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Table of Contents

Table of Contents

Overview

The Trenz Electronic TEI0015 TEI0023 is a commercial-grade, low cost and small size module integrated with Intel® MAX 10.  Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Refer to httpsto http://wiki.trenz-electronic.de/display/PD/TEI0023+Resourcesorg/tei0023-info for the current online version of this manual and other available documentation.

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Notes :

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Intel® MAX 10 FPGA [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C (Commercial)

    • Package compatible device 10M08..10M16 as assembly variant on request possible

  • SDRAM Memory up to 32 Mbyte (8Mbyte default)

  • USB 2.0 Multipurpose UART/FIFO IC (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)
  • 8x User LED's
  • 18 Bit 2 MSPS Analog to Digital Converter
  • 2x SMA Female Connector

  • I/O interface: 23x GPIO - Arduino MKR compatible

  • Power Supply: 5V

  • Dimension: 86.5mm x 25mm

  • Fully-Differential Programmable-Gain Instrumentation Amplifier
  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • ...
  • RAM/Storage
    • ...
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes...

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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titleTExxxx TE0023 main components


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  1. ...
  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module

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  1. SMA Connector, J5...6

  2. Amplifier, U12

  3. Voltage Reference, U8

  4. Analog to Digital Converter, U6

  5. Voltage Regulator, U4 - U10 - U13 - U16

  6. Switching Voltage Regulator, U11

  7. SDRAM Memory, U2

  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)

  10. Oscillator, U7 - U19

  11. FTDI USB to JTAG/FIFO Adapter, U3

  12. User LEDs, D2...9

  13. FTDI Configuration EEPROM, U9

  14. Configuration/Status LED (Red) , D10

  15. Power-On LED (Green), D1

  16. Push Button, S1...2

  17. Micro USB Connector, J9

  18. 1x14 Pin Header, J2 (Not assembled)

  19. 1x6 Pin Header, J4 (Not assembled)

  20. 1x4 Pin Header, J3 (Not assembled)

  21. 1x14 Pin Header, J1 (Not assembled)

Initial Delivery State

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Storage device name

...

Content

...

Notes

...

Quad SPI Flash

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Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

Notes :

Only components like EEPROM, SPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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titleBoot process.Initial delivery state of programmable devices on the module

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MODE Signal State

Boot Mode
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Signal

B2BI/ONote

...

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not populated

EEPROMProgrammed

FTDI configuration


Configuration Signals

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

FPGA Reconfigration can be triggered by pressing push button S1.

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titleBoot process.

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titleGeneral PL I/O to B2B connectors information

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

...

JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection

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JTAG Signal

...

B2B Connector

...

MIO Pins

...

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Example:

Signal

Push Button

Pin Header

Note

RESET

S1

J2Connected to nCONFIG


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

I/Os on Pin Headers and Connectors

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FPGA BankConnector DesignatorI/O Signal CountVoltage LevelNotes
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET


FPGA I/O Banks

...

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

...

anchorTable_SIP_MIOs
titleMIOs pins

...

Signal
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you must fill the table below with group of Test Point MIOs which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point sectionconnected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected to
Test Point
B2BNotes
10PWR_PL_OKJ2-120
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



Signal
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titleTest Points InformationFPGA I/O Banks

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FPGA BankI/O Signal Count
Test Point
Connected toNotes

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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titleOn board peripherals

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Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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titleQuad SPI interface MIOs and pins
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


112MHz Oscillator, U7CLK12M
41x14 Pin header, J1D2...5
4A2D, U6ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
3Amplifier, U12AMP_A0, AMP_A1, AMP_A2
1A2D, U6ADC_PWR_EN1
1100MHz Oscillator, U19CLK_EN
Bank 322SDRAM, U2RAM_ADDR_CMD
1A2D, U6PDB_AMP
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
1A2D, U6PDB_REF
Bank 8



8User Red LEDs, D2...9LED1...8
6SPI Flash, U5F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-USB Connector

The Micro-USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232H chip. The use of this feature requires that FTDI USB drivers are installed on your host PC.

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titleI2C interface MIOs and pins
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MIO PinSchematicU? PinNotes
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titleI2C Address for RTCMicro USB-2 connector pins

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MIO PinI2C AddressDesignatorNotes

...

PinsConnected toNote
VBUSUSB_VBUS
D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0023 FPGA through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.

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titleJTAG pins connection
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titleI2C EEPROM interface MIOs and pins

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JTAG Signal

MIO

Pin Header Connector

SchematicU?? PinNotes
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titleI2C address for EEPROM
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MIO PinI2C AddressDesignatorNotes

LEDs

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



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titleOn-board LEDsTest Points Information

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Designator
Test Point
Color
SignalConnected to
Active Level
Notes
Note

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

...

TP1+1.8 VV_Lin, U13   ↔   A2D, U12
TP2VREF_OUTV_Lin, U8   ↔   A2D, U6
TP6+14V_AV_Lin, U10   ↔   Amplifier, U12
TP7-14V_AV_Lin, U10   ↔   Amplifier, U12
TP8+14.5VV_Switch, U11 / D11   ↔   L6 / V_Lin u10
TP9-14.5VV_Switch, U11 / L12   ↔   L7 / V_Lin u10
TP10+5V5_Au16   ↔   V_Lin, U8 / A2D, U12


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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Chip/InterfaceDesignatorNotes
SDRAMU2
FTDI FT2232HU3JTAG/UART/FIFO Adapter
SPI FlashU5
EEPROMU9
OscillatorU712 MHz clock source
ADCU12Analog to Digital Converter
Push ButtonsS1...2
8x User LEDsD2...9Red LEDs


SDRAM

TEI0023 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface.

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.


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titleSDRAM interface IOs and pins

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SDRAM I/O Signals

Signal Schematic Name

Connected toNotes
Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the features of the FT2232H chip. FTDI FT2232H chip channel A is used in MPPSE mode for JTAG. Channel B is configured to be used as in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

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FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7User configurable
BDBUS6BDBUS6FPGA bank 6, pin C11User configurable
BDBUS7BDBUS7FPGA bank 3, pin J7User configurable
BCBUS0BCBUS0FPGA bank 5, pin J9User configurable
BCBUS1BCBUS1FPGA bank 3, pin K5User configurable
BCBUS2BCBUS2FPGA bank 3, pin L4User configurable
BCBUS3BCBUS3FPGA bank 3, pin L5User configurable
BCBUS4BCBUS4FPGA bank 3, pin N12User configurable


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populated.

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titleQuad SPI Flash memory interface

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Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3Chip select
F_CLKFPGA bank 8, pin A3Clock
F_DIFPGA bank 8, pin A2Data in / out
nSTATUS

FPGA bank 8, pin C4

Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.

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titleI2C EEPROM interface MIOs and pins

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SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0023-XX-XXA board is equipped with the Analog Devices ADAQ4003BBCZ 18-bit 2MSPS ADC.

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titleA2D converter interface and pins

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PinsConnected toNotes

IN+

Instrumentation Amplifier U14, VOUT-
IN-Instrumentation Amplifier U14, VOUT+
SDIFPGA, Bank 2, pin M2, ADC_SDI
SDOFPGA, Bank 2, pin M1,  ADC_SDO
SCKFPGA, Bank 2, pin N3,  ADC_SCK
CNVFPGA, Bank 2, pin N2, ADC_CNV


LEDs

Signal Name
Scroll Title
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titleEthernet PHY to Zynq SoC connectionsOn-board LEDs

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DesignatorColor
U?? Pin 
Connected to
Signal DescriptionNote