Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.

...

Page properties
hiddentrue
idComments

Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.


Scroll pdf ignore

Table of Contents

Table of Contents

...

Page properties
hiddentrue
idComments

Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Intel® MAX 10 Commercial FPGA [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C (Commercial)

    • Package compatible device 10M0210M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 64 Mbyte, 166MHz32 Mbyte (8Mbyte default)

  • USB 2.0 Dual High Speed USB to Multipurpose UART/FIFO IC

  • 64 Mbit Quad SPI Flash - Not on all variants

  • (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
  • 8x User LED 

    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)
  • 8x User LED'sMicro USB2 Receptacle 90
  • 18 Bit 2 MSPS Analog to Digital Converter
  • 2x SMA Female Connector

  • I/O interface: 23x GPIO - Arduino MKR compatible

  • Power Supply: 5V

  • Dimension: 86.5mm x 25mm

  • Fully-Differential Programmable-Gain Instrumentation Amplifier

...

  1. SMA Connector, J5...6

  2. Amplifier, U12

  3. Series Voltage Reference, U8

  4. Analog to Digital Converter, U6

  5. Voltage Regulator, U4 - U10 - U13 - U16

  6. Switching Voltage Regulator, U11

  7. SDRAM Memory, U2

  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)

  10. Oscillator, U7 - U19

  11. FTDI USB2 USB to JTAG/UART FIFO Adapter, U3

  12. User LEDs, D2...9

  13. FTDI Configuration EEPROM, U9

  14. Configuration/Status LED (Red) , D10

  15. Power-On LED (Green), D1

  16. Push Button, S1...2

  17. Micro USB Connector, J9

  18. 1x14 Pin Header, J2 (Not assembled)

  19. 1x6 Pin Header, J4 (Not assembled)

  20. 1x4 Pin Header, J3 (Not assembled)

  21. 1x14 Pin Header, J1 (Not assembled)

...

Page properties
hiddentrue
idComments

Notes :

Only components like EEPROM, QSPI SPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

...

Scroll Title
anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Not Programmed

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not

Programmed

populated

EEPROM ProgrammedProgrammed

FTDI configuration

SDRAM


Configuration Signals

Page properties
hiddentrue
idComments
  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (QSPI flash memory U5) or (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

Reset process must be done FPGA Reconfigration can be triggered by pressing push button S1.

...

Page properties
hiddentrue
idComments

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



Scroll Title
anchorTable_OBP_IOs
titleFPGA I/O Banks

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

FPGA BankI/O Signal CountConnected toNotes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


112MHz Oscillator, U7CLK12M
41x14 Pin header, J1D2...5
4A2D, U6ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
3Amplifier, U12AMP_A0, AMP_A1, AMP_A2
1A2D, U6ADC_PWR_EN1
1100MHz Oscillator, U19CLK_EN
Bank 322SDRAM, U2RAM_ADDR_CMD
1A2D, U6PDB_AMP
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
1A2D, U6PDB_REF
Bank 8



8User Red LEDs, D2...9LED1...8
6SPI Flash, U5F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-

...

USB Connector

The Micro-USB2 USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232 FT2232H chip. The use of this feature requires that FTDI USB driver is drivers are installed on your host PC.

Scroll Title
anchorTable_OBP_USB
titleMicro USB-2 connector pins

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

PinsConnected toNote
VBUSUSB_VBUS
D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0023 FPGA through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.

Scroll Title
anchorTable_SIP_JTG
titleJTAG pins connection

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

JTAG Signal

Pin Header Connector

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


...

Scroll Title
anchorTable_OBP
titleOn board peripherals

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Chip/InterfaceDesignatorNotes
SDRAMU2
FTDI FT2232HU3JTAG/UART/FIFO Adapter
SPI FlashU5
EEPROMU9
OscillatorU712 MHz clock source
ADCU12Analog to Digital Converter
Push ButtonsS1...2
8x User LEDsD2...9Red LEDs


SDRAM

TEI0023 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency..

Page properties
Page properties
hiddentrue
idComments

Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

...

The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity features of the FT2232H chip. FTDI FT2232H chip channel A is used in MPPSE mode for JTAG, 6 I/O's of . Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfacesis configured to be used as in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

Scroll Title
anchorTable_OBP_FTDI
titleFTDI chip interfaces and pins

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7User configurable
BDBUS6BDBUS6FPGA bank 6, pin C11User configurable
BDBUS7BDBUS7FPGA bank 3, pin J7User configurable
BCBUS0BCBUS0FPGA bank 5, pin J9User configurable
BCBUS1BCBUS1FPGA bank 3, pin K5User configurable
BCBUS2BCBUS2FPGA bank 3, pin L4User configurable
BCBUS3BCBUS3FPGA bank 3, pin L5User configurable
BCBUS4BCBUS4FPGA bank 3, pin N12User configurable

SPI Flash

BCBUS3FPGA bank 3, pin L5User configurable
BCBUS4BCBUS4FPGA bank 3, pin N12User configurable


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populatedOn-board serial configuration memory (U5) is provided by Winbond with 64 MBit (8 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 8 via SPI interface.

Scroll Title
anchorTable_OBP_QSPI
titleQuad SPI Flash memory interface

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3Chip select
F_CLKFPGA bank 8, pin A3Clock
F_DIFPGA bank 8, pin A2Data in / out
nSTATUS

FPGA bank 8, pin C4

Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2Data in / out


...

The configuration of FTDI FT2232H chip is pre-programmed on in the EEPROM U9.

Scroll Title
anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0023-XX-XXA board is equipped with the Analog Devices ADAQ4003BBCZ 18-bit 2MSPS ADC.

...

Scroll Title
anchorTable_PWR_PC
titlePower Consumption

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

FPGATypical Current
Intel MAX 10 10M08 FPGA SoCTBD*


* TBD - To Be Determined

Actual power consumption depends on the FPGA design and ambient temperature.

Power Distribution Dependencies

...

Scroll Title
anchorTable_PWR_PR
titleModule power rails.

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue


Power Rail Name

Connector

J2 Pin

Connector

J9 Pin

DirectionNotes
VINJ2-13-Input5 V - Pin Header
3.3VJ2-12-Output
5VJ2-14-Output

USB_VBUS

-J9-1Input5 V - USB Connector

...


Bank Voltages

Scroll Title
anchorTable_PWR_BV
titleIntel MAX 10 SoC bank voltagesMAX10 Bank Voltages.

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

Bank          

Schematic Name

Voltage

Notes
Bank 1AVCCIO1A3.3V
Bank 1B

VCCIO1B

3.3V
Bank 2VCCIO23.3V
Bank 3VCCIO33.3V
Bank 5VCCIO53.3V
Bank 6VCCIO63.3V


Bank 8VCCIO83.3V

...



Technical Specifications

Absolute Maximum Ratings

...

Scroll Title
anchorFigure_RV_HRN
titleBoard hardware revision number.


Scroll Ignore

draw.io Diagram
bordertrue
viewerToolbartrue
fitWindowfalse
diagramNameTEI0023_Revision-number
simpleViewerfalse
width200
diagramWidth642
revision2


Scroll Only


...

Scroll Title
anchorTable_RH_DCH
titleDocument change history.

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
sortByColumn1
sortEnabledfalse
cellHighlightingtrue

DateRevisionContributorDescription

Page info
infoTypeModified date
dateFormatyyyy-MM-dd
typeFlat

Page info
infoTypeCurrent version
prefixv.
typeFlat
showVersionsfalse

Page info
infoTypeModified by
typeFlat
showVersionsfalse

change list
  • corrected link to Download area

2021-02-23

v.41Antti Lukats
  • bugfix change history
2020-08-20v.36Antti Lukats
  • correction: Key features, overview, USB, SDRAM, SPI section
2020-02-04v.33ED, Kilian Jan
  • initial release

--

all

Page info
infoTypeModified users
typeFlat
showVersionsfalse

  • --


Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices