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Table of Contents

Table of Contents

Overview

The Trenz Electronic TEI0023 is a commercial-grade, low cost and small size module integrated with Intel® MAX 10.  Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Refer to httpsto http://wiki.trenz-electronic.de/display/PD/TEI0023+Resourcesorg/tei0023-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • Intel® MAX 10 Commercial FPGA [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C (Commercial)

    • Package compatible device 10M0210M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 64Mb, 166MHz32 Mbyte (8Mbyte default)

  • USB 2.0 Dual High Speed USB to Multipurpose UART/FIFO IC

  • 64 Mb Quad SPI Flash

  • 4Kb EEPROM Memory

  • 8x User LED 

  • Micro USB2 Receptacle 90

  • (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)
  • 8x User LED's
  • 18 Bit 2 MSPS 18 Bit 2 MSPS Analog to Digital Converter
  • 2x SMA Female Connector

  • I/O interface: 23x GPIO - Arduino MKR compatible

  • Power Supply: 5V

  • Dimension: 86.5mm x 25mm

  • Fully-Differential Programmable-Gain Instrumentation Amplifier

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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titleTExxxx TE0023 main components


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  1. SMA Connector, J5...6

  2. Amplifier, U12

  3. Series Voltage Reference, U8

  4. Analog to Digital Converter, U6

  5. Voltage Regulator, U4 - U10 - U13 - U16

  6. Switching Voltage Regulator, U11

  7. SDRAM Memory, U2

  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)

  10. Oscillator, U7 - U19

  11. FTDI USB2 USB to JTAG/UART adapterFIFO Adapter, U3

  12. User LEDs, D2...9

  13. FTDI configuration Configuration EEPROM, U9

  14. Configuration/Status LED (Red) , D10

  15. Power-on On LED (Green), D1

  16. Push buttonButton, S1...2

  17. Micro USB Connector, J9

  18. 1x14 pin headerPin Header, J2 (Not assembled)

  19. 1x6 pin headerPin Header, J4 (Not assembled)

  20. 1x4 Pin Header, J3 (Not assembled)

  21. 1x14 pin headerPin Header, J1 (Not assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI SPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Not Programmed

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not

Programmed

populated

EEPROM ProgrammedProgrammed

FTDI configuration

SDRAM


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (QSPI flash memory U5) or (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

Reset process must be done FPGA Reconfigration can be triggered by pressing push button S1.

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Signal

Push Button

Pin Header

Note

RESET

S1

J2Connected to nCONFIG
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Signal

B2BI/ONote


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

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I/Os on Pin Headers and Connectors

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FPGA Bank
B2B
Connector DesignatorI/O Signal CountVoltage LevelNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET


FPGA I/O Banks

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JTAG Signal

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B2B Connector

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MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



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FPGA BankI/O Signal Count
MIO Pin
Connected to
B2B
Notes

...

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Bank 1A
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Test PointSignalB2BNotes
10PWR_PL_OKJ2-120
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Test PointSignalConnected toNotes

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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Quad SPI Flash Memory

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Notes :

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71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


112MHz Oscillator, U7CLK12M
41x14 Pin header, J1D2...5
4A2D, U6ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
3Amplifier, U12AMP_A0, AMP_A1, AMP_A2
1A2D, U6ADC_PWR_EN1
1100MHz Oscillator, U19CLK_EN
Bank 322SDRAM, U2RAM_ADDR_CMD
1A2D, U6PDB_AMP
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
1A2D, U6PDB_REF
Bank 8



8User Red LEDs, D2...9LED1...8
6SPI Flash, U5F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-USB Connector

The Micro-USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232H chip. The use of this feature requires that FTDI USB drivers are installed on your host PC.

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MIO Pin
Pins
SchematicU?? PinNotes

...

Connected toNote
VBUSUSB_VBUS
D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0023 FPGA through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.

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titleI2C interface MIOs and JTAG pins connection

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MIO

JTAG Signal

Pin Header Connector

Schematic
Note
U? PinNotes
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MIO PinI2C AddressDesignatorNotes

...

TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



U?? Pin
Scroll Title
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titleTest Points Information
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titleI2C EEPROM interface MIOs and pins

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MIO Pin
Test Point
Schematic
SignalConnected toNotes