5F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-

...

USB Connector

The Micro-USB2 USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232 FT2232H chip. The use of this feature requires that FTDI USB driver is drivers are installed on your host PC.

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PinsConnected toNote
VBUSUSB_VBUS
D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0023 FPGA through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.

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JTAG Signal

Pin Header Connector

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120


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Test PointSignalConnected toNotes
TP1+1.8 VV_Lin, U13   ↔   A2D, U12
TP2VREF_OUTV_Lin, U8   ↔   A2D, U6
TP6+14V_AV_Lin, U10   ↔   Amplifier, U12
TP7-14V_AV_Lin, U10   ↔   Amplifier, U12
TP8+14.5VV_Switch, U11 / D11   ↔   L6 / V_Lin u10
TP9-14.5VV_Switch, U11 / L12   ↔   L7 / V_Lin u10
TP10+5V5_Au16   ↔   V_Lin, U8 / A2D, U12


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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Chip/InterfaceDesignatorNotes
TRM TEI0023
SDRAMU2
FTDI FT2232HU3JTAG/UART/FIFO Adapter
SPI FlashU5
TRM TEI0023

EEPROMU9
OscillatorU712 MHz clock source
TRM TEI0023
ADCU12Analog to Digital Converter
Push ButtonsS1...2
8x User LEDsD2...9Red LEDs


SDRAM

TEI0015 TEI0023 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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SDRAM I/O Signals

Signal Schematic Name

Connected toNotes
Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity features of the FT2232H chip. FTDI FT2232H chip channel A is used in MPPSE mode for JTAG, 6 I/O's of . Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfacesis configured to be used as in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

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FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7User configurable

SPI Flash

On-board serial configuration memory (U5) is provided by Winbond with 64 MBit (8 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 8 via SPI interface.

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titleQuad SPI Flash memory interface

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FPGA bank 8, pin C4

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BDBUS6BDBUS6FPGA bank 6, pin C11User configurable
BDBUS7BDBUS7FPGA bank 3, pin J7User configurable
BCBUS0BCBUS0FPGA bank 5, pin J9User configurable
BCBUS1BCBUS1FPGA bank 3, pin K5User configurable
BCBUS2BCBUS2FPGA bank 3, pin L4User configurable
BCBUS3BCBUS3FPGA bank 3, pin L5User configurable
BCBUS4BCBUS4FPGA bank 3, pin N12User configurable


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populated.

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Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3Chip select
F_CLKFPGA bank 8, pin A3Clock
F_DIFPGA bank 8, pin A2Data in / out
nSTATUS

FPGA bank 8, pin C4

Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed on in the EEPROM U9.

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SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0023-XX-XXA board is equipped with the Analog Devices ADAQ4003BBCZ 18-bit 2MSPS ADC.

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PinsConnected toNotes

IN+

Instrumentation Amplifier U14, VOUT-
IN-Instrumentation Amplifier U14, VOUT+
SDIFPGA, Bank 2, pin M2, ADC_SDI
SDOFPGA, Bank 2, pin M1,  ADC_SDO
SCKFPGA, Bank 2, pin N3,  ADC_SCK
CNVFPGA, Bank 2, pin N2, ADC_CNV


LEDs

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DesignatorColorConnected toActive LevelNote
D2...9RedLED1...8Active HighUser LEDs
D10RedCONF_DONEActive LowConfiguration DONE LED
D1Green3.3V Active HighAfter power on it will be on.


Push Bottuns

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DesignatorConnected toFunctionalityNote
S1RESETGeneral reset
S2USER_BTNUser push buttonConnected to FPGA Bank 8.


Clock Sources

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Clock SourceSchematic NameFrequencyNote
Microchip MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA Bank 2, pin H6.

DDR3 SDRAM


Power and Power-On Sequence

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Programmable Clock Generator

There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??.  The I2C Address is 0x??.

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IN0

...

XAXB

...

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of xx A 1A for system startup is recommended.

Power Consumption

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Power Input PinFPGATypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution
Intel MAX 10 10M08 FPGA SoCTBD*


* TBD - To Be Determined

Actual power consumption depends on the FPGA design and ambient temperature.

Power Distribution Dependencies

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Voltage Monitor Circuit

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Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed. After power on the green LED (D1) will be on.

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Power Rails

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Power Rail Name
B2B

Connector

JM1

J2 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

Direction

Connector

J9 Pin

DirectionNotes
VINJ2-13-Input5 V - Pin Header
3.3VJ2-12-Output
5VJ2-14-Output

USB_VBUS

-J9-1Input5 V - USB Connector
Notes


Bank Voltages

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Bank          

Schematic Name

Voltage

Notes

...

hiddentrue
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...

use "include page" macro and link to the general B2B connector page of the module series,

...

? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)

Bank 1AVCCIO1A3.3V
Bank 1B

VCCIO1B

3.3V
Bank 2VCCIO23.3V
Bank 3VCCIO33.3V
Bank 5VCCIO53.3V
Bank 6VCCIO63.3V


Bank 8VCCIO83.3V

...



Technical Specifications

Absolute Maximum Ratings

V
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SymbolsDescriptionMin
MaxUnitReference Document

VIN 

Supply voltage4.755.25V
CH1-, CH1+Analog input voltage on amplifier U12 pin 1, 10-2020VLTC6373 datasheet

T_STG

Storage Temperature-65+125°C
MaxUnitVVVVVVV


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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Parameter
SymbolsMinMax
Units
UnitReference Document
VSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.

VIN supply voltage (5.0V nominal)

4.755.25V
Analog input voltage on amplifier U12 pin 1 (CH1-), 10 (CH1+)-1010VLTC6373 datasheet

T_OP

0+85°C

10M08SAU169C8G datasheet

°CSee Xilinx ???? datasheet.